212622 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Package structure having a laminated release layer and method for fabricating the same
#3902Semiconductor device and process for fabricating the same
#3903Defective die replacement in a die stack
#3904Flexible underfill compositions for enhanced reliability
#3905Thermal interface devices
#3906Wiring board and method of manufacturing the same
#3907Passive electrical devices with a polymer carrier
#3908Wiring board
#3909Method of packaging stacked dies on wafer using flip-chip bonding
#3910Semiconductor devices having hybrid stacking structures and methods of fabricating the same
#3911Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#3912Thin stack packages
#3913Package structure and its fabrication method
#3914Semiconductor device
#3915Recessed semiconductor substrates and associated techniques
#3916Method and materials for warpage thermal and interconnect solutions
#3917LPS solder paste based low cost fine pitch pop interconnect solutions
#3918Electromagnetic interference shield for semiconductor chip packages
#3919Semiconductor package and method of manufacturing the same
#3920Stacked semiconductor chips packaging
#3921Polymer thermal interface material having enhanced thermal conductivity
#3922Flip chip packages
#3923Semiconductor package
#3924Embedded circuit patterning feature selective electroless copper plating
#3925Inductor embedded in a package substrate
#3926Achieving power supply and heat dissipation (cooling) in three-dimensional multilayer package
#3927Molded glass lid for wafer level packaging of opto-electronic assemblies
#3928Semiconductor device and method of manufacturing the same
#3929Semiconductor device package and method of the same
#3930Semiconductor chip and semiconductor package having the same
#3931Metal electromagnetic interference (EMI) shielding coating along an edge of a ceramic substrate
#3932Stacked die integrated circuit
#3933Leadless chip carrier
#3934Semiconductor device and method of fabricating the same
#3935Semiconductor device and manufacturing method thereof
#3936Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
#3937Semiconductor device
#39383D integrated circuit package processing with panel type lid
#3939Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#3940Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication
#3941Via structure for signal equalization
#3942Packages with through-vias having tapered ends
#3943Package with embedded heat dissipation features
#3944Dam for three-dimensional integrated circuit
#3945Packaging mechanisms for dies with different sizes of connectors
#3946Method for manufacturing semiconductor device and semiconductor device
#3947Semiconductor packages and data storage devices including the same
#3948Semiconductor device, adjustment method thereof and data processing system
#3949Memory module and memory system
#3950Circuit module
#3951Mirco-electro-mechanical system module and manufacturing method thereof
#3952Semiconductor device and method of forming microelectromechanical systems (MEMS) package
#3953Printed wiring board
#3954Detachable package structure
#39553-D inductor and transformer
#3956Methods for making semiconductor device with sealing resin
#3957Combined substrate
#3958Solution for reducing poor contact in info packages
#3959Semiconductor package and method
#3960Thermal vias disposed in a substrate proximate to a well thereof
#3961Package-on-package assembly with wire bond vias
#3962Semiconductor device and manufacturing method thereof
#3963Embedded die flip-chip package assembly
#3964Method of forming an inductor with magnetic material
#3965Semiconductor package with sidewall contacting bonding tape
#3966Through-silicon via (TSV)-based devices and associated techniques and configurations
#3967Thermal vias disposed in a substrate without a liner layer
#3968Semiconductor device with thin redistribution layers
#3969Package on package structure and fabrication method thereof
#3970Electronic component having encapsulated wiring board and method for manufacturing the same
#3971Low-stress dual underfill packaging
#3972Underfill composition for encapsulating a bond line
#3973Integrated interposer with embedded active devices
#3974Printed wiring board, method for manufacturing printed wiring board, and package-on-package
#3975Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers
#3976Reflow process and tool
#3977Interposer package-on-package structure
#39783D semiconductor device and structure
#3979Circuit board with phase change material
#3980Adhesive bonding composition and method of use
#3981Forming a carbon nano-tube dispersion
#3982Z-connection for a microelectronic package using electroless plating
#3983Packages and methods for forming the same
#3984Multiple die in a face down package
#3985Embedded die ball grid array package
#3986Packaging devices and methods
#3987Bottom package having routing paths connected to top package and method of manufacturing the same
#3988Method for manufacturing semiconductor device
#3989Chip thermal dissipation structure
#3990Semiconductor package and fabrication method thereof
#3991Integrated circuit package configurations to reduce stiffness
#3992Electronic device
#3993Plane connected embedded substrate capacitor
#3994Embedded multi-terminal capacitor
#3995Semiconductor device having wires connecting connection pads
#3996Thermal performance structure for semiconductor packages and method of forming same
#3997Bottom package with metal post interconnections
#3998Substrate design for semiconductor packages and method of forming same
#3999Substrate design for semiconductor packages and method of forming same
#4000Substrate design for semiconductor packages and method of forming same
#4001Integrated circuit package
#4002Silicon-glass hybrid interposer circuitry
#4003Flow diversion devices
#4004Substrate design for semiconductor packages and method of forming same
#4005Method of manufacturing a semiconductor device
#4006Glasswork component, manufacturing method thereof, and manufacturing method of electronic device
#4007Mounting device and method of manufacturing the same
#4008Circuit board with integrated passive devices
#4009Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#4010Semiconductor device and method of manufacturing the same
#4011Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit
#4012Method of manufacturing a semiconductor device including applying ultrasonic waves to a ball portion of the semiconductor device
#4013Semiconductor device
#4014Substrate with corner cut-outs and semiconductor device assembled therewith
#4015Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
#4016Reliable microstrip routing for electronics components
#4017Fan-out high-density packaging methods and structures
#4018Integrated device comprising via with side barrier layer traversing encapsulation layer
#4019Hybrid thermal interface material for IC packages with integrated heat spreader
#4020Method of manufacturing stacked package
#4021Methods for packaging integrated circuits
#4022Electronic component module and manufacturing method thereof
#4023Printed wiring board
#4024Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
#4025Semiconductor device including independent film layer for embedding and/or spacing semiconductor die
#4026Semiconductor device and connection checking method for semiconductor device
#4027Multiple die face-down stacking for two or more die
#4028Methods of forming ultra thin package structures including low temperature solder and structures formed therby
#4029Lead-free solder ball
#4030Semiconductor device
#4031Microbump and sacrificial pad pattern
#4032Semiconductor device with redistribution layers formed utilizing dummy substrates
#4033Package substrate and semiconductor package including the same
#4034Device and method of manufacturing the same
#4035Transferring heat through an optical layer of integrated circuitry
#4036Semiconductor device and manufacturing method thereof
#4037Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste
#4038Core ball, solder paste, formed-solder, flux-coated core ball and solder joint
#4039Wiring board and manufacturing method of the same
#4040Wiring board and method for manufacturing the same
#4041Multi-dimensional integrated circuit structures and methods of forming the same
#4042Semiconductor device including embedded controller die and method of making same
#4043Structure and formation method of chip package structure
#4044Probing chips during package formation
#4045Leadframe area array packaging technology
#4046Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#4047Methods for forming a semiconductor device package
#4048Microelectronic unit and package with positional reversal
#4049Packages for three-dimensional die stacks
#4050System and method for bonding package lid
#4051Structure and approach to prevent thin wafer crack
#4052Packaging methods for semiconductor devices with encapsulant ring
#4053Configuration context switcher with a latch
#4054Package-on-package devices and methods of manufacturing the same
#4055Semiconductor Package and Methods of Forming Same
#4056Integrated circuit package and methods of forming same
#4057Package on package arrangement and method
#4058System, method, and computer program product for a cavity package-on-package structure
#4059Semiconductor device with through silicon via and alignment mark
#4060Carbon nanotube sheet, semiconductor device, method of manufacturing carbon nanotube sheet, and method of manufacturing semiconductor device
#4061Fine pitch BVA using reconstituted wafer with area array accessible for testing
#4062Semiconductor device and manufacturing method thereof
#4063Interconnect structures for substrate
#4064Method and device for an integrated trench capacitor
#4065Package on packaging structure and methods of making same
#4066Pad structure design in fan-out package
#4067Stackable microelectronic package structures
#4068Semiconductor device and manufacturing method thereof
#4069Semiconductor device
#4070Semiconductor package and fabrication method thereof
#4071Stacked semiconductor package
#4072Stub minimization for multi-die wirebond assemblies with parallel windows
#4073Ball grid array system
#4074Integrated circuit interposer and method of manufacturing the same
#4075Interposer for integrated circuit chip package
#4076Semiconductor device package with warpage control structure
#4077Self-shielded components and methods for making the same
#4078Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same
#4079Semiconductor device
#4080Power overlay structure and method of making same
#40813D chip testing through micro-C4 interface
#4082Package substrates and integrated circuit packages including the same
#4083Coil device and antenna device
#4084Package on package devices and methods of packaging semiconductor dies
#4085Wafer level package structure and method of forming same
#4086Package on package structure and fabrication method thereof
#4087Molding package assembly and molding material
#4088Stackable microelectronic package structures
#4089Package on package bonding structure and method for forming the same
#4090Package with multiple plane I/O structure
#4091Semiconductor device
#4092Metal fuse by topology
#4093Packaging substrate having a through-holed interposer
#4094Lid design for heat dissipation enhancement of die package
#4095Lid for integrated circuit package
#4096Wiring substrate and semiconductor device
#4097Method of fabricating semiconductor package
#4098Stub minimization with terminal grids offset from center of package
#4099Package-on-package modules, electronic systems including the same, and memory cards including the same
#4100Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
#4101Semiconductor packaging structure and process
#4102Backside redistribution layer (RDL) structure
#4103Semiconductor device and method of forming stress relief layer between die and interconnect structure
#4104Methods and apparatus for package with interposers
#4105Wiring substrate and semiconductor device
#4106Semiconductor devices having through-substrate via plugs and semiconductor packages including the same
#4107Semiconductor device and method of wafer thinning involving edge trimming and CMP
#4108Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures
#4109Embedded heat spreader with electrical properties
#4110Semiconductor substrate and fabrication method thereof
#4111Method of fabricating a through-holed interposer
#4112Method of fabricating packaging substrate having a through-holed interposer
#4113Detecting defective connections in stacked memory devices
#4114Detecting defective connections in stacked memory devices
#4115Thermally enhanced wafer level fan-out POP package
#4116Stacked packaged integrated circuit devices, and methods of making same
#4117Manufacturing method of a conductive shield layer in semiconductor device
#4118Low cost hybrid high density package
#4119Molding structure for wafer level package
#4120Die-die stacking structure and method for making the same
#4121Bump structures for semiconductor package
#4122Chip-on-substrate packaging on carrier
#4123Semiconductor device and method of reducing warpage using a silicon to encapsulant ratio
#4124Formation of alpha particle shields in chip packaging
#4125Method of manufacturing semiconductor device and semiconductor device
#4126Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
#4127Molding structure for wafer level package
#4128Method of manufacturing an inductor core for a chip assembly and chip assembly
#4129Light coupling device and methods of forming same
#4130Printed wiring board and method for manufacturing printed wiring board
#4131Packaged semiconductor devices and methods of packaging semiconductor devices
#4132Electronic apparatus and method for fabricating the same
#4133Interposer-chip-arrangement for dense packaging of chips
#4134Packages with thermal management features for reduced thermal crosstalk and methods of forming same
#4135Apparatus And Methods For High-Density Chip Connectivity
#4136Semiconductor mounting device and method for manufacturing semiconductor mounting device
#4137System and method for manufacturing a fabricated carrier
#4138Tunable composite interposer
#4139Voltage droop mitigation in 3D chip system
#4140Package with SoC and integrated memory
#4141Microelectronic structures having laminated or embedded glass routing structures for high density packaging
#4142Optical interconnection module and optical-electrical hybrid board
#4143Multiple die stacking for two or more die
#4144Semiconductor package
#4145Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
#4146Warpage control in package-on-package structures
#4147Method for fabricating EMI shielding package structure
#41483DIC packaging with hot spot thermal management features
#4149Multi-layer substrate for semiconductor packaging
#4150Chip detecting system and detecting method
#4151Method for generating die identification by measuring whether circuit is established in a package structure
#4152Pop structures and methods of forming the same
#4153Independent control of stacked electronic modules
#4154Method for co-designing flip-chip and interposer
#4155Method for flip chip packaging co-design
#4156Interposer capture shift update cell between functional and test data
#4157Packages with molding material forming steps
#4158Mechanisms for forming package structure
#4159Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
#4160Apparatus for dicing interposer assembly
#4161Ball arrangement for integrated circuit package devices
#4162Semiconductor packaging and manufacturing method thereof
#4163Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
#4164Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
#4165Integrated circuit and fabricating method thereof
#4166Ridged integrated heat spreader
#4167Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
#4168Semiconductor package
#4169System, method and computer program product for multi-thread operation involving first memory of a first memory class and second memory of a second memory class
#4170Integrated circuit device including through-silicon via structure and method of manufacturing the same
#4171Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods
#4172Stacked microelectronic devices
#4173Semiconductor device and semiconductor package having a plurality of differential signal balls
#4174Reworkable epoxy resin and curative blend for low thermal expansion applications
#4175Electronic device
#4176Stacked semiconductor package and manufacturing method thereof
#4177Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#4178Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
#4179High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly
#4180Method of fabricating packaging substrate having embedded through-via interposer
#4181Fabrication method of semiconductor package
#4182Packaging methods for semiconductor devices
#4183Package on-Package (PoP) structure including stud bulbs and method
#4184Memory system and assembling method of memory system
#4185Camera module and electronic device
#4186Nanoelectromechanical antifuse and related systems
#4187Defense against counterfeiting using antifuses
#4188Semiconductor device and method of fabricating the same
#4189Configurable routing for packaging applications
#4190Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#4191Semiconductor element
#4192Semiconductor package having magnetic substance and related equipment
#4193Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure
#4194Semiconductor package and manufacturing method thereof
#4195Semiconductor device and semiconductor package
#4196Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation
#4197Semiconductor package and method of fabricating the same
#4198Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#4199Semiconductor integrated circuit, method for fabricating the same, and semiconductor package
#4200Printed circuit board and method of manufacturing the same