H01L2924/15312 - CPC Classification Index

#1

20230223315

2023-07-13

Methods for establishing thermal joints between heat spreaders or lids and heat sources

#2

20230121381

2023-04-20

Systems and methods for providing an interface on a printed circuit board using pin solder enhancement

#3

20220336399

2022-10-20

Semiconductor device

#4

20220108966

2022-04-07

Semiconductor device

#5

20210313248

2021-10-07

Circuit board with phase change material

#6

20210202343

2021-07-01

Methods for establishing thermal joints between heat spreaders or lids and heat sources

#7

20210183662

2021-06-17

Semiconductor device assembly with pillar array

#8

20210107080

2021-04-15

Systems and methods for providing an interface on a printed circuit board using pin solder enhancement

#9

20200402955

2020-12-24

System-in-package with double-sided molding

#10

20200266166

2020-08-20

Semiconductor device

#11

20200219847

2020-07-09

System-in-package with double-sided molding

#12

20200219785

2020-07-09

Methods for establishing thermal joints between heat spreaders or lids and heat sources

#13

20200168539

2020-05-28

Integrated circuit and electronic circuit comprising the same

#14

20190371697

2019-12-05

Methods for establishing thermal joints between heat spreaders or lids and heat sources

#15

20190341270

2019-11-07

Semiconductor device assembly with pillar array and test ability

#16

20190221509

2019-07-18

Semiconductor device and method of manufacturing the same

#17

20190123009

2019-04-25

Semiconductor device

#18

20190067166

2019-02-28

Semiconductor device and fabrication method thereof

#19

20190045622

2019-02-07

Discrete circuit having cross-talk noise cancellation circuitry and method thereof

#20

20180277396

2018-09-27

Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader

#21

20180269181

2018-09-20

System-in-package with double-sided molding

#22

20180183374

2018-06-28

Semiconductor device

#23

20180076112

2018-03-15

Flexible system integration to improve thermal properties

#24

20180068936

2018-03-08

Semiconductor device and method of manufacturing the same

#25

20180068917

2018-03-08

Lid attach optimization to limit electronic package warpage

#26

20180068916

2018-03-08

Lid attach optimization to limit electronic package warpage

#27

20180061733

2018-03-01

Method of fabricating a chip module with stiffening frame and orthogonal heat spreader

#28

20180061732

2018-03-01

Chip module with stiffening frame and orthogonal heat spreader

#29

20180047590

2018-02-15

Limiting electronic package warpage

#30

20170338127

2017-11-23

Methods for Forming Ceramic Substrates with Via Studs

#31

20170263539

2017-09-14

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

#32

20170170086

2017-06-15

Lid attach optimization to limit electronic package warpage

#33

20170077014

2017-03-16

Power overlay structure and method of making same

#34

20160358836

2016-12-08

Method of fabricating a chip module with stiffening frame and directional heat spreader

#35

20160351471

2016-12-01

Method for manufacturing component built-in substrate

#36

20160351467

2016-12-01

Limiting electronic package warpage with semiconductor chip lid and lid-ring

#37

20160329308

2016-11-10

Wire bond support structure and microelectronic package including wire bonds therefrom

#38

20160307780

2016-10-20

Structure and method to minimize warpage of packaged semiconductor devices

#39

20160286642

2016-09-29

Pin connector structure and method

#40

20160233193

2016-08-11

Multi-die wirebond packages with elongated windows

#41

20160172332

2016-06-16

Memory module in a package

#42

20160133541

2016-05-12

Heat spreader with wiring substrate for reduced thickness

#43

20160118961

2016-04-28

Semiconductor device

#44

20160029484

2016-01-28

Electronic component, manufacturing method for electronic component, electronic apparatus, and moving object

#45

20150325560

2015-11-12

Systems and methods for high-speed, low-profile memory packages and pinout designs

#46

20150311174

2015-10-29

Binding wire and semiconductor package structure using the same

#47

20150311136

2015-10-29

Heat sink having a through-opening

#48

20150303137

2015-10-22

Multi-use substrate for integrated circuit

#49

20150294945

2015-10-15

Apparatus and methods for shielding differential signal pin pairs

#50

20150260932

2015-09-17

Circuit module

#51

20150249044

2015-09-03

Circuit board with phase change material

#52

20150216059

2015-07-30

Wiring board and manufacturing method of the same

#53

20150200174

2015-07-16

Semiconductor device

#54

20150194375

2015-07-09

Power overlay structure and method of making same

#55

20150130079

2015-05-14

Semiconductor element

#56

20150115468

2015-04-30

Semiconductor package having magnetic connection member

#57

20150099331

2015-04-09

Semiconductor device and method of manufacturing

#58

20150091194

2015-04-02

Multi-die wirebond packages with elongated windows

#59

20150054612

2015-02-26

Semiconductor package with air core inductor (ACI) having a metal-density layer unit of fractal geometry

#60

20140367866

2014-12-18

Memory module in a package

#61

20140367847

2014-12-18

Methods for establishing thermal joints between heat spreaders or lids and heat sources

#62

20140264800

2014-09-18

Power overlay structure and method of making same

#63

20140264799

2014-09-18

Power overlay structure and method of making same

#64

20140247572

2014-09-04

Printed circuit board

#65

20140196935

2014-07-17

Ceramic substrate and process for producing same

#66

20140182763

2014-07-03

Polymer matrices for polymer solder hybrid materials

#67

20140002223

2014-01-02

Semiconductor package with air core inductor (ACI) having a metal-density layer unit of fractal geometry

#68

20130309814

2013-11-21

Lid attach process

#69

20130299218

2013-11-14

Multilayer printed wiring board having multilayer core substrate

#70

20130285232

2013-10-31

SEMICONDUCTOR PACKAGE MODULE

#71

20130256895

2013-10-03

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

#72

20130249116

2013-09-26

Microelectronic package

#73

20130223038

2013-08-29

Module substrate and method for manufacturing module substrate

#74

20130206843

2013-08-15

INTEGRATED CIRCUIT PACKAGE

#75

20130206466

2013-08-15

Multilayer printed wiring board

#76

20130127041

2013-05-23

Ball grid array to pin grid array conversion

#77

20130050949

2013-02-28

Circuit module

#78

20130037947

2013-02-14

Semiconductor device and method of manufacturing the same

#79

20130015591

2013-01-17

Memory module in a package

#80

20130015590

2013-01-17

Memory module in a package

#81

20130015586

2013-01-17

De-skewed multi-die packages

#82

20130001794

2013-01-03

In situ-built pin-grid arrays for coreless substrates, and methods of making same

#83

20120329198

2012-12-27

Method for producing an infrared light detector

#84

20120319288

2012-12-20

Semiconductor package

#85

20120304923

2012-12-06

METHOD AND SYSTEM FOR PROCESSING FROZEN ADHESIVE PARTICLES

#86

20120300412

2012-11-29

Memory device and fabricating method thereof

#87

20120186867

2012-07-26

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#88

20120186864

2012-07-26

Wiring board and method for manufacturing the same

#89

20120181078

2012-07-19

Multilayer printed wiring board

#90

20120168835

2012-07-05

Anti-reflection structures for CMOS image sensors

#91

20120133045

2012-05-31

Semiconductor device and method of manufacturing the same

#92

20120120623

2012-05-17

LEAD PIN FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE USING THE SAME

#93

20120088336

2012-04-12

SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

#94

20120083052

2012-04-05

Flexible packaging for chip-on-chip and package-on-package technologies

#95

20120074521

2012-03-29

Laminate stacked capacitor, circuit substrate with laminate stacked capacitor and semiconductor apparatus with laminate stacked capacitor

#96

20120067633

2012-03-22

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#97

20120067628

2012-03-22

Printed wiring board

#98

20120043653

2012-02-23

Lead pin for package substrate, and method for manufacturing package substrate with the same

#99

20120012365

2012-01-19

THERMAL FLEX CONTACT CARRIERS #2

#100

20120009732

2012-01-12

System-in-a-package based flash memory card

#101

20120007226

2012-01-12

System-in-a-package based flash memory card

#102

20120006469

2012-01-12

Method of manufacturing printed wiring board

#103

20120000068

2012-01-05

Printed circuit board manufacturing method

#104

20110304016

2011-12-15

Wiring board, method of manufacturing the same, and semiconductor device

#105

20110303451

2011-12-15

MULTILAYER PRINTED WIRING BOARD

#106

20110299821

2011-12-08

Interconnect structure

#107

20110272805

2011-11-10

Semiconductor package, semiconductor device, and semiconductor module

#108

20110269273

2011-11-03

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#109

20110269272

2011-11-03

Microelectronic packages and methods therefor

#110

20110253428

2011-10-20

Circuit board with notched stiffener frame

#111

20110253306

2011-10-20

Method of manufacturing multi-layer printed circuit board

#112

20110252641

2011-10-20

Method of manufacturing multi-layer printed circuit board

#113

20110247208

2011-10-13

Method of manufacturing a multilayered printed wiring board

#114

20110241161

2011-10-06

Chip package with channel stiffener frame

#115

20110227204

2011-09-22

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

#116

20110222256

2011-09-15

CIRCUIT BOARD WITH ANCHORED UNDERFILL

#117

20110194254

2011-08-11

Polymer matrices for polymer solder hybrid materials

#118

20110192637

2011-08-11

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#119

20110186978

2011-08-04

STACK PACKAGE

#120

20110176286

2011-07-21

LEAD PIN AND WIRING SUBSTRATE WITH LEAD PIN

#121

20110104828

2011-05-05

Method for making microstructures by converting porous silicon into porous metal or ceramics

#122

20110103029

2011-05-05

Lead pin and wiring substrate with lead pin, and method of manufacturing the same

#123

20110102122

2011-05-05

Inductor and electric power supply using it

#124

20110068462

2011-03-24

SEMICONDUCTOR CHIP PACKAGES HAVING REDUCED STRESS

#125

20110049702

2011-03-03

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

#126

20110036626

2011-02-17

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#127

20110032222

2011-02-10

PLASMA DISPLAY APPARATUS AND METHOD FOR PRODUCING PLASMA DISPLAY PANEL

#128

20110024904

2011-02-03

Semiconductor package and package-on-package semiconductor device

#129

20110024164

2011-02-03

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD

#130

20110014827

2011-01-20

Lead pin for package substrate

#131

20110010932

2011-01-20

WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD OF MANUFACTURING WIRING BOARD

#132

20110003472

2011-01-06

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

#133

20100328915

2010-12-30

Printed circuit board

#134

20100327433

2010-12-30

High Density MIM Capacitor Embedded in a Substrate

#135

20100325882

2010-12-30

System And Method For Processor Power Delivery And Thermal Management

#136

20100321914

2010-12-23

Multilayer printed wiring board

#137

20100295168

2010-11-25

SEMICONDUCTOR PACKAGE USING CONDUCTIVE PLUG TO REPLACE SOLDER BALL

#138

20100288525

2010-11-18

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE

#139

20100282502

2010-11-11

MULTILAYER PRINTED WIRING BOARD

#140

20100270679

2010-10-28

Microelectronic packages fabricated at the wafer level and methods therefor

#141

20100264954

2010-10-21

Receive circuit for connectors with variable complex impedance

#142

20100264473

2010-10-21

Anti-reflection structures for CMOS image sensors

#143

20100258956

2010-10-14

Microelectronic packages and methods therefor

#144

20100252317

2010-10-07

CARBON NANOTUBE CONTACT STRUCTURES FOR USE WITH SEMICONDUCTOR DIES AND OTHER ELECTRONIC DEVICES

#145

20100244280

2010-09-30

Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch

#146

20100237462

2010-09-23

Package Level Tuning Techniques for Propagation Channels of High-Speed Signals

#147

20100230825

2010-09-16

Flexible packaging for chip-on-chip and package-on-package technologies

#148

20100226108

2010-09-09

Printed circuit board and method of manufacturing printed circuit board

#149

20100189892

2010-07-29

Method and system for processing frozen adhesive particles

#150

20100187679

2010-07-29

Semiconductor device and method of manufacturing the same

#151

20100187004

2010-07-29

Lead pin for mounting semiconductor and printed wiring board

#152

20100163288

2010-07-01

MULTILAYERED PRINTED CIRCUIT BOARD

#153

20100155920

2010-06-24

Stacked semiconductor package, semiconductor package module and method of manufacturing the stacked semiconductor package

#154

20100140803

2010-06-10

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

#155

20100139970

2010-06-10

Wiring board having lead pin, and lead pin

#156

20100127389

2010-05-27

Power semiconductor module

#157

20100122840

2010-05-20

Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board

#158

20100118502

2010-05-13

Printed circuit board

#159

20100117779

2010-05-13

Inductor and electric power supply using it

#160

20100117219

2010-05-13

Power semiconductor device

#161

20100117216

2010-05-13

Chip package structure

#162

20100101838

2010-04-29

Multilayer printed wiring board

#163

20100096747

2010-04-22

Semiconductor device and method of manufacturing the same

#164

20100090339

2010-04-15

Structures and Methods for Wafer Packages, and Probes

#165

20100084175

2010-04-08

Component built-in wiring substrate and manufacturing method thereof

#166

20100068837

2010-03-18

Methods for forming ceramic substrates with via studs

#167

20100065959

2010-03-18

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE

#168

20100059886

2010-03-11

Carrier structure of SoC with custom interface

#169

20100059865

2010-03-11

Package with power and ground through via

#170

20100052153

2010-03-04

Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same

#171

20100032200

2010-02-11

Package substrate with a conductive connecting pin

#172

20100031503

2010-02-11

Method for manufacturing multilayer printed circuit board

#173

20100018049

2010-01-28

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

#174

20100014261

2010-01-21

Printed circuit board

#175

20100013086

2010-01-21

Power semiconductor device

#176

20100006765

2010-01-14

Electrical connection of a substrate within a vacuum device via electrically conductive epoxy/paste

#177

20100006328

2010-01-14

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#178

20090314537

2009-12-24

Conductive pin attached to package substrate

#179

20090309215

2009-12-17

Semiconductor module and method for fabricating semiconductor module

#180

20090284944

2009-11-19

Split thin film capacitor for multiple voltages

#181

20090283807

2009-11-19

Anti-reflection structures for CMOS image sensors

#182

20090267227

2009-10-29

Plastic ball grid array ruggedization

#183

20090267079

2009-10-29

Externally configurable integrated circuits

#184

20090266588

2009-10-29

Multilayer printed wiring board

#185

20090263939

2009-10-22

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

#186

20090250824

2009-10-08

METHOD AND APPARATUS TO REDUCE PIN VOIDS

#187

20090246916

2009-10-01

Chip Package with Pin Stabilization Layer

#188

20090243053

2009-10-01

Structure for reduction of soft error rates in integrated circuits

#189

20090242245

2009-10-01

Multi-layer wiring board and method of manufacturing the same

#190

20090233047

2009-09-17

Substrate having a functionally gradient coefficient of thermal expansion

#191

20090229861

2009-09-17

Wiring board having solder bump and method for manufacturing the same

#192

20090225525

2009-09-10

Inductor and electric power supply using it

#193

20090224863

2009-09-10

Inductor and electric power supply using it

#194

20090224422

2009-09-10

Methods of fabricating a composite carbon nanotube thermal interface device

#195

20090221108

2009-09-03

Miniature optical element for wireless bonding in an electronic instrument

#196

20090212413

2009-08-27

Ball grid array package layout supporting many voltage splits and flexible split locations

#197

20090201113

2009-08-13

Integrated inductor structure and method of fabrication

#198

20090200665

2009-08-13

Semiconductor device and method of manufacturing the same

#199

20090200659

2009-08-13

Chip package with channel stiffener frame

#200

20090174065

2009-07-09

Semiconductor device and method of manufacturing the same

#201

20090166843

2009-07-02

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

#202

20090166819

2009-07-02

Chipset package structure

#203

20090154131

2009-06-18

Conductive connecting pin and package substrate

#204

20090146321

2009-06-11

Wire bonding personalization and discrete component attachment on wirebond pads

#205

20090135574

2009-05-28

WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD OF MANUFACTURING WIRING BOARD

#206

20090096084

2009-04-16

Semiconductor chip packages having reduced stress

#207

20090095518

2009-04-16

Wiring board and method of manufacturing the same

#208

20090090542

2009-04-09

Multilayer printed wiring board

#209

20090086443

2009-04-02

Interface module

#210

20090079063

2009-03-26

Microelectronic package and method of cooling an interconnect feature in same

#211

20090077796

2009-03-26

Method of manufacturing a printed circuit board having an embedded electronic component

#212

20090070996

2009-03-19

Printed circuit board manufacturing method

#213

20090067137

2009-03-12

High density in-package microelectronic amplifier

#214

20090065243

2009-03-12

Printed wiring board

#215

20090057884

2009-03-05

Multi-Chip Package

#216

20090057877

2009-03-05

Semiconductor device with gel-type thermal interface material

#217

20090056992

2009-03-05

Wiring substrate with lead pin and lead pin

#218

20090053459

2009-02-26

Conductive connecting pins for a package substrate

#219

20090052150

2009-02-26

Wiring board, method of manufacturing the same, and semiconductor device having wiring board

#220

20090051041

2009-02-26

MULTILAYER WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE FOR USE IN IC INSPECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME

#221

20090051024

2009-02-26

Semiconductor package structure

#222

20090046441

2009-02-19

WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND WIRING BOARD ASSEMBLY

#223

20090045524

2009-02-19

Microelectronic package

#224

20090045512

2009-02-19

Carrier substrate and integrated circuit

#225

20090038154

2009-02-12

Method of fabricating a thermal spreader having thermal conduits

#226

20090038153

2009-02-12

Method of fabricating a thermal spreader having thermal conduits

#227

20090034219

2009-02-05

Electronic assemblies without solder having overlapping components

#228

20090032915

2009-02-05

TFCC (TM) and SWCC (TM) thermal flex contact carriers

#229

20090028491

2009-01-29

INTERCONNECT STRUCTURE

#230

20090027866

2009-01-29

Semiconductor die package with internal bypass capacitors

#231

20090026612

2009-01-29

SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

#232

20090017613

2009-01-15

METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DEVICE

#233

20090001555

2009-01-01

Semiconductor device having metal cap divided by slit

#234

20080310117

2008-12-18

Method and structure to improve thermal dissipation from semiconductor devices

#235

20080303135

2008-12-11

Pin grid array package substrate including pins having curved pin heads

#236

20080302559

2008-12-11

Flexible and elastic dielectric integrated circuit

#237

20080298017

2008-12-04

Counterflow microchannel cooler for integrated circuits

#238

20080296752

2008-12-04

Substrate with pin, manufacturing method thereof, and semiconductor product

#239

20080296052

2008-12-04

MULTILAYER PRINTED WIRING BOARD

#240

20080293188

2008-11-27

Reactive solder material

#241

20080290378

2008-11-27

Transistor package with wafer level dielectric isolation

#242

20080284047

2008-11-20

Chip Package with Stiffener Ring

#243

20080283999

2008-11-20

Chip Package with Pin Stabilization Layer

#244

20080283282

2008-11-20

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

#245

20080277148

2008-11-13

Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board

#246

20080272481

2008-11-06

Pin grid array package substrate including slotted pins

#247

20080265398

2008-10-30

SUBSTRATE WITH PIN, WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

#248

20080242001

2008-10-02

Lid attachment mechanism

#249

20080239685

2008-10-02

CAPACITOR BUILT-IN WIRING BOARD

#250

20080230914

2008-09-25

Semiconductor element connected to printed circuit board

#251

20080230893

2008-09-25

Integrated circuit package lid with a wetting film

#252

20080218971

2008-09-11

Method and structure to improve thermal dissipation from semiconductor devices

#253

20080206926

2008-08-28

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

#254

20080204115

2008-08-28

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

#255

20080201944

2008-08-28

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

#256

20080194124

2008-08-14

Socket with high performance electrical connectors

#257

20080185714

2008-08-07

Methods of forming channels on an integrated circuit die and die cooling systems including such channels

#258

20080185713

2008-08-07

Heat dissipating device with preselected designed interface for thermal interface materials

#259

20080185708

2008-08-07

Stackable semiconductor package having metal pin within through hole of package

#260

20080182366

2008-07-31

Hybrid module and method of manufacturing the same

#261

20080174938

2008-07-24

Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same

#262

20080169123

2008-07-17

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

#263

20080169120

2008-07-17

Printed circuit board

#264

20080164584

2008-07-10

Method for reduction of soft error rates in integrated circuits

#265

20080160800

2008-07-03

Pin with shape memory alloy

#266

20080158842

2008-07-03

STRESS AND COLLAPSE RESISTANT INTERCONNECT FOR MOUNTING AN INTEGRATED CIRCUIT PACKAGE TO A SUBSTRATE

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2008-07-03

Printed circuit board

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2008-07-03

Printed circuit board

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2008-07-03

METHODS AND APPARATUS FOR MULTICHIP MODULE PACKAGING

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20080151522

2008-06-26

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

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20080151520

2008-06-26

Multilayer printed circuit board

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20080151519

2008-06-26

Multilayer printed circuit board

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20080151517

2008-06-26

Multilayer printed circuit board

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20080150125

2008-06-26

Thermal management of dies on a secondary side of a package

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20080148563

2008-06-26

Method of manufacturing multi-layer printed circuit board

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20080144298

2008-06-19

Printed circuit board

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20080142255

2008-06-19

Printed circuit board

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20080131997

2008-06-05

Integrated circuit package with chip-side signal connections

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20080124841

2008-05-29

Reduction of damage to thermal interface material due to asymmetrical load

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20080107863

2008-05-08

Multilayered printed wiring board with a multilayered core substrate

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2008-04-24

Flip chip metallization method and devices

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2008-04-24

INTEGRATED CIRCUIT DIE/PACKAGE INTERCONNECT

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20080090333

2008-04-17

Microelectronic packages fabricated at the wafer level and methods therefor

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20080088009

2008-04-17

I/O Architecture for integrated circuit package

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20080073776

2008-03-27

Sintered metallic thermal interface materials for microelectronic cooling assemblies

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20080073740

2008-03-27

Backside-illuminated photodetector

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20080055874

2008-03-06

Lead pin for mounting semiconductor and printed wiring board

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20080055872

2008-03-06

Printed circuit board

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20080053692

2008-03-06

STRIP LINE DEVICE, PRINTED WIRING BOARD MOUNTING MEMBER, CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD OF FORMING SAME

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20080041615

2008-02-21

Multilayered printed circuit board, solder resist composition, and semiconductor device

#291

20080012042

2008-01-17

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

#292

20080009155

2008-01-10

Wiring board with lead pins, and lead pin

#293

20080009087

2008-01-10

Miniature optical element for wireless bonding in an electronic instrument

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20080007890

2008-01-10

Thermally conductive composite and uses for microelectronic packaging

#295

20070291448

2007-12-20

Interposer containing bypass capacitors for reducing voltage noise in an IC device

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20070287005

2007-12-13

Phase change material containing fusible particles as thermally conductive filler

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20070284706

2007-12-13

Interconnections resistant to wicking

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20070272998

2007-11-29

Semiconductor device

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20070269167

2007-11-22

Multi-channel optical receiver module

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20070268677

2007-11-22

SYSTEM AND METHOD FOR PROCESSOR POWER DELIVERY AND THERMAL MANAGEMENT