Semiconductor package device

Thermal dissipation through seal rings in 3DIC structure

Semiconductor package stack having a heat slug

Printing circuit board with traces in an insulator

Electrical connector

Bonding structure and method

Stack packages having fastening element and halogen-free inter-package connector

Methods of fabricating semiconductor stack packages

Electronic module allowing fine tuning after assembly

Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP

Stacked microelectronic assemblies

Semiconductor package having embedded semiconductor elements

Composite reconstituted wafer structures

Semiconductor device

Microelectronic devices and methods for manufacturing microelectronic devices

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Composite reconstituted wafer structures

Composite reconstituted wafer structures

Packaging process tools and packaging methods for semiconductor devices

Electronic component-embedded module

Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows

Semiconductor device having stacked chips, a re-distribution layer, and penetration electrodes

Semiconductor device including a plurality of semiconductor chips, and a cover member with first and second brims

Semiconductor device and method of forming duplex plated bump-on-lead pad over substrate for finer pitch between adjacent traces

Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages

Semiconductor package structure and fabrication method thereof

Antenna, transmitter device, receiver device, three-dimensional integrated circuit, and contactless communication system

Package for three dimensional integrated circuit

Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant

Low CTE interposer

Photosensitive compositions and applications thereof

Hybrid-integrated photonic chip package with an interposer

Hybrid-integrated photonic chip package with an interposer

Component-embedded substrate

Integrated-circuit module with waveguide transition element

Stackable package by using internal stacking modules

3D packages and methods for forming the same

Multi-solder techniques and configurations for integrated circuit package assembly

Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

Lead frame and semiconductor package manufactured by using the same

Semiconductor package

Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer

Fabrication method of semiconductor package without chip carrier

Chip embedded substrate and method of producing the same

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor device, semiconductor package, and electronic system

Electrical system and core module thereof

Semiconductor package having IC dice and voltage tuners

Materials, structures and methods for microelectronic packaging

Fabrication method of semiconductor package

Apparatus, systems, and methods for providing a hybrid voltage regulator

Semiconductor package

Stiffened semiconductor die package

Printed circuit board including through region and semiconductor package formed by using the same

Two-step interconnect testing of semiconductor dies

Semiconductor packages and methods of fabricating the same

Integrated circuit package assemblies including a glass solder mask layer

Resin-sealed semiconductor device and associated wiring and support structure

Semiconductor packages including a heat spreader and methods of forming the same

Semiconductor package and manufacturing method thereof

Semiconductor device and stacked semiconductor device

Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding

Circuit board and electronic device

Interposer and electronic component package

Method apparatus and material for radio frequency passives and antennas

Decoupling circuit and semiconductor integrated circuit

Impedance controlled packages with metal sheet or 2-layer rdl

Apparatus and method to attach a wireless communication device into a semiconductor package

Embedded die-down package-on-package device

Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components

Electronic component built-in substrate and method of manufacturing the same

Semiconductor packages having TSV and adhesive layer

Enhanced flip-chip die architecture

Semiconductor device, method for manufacturing same, and electronic component

Stacked semiconductor package

Embedded package and method for manufacturing the same

IC package with integrated waveguide launcher

Semiconductor device and method of forming shielding layer over active surface of semiconductor die

Hybrid carbon-metal interconnect structures

Methods for fabricating dual damascene structures in low temperature dielectric materials

Method for forming chip-on-wafer assembly

Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device

Semiconductor chip and semiconductor device

Semiconductor package and fabrication method thereof

Coreless integrated circuit packaging system and method of manufacture thereof

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor device, and semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor package having heat slug and passive device

Semiconductor device

Flexible memory system with a controller and a stack of memory

Method of making package with interposer frame

Method of manufacturing semiconductor device

Package-on-package electronic devices including sealing layers and related methods of forming the same

Semiconductor device

Semiconductor device and semiconductor package

Semiconductor lighting devices and methods

Coupled vias for channel cross-talk reduction

Coreless substrate with passive device pads

Module and method of manufacturing the same

Semiconductor package and printed circuit board

In-package fly-by signaling

Ground-referenced single-ended signaling connected graphics processing unit multi-chip module

Laser die backside film removal for integrated circuit (IC) packaging

Package-on-package structure with reduced height

Three-dimensional semiconductor architecture

Semiconductor package and package on package having the same

Wafer level chip scale packaging intermediate structure apparatus and method

Semiconductor package and fabrication method thereof

Semiconductor device and manufacturing method having copper interconnects with metal film, barrier metal, and metal caps

Package on-package joint structure with molding open bumps

Package-on-package with via on pad connections

Package on-package structures and methods for forming the same

Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer

Packaging devices, methods of manufacture thereof, and packaging methods

Package-on-package structure and method of forming same

Package on-package structure

System-in-package with interposer pitch adapter

Polymer thermal interface material having enhanced thermal conductivity

Semiconductor package structure

Semiconductor package assembly with decoupling capacitor

Package on-package with cavity in interposer

Packages with molding material forming steps

Power overlay structure and method of making same

Power overlay structure and method of making same

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect

Inductor with magnetic material

Semiconductor package including an image sensor and a holder with stoppers

Accumulation-mode field effect transistor with improved current capability

Daisy chain connection for testing continuity in a semiconductor die

3D shielding case and methods for forming the same

Wiring substrate and method of manufacturing the same

Porous alumina templates for electronic packages

Stacked semiconductor packages

Method of manufacturing a semiconductor device having a chip mounted on an interposer

Electronic component and electronic component cooling method

Semiconductor package and electronic system including the same

Package integrity monitor with sacrificial bumps

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Thermal design and electrical routing for multiple stacked packages using through via insert (TVI)

Semiconductor chip with modified regions for dividing the chip

Packaging devices and methods for semiconductor devices

Surface treatment method and apparatus for semiconductor packaging

Wiring substrate for a semiconductor device having differential signal paths

Package-on-package structure and methods for forming the same

Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) product

Bump-on-trace (BOT) structures and methods for forming the same

Package structures and methods for forming the same

Semiconductor module

Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages

Semiconductor device with wiring substrate including conductive pads and testing conductive pads

Suspended inductor microelectronic structures

Three-dimensional integrated circuit (3DIC)

Packaging and function tests for package-on-package and system-in-package structures

Semiconductor package and method of estimating surface temperature of semiconductor device including the same

Multi-die memory device

Printed circuit board

Printed wiring board

Stack-type semiconductor package

Semiconductor apparatus

Package on package structure

Package substrate, method of manufacturing the package substrate and semiconductor package including the package substrate

Copper nanorod-based thermal interface material (TIM)

Printed wiring board

Multi-chip package and method of manufacturing the same

Semiconductor system

Semiconductor packages

Microelectronic package with consolidated chip structures

Enhanced stacked microelectronic assemblies with central contacts

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Packaged semiconductor device

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Semiconductor apparatus having signal and ground terminals arranged on vertically adjacent wiring substrates

Window ball grid array (BGA) semiconductor packages

Integrated heat spreader for multi-chip packages

Semiconductor packages and methods of forming the same

Buried TSVs used for decaps

Integrated antenna on interposer substrate

Semiconductor device including a plurality of magnetic shields

Semiconductor test device and method for fabricating the same

Method and an alignment plate for engaging a stiffener frame and a circuit board

Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding

Semiconductor package and method of forming the same

3D semiconductor device

Stacked type semiconductor device and printed circuit board

Method of fabricating three dimensional integrated circuit

Packaging methods and packaged semiconductor devices

Semiconductor device including electromagnetic absorption and shielding

Semiconductor packages and methods of packaging semiconductor devices

Wiring substrate and method of manufacturing the same

Semiconductor device having a base film and manufacturing method for same

Copper pillar full metal via electrical circuit structure

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device, semiconductor package, and electronic device

Memory system topologies including a buffer device and an integrated circuit memory device

Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure

Stack package and method of manufacturing stack package

Method of making a system-in-package device

3D semiconductor package interposer with die cavity

Wafer leveled chip packaging structure and method thereof

Package-on-package device

Semiconductor device

Semiconductor device including a solder and method of fabricating the same

Semiconductor package with thermal dissipating member and method of manufacturing the same

Low profile zero/low insertion force package top side flex cable connector architecture

Semiconductor devices having through silicon vias and methods of fabricating the same

Magnetic sensor integrated in a chip for detecting magnetic fields perpendicular to the chip and manufacturing process thereof

Methods of processing substrates

Microelectronic package with stacked microelectronic units and method for manufacture thereof

Pre-soldered leadless package

Stacked wafer DDR package

Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package

Integrated circuit package with active interposer

Method of manufacturing semiconductor device capable of enhancing bonding strength between connection terminal and electrode

Semiconductor device

Packaging methods and packaged semiconductor devices

PoP device

Semiconductor devices, methods of manufacture thereof, and semiconductor device packages

Semiconductor package

Organic module EMI shielding structures and methods

Semiconductor device and method of fabricating the same

3D assembly for interposer bow

Method for generation of electrical power within a three-dimensional integrated structure and corresponding link device

Interposer having molded low CTE dielectric

Single layer BGA substrate process

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Semiconductor device and manufacturing method thereof

Methods and arrangements relating to semiconductor packages including multi-memory dies

Method of forming wafer-level molded structure for package assembly

Passively controlled smart microjet cooling array

Stacked die package, system including the same, and method of manufacturing the same

Semiconductor device and power source device

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Microelectronic package and method of manufacture thereof

Semiconductor device

Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects

Semiconductor package and method of manufacturing the same

Integration of laminate MEMS in BBUL coreless package

Stackable microelectronic package structures

Package on package structures and methods for forming the same

Non-cylindrical conducting shapes in multilayer laminated substrate cores

Extended redistribution layers bumped wafer

Method for manufacturing a semiconductor device having multiple heat sinks

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Die package structure

Shields for magnetic memory chip packages

Sensor package

Method of manufacturing semiconductor device

Stacked semiconductor package including connections electrically connecting first and second semiconductor packages

Low void solder joint for multiple reflow applications

Direct metalization of electrical circuit structures

3D integrated circuit package with window interposer

Semiconductor device and method for fabricating the same

Stub minimization using duplicate sets of signal terminals

Packaging substrate, method for manufacturing same, and chip packaging structure having same

Method of manufacturing semiconductor device and semiconductor device

Ultrathin buried die module and method of manufacturing thereof

Semiconductor device

Package on package bonding structure and method for forming the same

Package on package (PoP) bonding structures

Semiconductor device having a liquid cooling module

Ball grid array package with improved thermal characteristics

Semiconductor device with through silicon via and alignment mark

Interposer and packaging substrate having the interposer

Polymer matrices for polymer solder hybrid materials

Cache coherency using die-stacked memory device with logic die

Semiconductor devices having through-vias and methods for fabricating the same

Fabrication method of semiconductor package

Designed asperity contactors, including nanospikes, for semiconductor test using a package, and associated systems and methods

DBF film as a thermal interface material

Thermal matched composite die

Method for reducing underfill filler settling in integrated circuit packages

Package structures including discrete antennas assembled on a device

Absorbing excess under-fill flow with a solder trench

Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements

Semiconductor device and method of manufacturing the same

Semiconductor package

Chip package using interposer substrate with through-silicon vias

Semiconductor device and method of making bumpless flipchip interconnect structures

Landing structure for through-silicon via

Packaged microelectronic elements having blind vias for heat dissipation

Package structure and method for manufacturing same

Methods of forming ultra thin package structures including low temperature solder and structures formed therby

Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form

Semiconductor device and method of simultaneous molding and thermalcompression bonding

Semiconductor chip and semiconductor apparatus with embedded capacitor

Screen control module of a mobile electronic device and controller thereof with multiple dielectric layers

Antenna apparatus and method

Semiconductor integrated circuit device

Semiconductor package having supporting plate and method of forming the same

Microelectronic package with terminals on dielectric mass

Semiconductor device

Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate

Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows

Methods and apparatus for package with interposers