Multi-channel radiometer imaging system

Inductive device including bond wires

Power amplifier module for wireless communication devices

Information storage apparatus and electronic device in which information storage apparatus is installed

Semiconductor device and a method of manufacturing the same

Internally reinforced bond pads

Offset-bonded, multi-chip semiconductor device

Component

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Semiconductor device manufacturing method and manufacturing apparatus

Thinned die integrated circuit package

Method for fabricating chip package

Lead-free integrated circuit package structure

Multi-chips bumpless assembly package and manufacturing method thereof

Stackable integrated circuit packaging

Temperature sustaining flip chip assembly process

Semiconductor package with a chip on a support plate

Thin package for stacking integrated circuits

Integrated circuit package overlay

Method for making dual gauge leadframe

Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same

Chip and wafer integration process using vertical connections

Capillary with contained inner chamfer

Multi-part capillary

Method of manufacturing circuits

Electroplating method for a semiconductor device

Method and substrate to control flow of underfill

Method for electrical interconnection of angularly disposed conductive patterns

System and method used in attaching die for ball grid arrays

Method for forming MEMS grid array connector

Method of manufacturing semiconductor device and system of manufacturing semiconductor device

Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus

Electronic device and method of manufacturing same

Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification

Circuit layout structure

Semiconductor interconnect having conductive spring contacts

Support structure for low-k dielectrics

Selective deposition of solder ball contacts

Semiconductor package with heat spreader

Stacked chip semiconductor device

Formation of circuitry with modification of feature height

Switching media for chip carrier device

Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)

Circuit interconnect for optoelectronic device

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Chip assembling structure and socket

Parallel design processes for integrated circuits

Multi-chip package type memory system

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

Roughened bonding pad and bonding wire surfaces for low pressure wire bonding

Method for anodic bonding of wafers and device

Integrating passive components on spacer in stacked dies

Semiconductor device and its manufacturing method, and semiconductor device manufacturing system

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Electronics circuit manufacture

Wiring base with wiring extending inside and outside of a mounting region

Bond pad

Bonding structure with buffer layer and method of forming the same

Low coefficient of thermal expansion (CTE) semiconductor packaging materials

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor chip, semiconductor device, circuit board, and electronic instrument

Bump-on-lead flip chip interconnection

Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus

Semiconductor device

Semiconductor device, its manufacturing method, circuit board, and electronic unit

Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)

Customized microelectronic device and method for making customized electrical interconnections

Multi-concentric pad arrangements for integrated circuit pads

Module assembly and method for stacked BGA packages

Semiconductor device

Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same

Encapsulated chip and procedure for its manufacture

Large-area nanoenabled macroelectronic substrates and uses therefor

Low temperature solder chip attach structure and process to produce a high temperature interconnection

Low loop height ball bonding method and apparatus

Flip chip bonding tool tip

Bonding tool with resistance

Methods and apparatus for integrated circuit device power distribution via internal wire bonds

Film adhesives containing maleimide compounds and methods for use thereof

Wire bonding process for copper-metallized integrated circuits

Semiconductor/printed circuit board assembly, and computer system

Techniques for packaging multiple device components

In-line die attaching and curing apparatus for a multi-chip package

Fretting and whisker resistant coating system and method

High-frequency module and communication apparatus

Power amplifier device

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Substrate-based package for integrated circuits

Wafer level chip scale packaging structure and method of fabricating the same

Conductive bumps with insulating sidewalls and method for fabricating

Bond pad for flip chip package

Conductive bumps with non-conductive juxtaposed sidewalls

Flip chip device having supportable bar and mounting structure thereof

Intermediate chip module, semiconductor device, circuit board, and electronic device

Seedless wirebond pad plating

Electric connection terminal and method of manufacturing the same, semiconductor device and method of mounting the same

Mounting structure for semiconductor parts and semiconductor device

Use of palladium in IC manufacturing with conductive polymer bump

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Corrosion-resistant bond pad and integrated device

Circuit device and manufacturing method thereof

Chip package structure and manufacturing method thereof

Semiconductor device with magnetically permeable heat sink

Optimum padset for wire bonding RF technologies with high-Q inductors

Semiconductor chip package and method

Multi-chip module

Wafer level stack structure for system-in-package and method thereof

Electronic device with reduced entrapment of material between die and substrate electrical connections

Methods and apparatus for packaging integrated circuit devices

Integrated circuit carrier apparatus method and system

Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices having conductive complementary structures

Stress-free lead frame

Molded leadless package having a partially exposed lead frame pad

EMI shielded integrated circuit packaging apparatus method and system

Semiconductor component and sensor component for data transmission devices

Semiconductor device and manufacturing method thereof

Chip bonding heater with differential heat transfer

Semiconductor integrated circuit

Compliant interconnect assembly

Integrated circuit device and the manufacturing method thereof

Method of manufacturing a semiconductor device

Test system with interconnect having conductive members and contacts on opposing sides

Semiconductor package using terminals formed on a conductive layer of a circuit board

Inductor formed in an integrated circuit

Transparent small memory card

Semiconductor device having a bond pad and method therefor

Bonding structure with compliant bumps

Semiconductor device and method of manufacturing the same

Method and semiconductor device having copper interconnect for bonding

Using backgrind wafer tape to enable wafer mounting of bumped wafers

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Chip package structure

FBGA arrangement

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit package having a resistant layer for stopping flowed glue

Semiconductor device

Production process for producing semiconductor devices, semiconductor devices produced thereby, and test system for carrying out yield-rate test in production of such semiconductor devices

Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment

Design of an insulated cavity

Apparatus and method for mounting electronic components

Ball mounting method

Apparatus and method for low pressure wirebond

Apparatus for packaging electronic components including a reel entrained with desiccating material

Semiconductor device

Method and system for integrated circuit bonding

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Bond pad scheme for Cu process

Structure and method of making capped chips having vertical interconnects

Process for strengthening semiconductor substrates following thinning

Method for manufacturing ball grid array package

Wafer level transparent packaging

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

System to couple integrated circuit die to substrate

Fabrication method of semiconductor integrated circuit device

Ceramic package sealing structure and ceramic package having said sealing structure

Stacked semiconductor device including improved lead frame arrangement

Magnetic thin film, magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device

Carrier for cleaning sockets for semiconductor components having contact balls

Method of forming an electrical contact

Heat sinkable package

Bonding pad structure

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Electronic circuit device, and method and apparatus for manufacturing the same

Integrated interconnect package

BGA package with component protection on bottom

Multi-surface contact IC packaging structures and assemblies

Semiconductor circuit with multiple contact sizes

Method of manufacturing a semiconductor device having an enhanced electrode pad structure

Semiconductor device and method of manufacturing the same

ASIC-embedded switchable antenna arrays

Multi-chip module

Semiconductor package for memory chips

Antenna-incorporated semiconductor device

Multi-surface IC packaging structures and methods for their manufacture

Flip-chip sub-assembly, methods of making same and device including same

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device, electronic card and pad rearrangement substrate

Method of mounting a circuit component and joint structure therefor

Chip package with die and substrate

System and method for using film deposition techniques to provide an antenna within an integrated circuit package

Semiconductor device and method of fabricating the same

Substrate based ESD network protection for a flip chip

IC package with stacked sheet metal substrate

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Use of a down-bond as a controlled inductor in integrated circuit applications

IC card

IC card

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Chip package with die and substrate

Method for forming solder bump structure

Stacked semiconductor packages

Manufacturing method of ball grid array package

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load

No-flow underfill composition and method

RF circuit electrostatic discharge protection

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Back-face and edge interconnects for lidded package

Semiconductor chip package and method for making the same

Microelectronic component and assembly having leads with offset portions

Method for fabricating a semiconductor package with multi layered leadframe

Chip structure and process for forming the same

Integrated circuit bond pad structures and methods of making

Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device

Semiconductor device and fabrication method for the same

Vertical removal of excess solder from a circuit substrate

Radio frequency unit analog level detector and feedback control system

Robust interlocking via

Method for forming metal contacts on a substrate

Method of forming bumps

System and method for reducing or eliminating semiconductor device wire sweep

Structure and method of making capped chips using sacrificial layer

Method of manufacturing a semiconductor device

Thinned, strengthened semiconductor substrates and packages including same

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device manufacturing method

Electrical interconnection for high-frequency devices

Mold with compensating base

Method for producing semiconductor device and semiconductor device

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Prevention of contamination on bonding pads of wafer during SMT

Semiconductor device and method of enveloping an integrated circuit

Semiconductor component and production method suitable therefor

Integrated circuit with copper interconnect and top level bonding/interconnect layer

Radio card

Integrated circuit package with integral leadframe convector and method therefor

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Integrated circuit packaging system

Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area

Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus

Flexible and elastic dielectric integrated circuit

Membrane 3D IC fabrication

Large bumps for optical flip chips

Large bumps for optical flip chips

Self-locking wire bond structure and method of making the same

Robust interlocking via

Printed circuit board assembly and method

Module integration integrated circuits

Method for low temperature bonding and bonded structure

Deposition of diffusion barrier

Large-area nonenabled macroelectronic substrates and uses therefor

Wirebond structure and method to connect to a microelectronic die

Method for stacking chips within a multichip module package

Optimization of routing layers and board space requirements for a ball grid array package

Forming of the last metallization level of an integrated circuit

Optimization of routing layers and board space requirements for a ball grid array land pattern

Die pillar structures and a method of their formation

Vertically stacked pre-packaged integrated circuit chips

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

High power light emitting diode device

Integrated circuit package

Small memory card

Integrated circuit package with laminated power cell having coplanar electrode

Semiconductor component with electromagnetic shielding device

Structure and method for forming a capacitively coupled chip-to-chip signaling interface

Ball grid array package with patterned stiffener surface and method of assembling the same

Anisotropic conductive film

Semiconductor package

Tin deposition

Inter-chip and intra-chip wireless communications systems

Local multilayered metallization

Method of fabricating a wire bond pad with Ni/Au metallization

Method of manufacturing a semiconductor device including a bump forming process

Method of making circuitized substrate

Process for producing resin-sealed type electronic device

Low cost substrate for an integrated circuit device with bondpads free of plated gold

Pad structure for stress relief

Method of using pre-applied underfill encapsulant

Integrated circuit with dual electrical attachment PAD configuration

Integrated circuit package bond pad having plurality of conductive members

Semiconductor electronic device and method of manufacturing thereof

Quad flat no-lead package structure and manufacturing method thereof

Integrated circuit incorporating flip chip and wire bonding

Semiconductor device and method of fabricating the same

Sealing and protecting integrated circuit bonding pads

Semiconductor device having heat conducting plate

Wafer level package for micro device

Semiconductor component and system having stiffener and circuit decal

Lead frame, semiconductor device, and method for manufacturing semiconductor device

Input/output structure and integrated circuit using the same

Method of forming low wire loops and wire loops formed using the method

Ball grid array rework using a continuous belt furnace

Power supply layout for an integrated circuit

Electrical circuit assembly with micro-socket

Reliable metal bumps on top of I/O pads after removal of test probe marks

Substrate for pre-soldering material and fabrication method thereof

Wafer-level moat structures

Method of mounting wafer on printed wiring substrate

Devices and methods employing high thermal conductivity heat dissipation substrates

Method of manufacturing electronic device and method of manufacturing electro-optical device

Modified chip attach process and apparatus

Method and structure for cooling a dual chip module with one high power chip

Method of producing an electronic component and a panel with a plurality of electronic components

Semiconductor device and method for producing the same