Connection components with anistropic conductive material interconnector

Method for bonding heat sinks to overmold material and resulting structure

Wiring board and a semiconductor device using the same

Placement of sacrificial solder balls underneath the PBGA substrate

Microelectronic devices and methods for packaging microelectronic devices

Microelectronic substrates with integrated devices

Bridge connection type of chip package and fabricating method thereof

Window ball grid array semiconductor package and method for fabricating the same

Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the same

Integral heatsink ball grid array

Semiconductor package

Semiconductor device having heat dissipation layer

Memory expansion and chip scale stacking system and method

Chip on glass package

Receptacle for a programmable, electronic processing device

Method of fabrication of semiconductor integrated circuit device

Method and apparatus for packaging test integrated circuits

Cooling system for a semiconductor device and method of fabricating same

Method of manufacturing semiconductor device

Image sensor packages

Test apparatus for a semiconductor package

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Super-thin high speed flip chip package

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

Semiconductor device

Heat dissipating structure and semiconductor package with the same

Semiconductor apparatus with decoupling capacitor

Expansion constrained die stack

Method of encapsulating interconnecting units in packaged microelectronic devices

Circuit device and manufacturing method of circuit device

Junction structure and junction method for conductive projection

Using benzocyclobutene based polymers as underfill materials

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

System and method for marking the surface of a semiconductor package

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board

Power amplifier circuitry and method

Power amplifier circuitry and method

Power amplifier circuitry and method

Power amplifier circuitry and method

Integrated circuit package

Stackable electronic assembly

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same

Integrated circuit packaging architecture

Semiconductor device and method of manufacturing the same

Semiconductor package structure

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods

Semiconductor device having transferred integrated circuit

Circuit-component-containing module

Method for fabricating thermally enhanced semiconductor device

Method of making a circuitized substrate

Method and system for integrated circuit packaging

Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuit

Substrate frame

Heat sink structure with embedded electronic components for semiconductor package

Embedded RF vertical interconnect for flexible conformal antenna

Resin-encapsulated package, lead member for the same and method of fabricating the lead member

Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same

Flip chip stacked package

Multi-dice chip scale semiconductor components

Semiconductor device, semiconductor module and method of manufacturing semiconductor device

Semiconductor device

Bonding material and circuit device using the same

Semiconductor device

Electronic package with insert conductor array

Array-molded package heat spreader and fabrication method therefor

Leadframe-based mold array package heat spreader and fabrication method therefor

Unit semiconductor chip and multi chip package with center bonding pads and methods for manufacturing the same

Chip stack package and manufacturing method thereof

High-frequency chip packages

Invertible microfeature device packages

Stacked microfeature devices and associated methods

Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations

Wire bonding for thin semiconductor package

Fluxless assembly of chip size semiconductor packages

Semiconductor device and method for production thereof

Method for making an integrated circuit substrate having embedded back-side access conductors and vias

Thermally enhanced component substrate: thermal bar

Transparent member in a solid-state image pick-up apparatus supported through use of micro-lenses larger in size than pixel micro-lenses and a method for producing the micro-lenses and transparent member

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device

Apparatus and method to reduce signal cross-talk

Ball grid array package, stacked semiconductor package and method for manufacturing the same

Package module for an IC device and method of forming the same

Chip carrier for semiconductor chip

Semiconductor package with heat sink

Semiconductor package with improved chip attachment and manufacturing method thereof

Semiconductor device

Area array type package stack and manufacturing method thereof

Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials

High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Apparatus and method for force mounting semiconductor packages to printed circuit boards

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

Method for manufacturing semiconductor devices

Semiconductor package with heat dissipating structure

Semiconductor device and method of manufacturing the same, circuit board and electronic instrument

Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection

Die-up ball grid array package including a substrate having an opening and method for making the same

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

Multi-chip package device with heat sink and fabrication method thereof

Stacked chip assembly with encapsulant layer

Integral chip lid and heat sink

Method for reducing defects in post passivation interconnect process

Structure and method for fine pitch flip chip substrate

Arrangement for authentication of a person

Tin/indium lead-free solders for low stress chip attachment

Multi-chip module

Multi-chip semiconductor device with specific chip arrangement

Flip chip package structure

Semiconductor device structural body and electronic device

Enhanced die-up ball grid array and method for making the same

Semiconductor device

Semiconductor device and an electronic device

Stacked mass storage flash memory package

Multi-chip package and manufacturing method thereof

Molded ball grid array

Semiconductor die packages with recessed interconnecting structures

Circuit board

Ultrathin leadframe BGA circuit package

Method of fabricating semiconductor device and semiconductor device

Composite lid for land grid array (LGA) flip-chip package assembly

Packaged microelectronic components

Method of manufacturing a semiconductor device

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

Image sensor package fabrication method

Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure

Variable thickness pads on a substrate surface

High reliability chip scale package

Method for assembling a ball grid array package with multiple interposers

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

High density chip carrier with integrated passive devices

Method of forming a package

Semiconductor device and its manufacturing method

Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane

Stacked chip-packaging structure

Method for fabricating semiconductor component with chip on board leadframe

Semiconductor component having chip on board leadframe

Electronic device package

Healing of micro-cracks in an on-chip dielectric

Semiconductor chip with fuse unit

Standoffs for centralizing internals in packaging process

Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses

Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate

Laminated wiring board and its mounting structure

Printed circuit board with a heat dissipation element and package comprising the printed circuit board

Method of making a semiconductor device having an opening in a solder mask

Method and apparatus for attaching microelectronic substrates and support members

Method for making electronic devices including silicon and LTCC and devices produced thereby

Method of manufacturing a stackable ball grid array

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Method of fabricating flip chip ball grid array package

Fabrication method of semiconductor integrated circuit device

Computer system including at least one stress balanced semiconductor package

Memory package

Ball grid array package substrate and method for manufacturing the same

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Semiconductor device

Arrangement for reducing stress in substrate-based chip packages

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Flexible tape electronics packaging and methods of manufacture

Ball grid array structures having tape-based circuitry

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

[MULTI-CHIP PACKAGE]

Micromachine package and method for manufacturing the same

Interposer and method of making same

Multilayered substrate for semiconductor device and method of manufacturing same

Microelectronic package with reduced underfill and methods for forming such packages

Method for optimizing routing layers and board space requirements for a ball grid array land pattern

Tailored interconnect module

System for making high-speed connections to board-mounted modules

Method of making a semiconductor device having an opening in a solder mask

Multichip semiconductor device, chip therefor and method of formation thereof

Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit

Capacitor device and method of manufacturing the same

Electronic component-built-in module

Transponder system and method for measurement of separation

Wafer-level chip scale package and method for fabricating and using the same

Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Reconnectable chip interface and chip package

Enhanced die-down ball grid array and method for making the same

BGA package with stacked semiconductor chips and method of manufacturing the same

Electronic package having a folded package substrate

Hybrid integrated circuit

Reconnectable chip interface and chip package

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Via and via landing structures for smoothing transitions in multi-layer substrates

Method and apparatus for generating a device ID for stacked devices

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument

Packaging method for thin integrated circuits

Optoelectronic packaging with embedded window

Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Packaging assembly and method of assembling the same

Substrate-less microelectronic package

Semiconductor device and method of fabricating the same

Manufacturing method for multichip module

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device

Multi-layer interconnection circuit module and manufacturing method thereof

Chip mounting substrate, first level assembly, and second level assembly

Fabrication method for stacked multi-chip package

Stacked-type semiconductor device

Package for semiconductor devices

Substrate-based chip package

Semiconductor packages for enhanced number of terminals, speed and power performance

Bonding pad for a packaged integrated circuit

Electronic device carrier adapted for transmitting high frequency signals

Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages

Method of manufacturing semiconductor device and method of manufacturing electronics device

Method of manufacturing an enhanced thermal dissipation integrated circuit package

Stacked chip semiconductor device and method for manufacturing the same

Microelectronic package

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Semiconductor device, method for manufacturing the same, circuit substrate and electronic device

Semiconductor device, stacked semiconductor device, methods of manufacturing them, circuit board, and electronic instrument

Semiconductor device

Chip package with grease heat sink

Chip package structure with dual heat sinks

Integrated circuit carrier

Stack package of semiconductor device

Method of manufacturing multi-chip stacking package

Semiconductor module in which a semiconductor package is bonded on a mount substrate

Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device

Leadless leadframe package substitute and stack package

PMM/DC-MHS HPM interposer system

Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof

Methods for producing a 3D semiconductor memory device and structure

Forming and/or configuring stacked dies

Package including a plurality of stacked semiconductor devices, an interposer and interface connections

Package including a plurality of stacked semiconductor devices, an interposer and interface connections

Package including a plurality of stacked semiconductor devices, an interposer and interface connections

Package including a plurality of stacked semiconductor devices, an interposer and interface connections

Interposer with interconnects and methods of manufacturing the same

Package including a plurality of stacked semiconductor devices, an interposer and interface connections

Compensating for memory input capacitance

Package including a plurality of stacked semiconductor devices an interposer and interface connections

Thrumold post package with reverse build up hybrid additive structure

Methods and structures for increasing the allowable die size in TMV packages

Underfill stop using via bars in semiconductor packages

Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die

Method for producing semiconductor package

Semiconductor apparatus and method for preparing the same

Integrated circuit package with thermally conductive pillar

Electronic device package

Pop devices and methods of forming the same

Fan-out in ball grid array (BGA) package

3D field programmable gate array system with reset management and method of manufacture thereof

Semiconductor device having overlapped via apertures

Heat spreader for package-on-package (PoP) type packages

Removal of electrostatic charges from an interposer via a ground pad thereof for die attach for formation of a stacked die

Flip chip stacking utilizing interposer

Flip chip cavity package

Molded leadframe substrate semiconductor package

Integrated chip package structure using silicon substrate and method of manufacturing the same

Chip package with die and substrate