Arrangement for energy conditioning

Methods for enclosing a thermoplastic package

Method for optimizing routing layers and board space requirements for a ball grid array land pattern

Forming tool for forming a contoured microelectronic spring mold

Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus

Method, system, and apparatus for transfer of dies using a pin plate

Adhesive film

Tailored interconnect module

Method for forming a bond pad interface

Under-bump metallization layers and electroplated solder bumping technology for flip-chip

Method of making a semiconductor device having an opening in a solder mask

Stencil mask design method and under bump metallurgy for C4 solder bump

Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit

Method for processing semiconductor devices in a singulated form

Memory card with raised portion

Peripheral card with hidden test pins

Electronic component-built-in module

Wafer-level chip scale package and method for fabricating and using the same

Chip structure

Semiconductor interconnect having compliant conductive contacts

Reconnectable chip interface and chip package

Semiconductor device having chip size package with improved strength

Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices

Enhanced die-down ball grid array and method for making the same

Multiple die stack apparatus employing T-shaped interposer elements

Electronic package having a folded package substrate

Hybrid integrated circuit

Reconnectable chip interface and chip package

Integrated circuit package with a balanced-part structure

Lead for integrated circuit package

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Dual gauge leadframe

Semiconductor device including a potential drawing portion formed at a corner

Transistor with improved safe operating area

Semiconductor device having a flip-chip construction

Flange for integrated circuit package

Thermoplastic material

Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus

Low temperature bonding of multilayer substrates

Method for shielding integrated circuit devices

Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby

Wafer level bumping process

Manufacturing method for semiconductor device

Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs

Underfill and encapsulation of carrier substrate-mounted flip-chip components

Method of manufacturing a plurality of assemblies

Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument

Packaging method for thin integrated circuits

Process for producing semiconductor device and semiconductor device

Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof

Method of fabrication of stacked semiconductor devices

Method, system, and apparatus for transfer of dies using a die plate having die cavities

Interlayer dielectric and pre-applied die attach adhesive materials

IC module and IC card

Method, system, and apparatus for authenticating devices during assembly

[BONDING PAD STRUCTURE]

Packaging assembly and method of assembling the same

Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board

Substrate-less microelectronic package

Manufacturing method for multichip module

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device

Semiconductor device with improved design freedom of external terminal

Bump electrodes having multiple under ball metallurgy (UBM) layers

Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument

Semiconductor device

Semiconductor device and method for manufacturing the same

Fabrication method for stacked multi-chip package

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same

Semiconductor packages for enhanced number of terminals, speed and power performance

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Die package

Bonding pad for a packaged integrated circuit

Semiconductor package containing an integrated-circuit chip supported by electrical connection leads

Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other

Arrangement comprising a capacitor

Group III nitride based flip-chip integrated circuit and method for fabricating

Method for opening the plastic housing of an electronic module

Method, system, and apparatus for high volume transfer of dies

Activation plate for electroless and immersion plating of integrated circuits

Method and apparatus for low temperature copper to copper bonding

Method and apparatus for low temperature copper to copper bonding

Three-dimensional stacked substrate arrangements

Semiconductor device and manufacturing method thereof

Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages

Manufacturing method of a semiconductor device

Method of manufacturing an enhanced thermal dissipation integrated circuit package

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Micro lead frame package

Semiconductor device and method of manufacturing the device

Thin stacked package and manufacturing method thereof

Imaging system

Methods relating to the reconstruction of semiconductor wafers for wafer-level processing

Method and apparatus for non-conductively interconnecting integrated circuits

Microelectronic package

System and method for controlling integrated circuit die height and planarity

Corrosion-resistant copper bond pad and integrated device

Corrosion-resistant bond pad and integrated device

Semiconductor device

Chip package with grease heat sink

Integrated circuit carrier

Chip scale package and method of fabricating the same

Adhesion enhanced semiconductor die for mold compound packaging

Leadless leadframe package substitute and stack package

Moly mask construction and process

Anodes for electroplating operations, and methods of forming materials over semiconductor substrates

Multilayer wiring board for an electronic device

Transfer assembly for manufacturing electronic devices

High-speed RFID tag assembly using impulse heating

Methods for producing a 3D semiconductor memory device and structure

High-speed RFID tag assembly using impulse heating

System, method, and computer program product for predicting pin placement in an electronic design

Concurrent optimization of 3D-IC with asymmetrical routing layers

Electronic device

Image sensor module and method for forming the same

Integrated assemblies and methods of forming integrated assemblies

Substrate with reservoir for die attach adhesive

Semiconductor package and manufacturing method thereof

Light engine based on silicon photonics TSV interposer

Semiconductor device

Integrated circuit structure incorporating stacked field effect transistors

Power-ground co-reference transceiver structure to deliver ultra-low crosstalk

Vertically stacked wafers and methods of forming same

Devices and methods for testing integrated circuit devices

Chip package structure with adhesive layer

Multi-chip module clips with connector bar

Integrated circuit package with thermally conductive pillar

Electronic device interconnections for high temperature operability

Integrated circuits with thermal isolation and temperature regulation

Integrated fan-out package and method of fabricating the same

Fan-out in ball grid array (BGA) package

Passive hydraulic load leveler for thermal compression bonding

IC package with integrated inductor

Angle referenced lead frame design

Compact optical transceiver by hybrid multichip integration

Semiconductor package with barrier for radio frequency absorber

Chip packaging structure and manufacturing method thereof

Integrated circuit assembly that includes stacked dice

Under die surface mounted electrical elements

Integrated circuit die decoupling system with reduced inductance

Integrated circuit package with embedded passive structures

Integrated circuit with sewn interconnects

Semiconductor packaging identifier

Semiconductor assembly having bridge module for die-to-die interconnection

Integrated circuit packaging system with surface treatment and method of manufacture thereof

Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product

Low resistance power switching device

Integrated circuit package and method of making the same

Interposer with overmolded vias

Integrated circuit package with multi-trench structure on flipped substrate contacting underfill

Integrated circuit device having exposed contact pads and leads supporting the integrated circuit die and method of forming the device

Integrated circuit package with solderless interconnection structure

Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafers

Semiconductor device with die attached heat spreader

Integrated circuit with recess for die attachment

Pre-formed via array for integrated circuit package

Semiconductor device with leadframe configured to facilitate reduced burr formation

Multiple port routing circuitry for flash memory storage systems

Flip chip cavity package

Molded leadframe substrate semiconductor package

Integrated chip package structure using silicon substrate and method of manufacturing the same

Chip package with die and substrate