Semiconductor chip and manufacturing method for the same, and semiconductor device

Organic dielectric electronic interconnect structures and method for making

Semiconductor device and manufacturing method thereof

Method for fabricating a flash-preventing window ball grid array semiconductor package

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

Method of manufacturing an electronic device, and electronic device

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Insulating substrate for IC packages having integral ESD protection

Semiconductor chip with external connecting terminal

Semiconductor chip with external connecting terminal

Semiconductor device and semiconductor module

Semiconductor device and method of manufacturing the same

RF and MMIC stackable micro-modules

High density chip level package for the packaging of integrated circuits and method to manufacture same

Semiconductor chip with external connecting terminal

Low profile stacking system and method

System and method for high performance heat sink for multiple chip devices

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Power supply connection structure to a semiconductor device

Stackable ceramic FBGA for high thermal applications

Multi-chip module and methods

Semiconductor device

Semiconductor device and manufacturing method thereof

Method for fabricating a warpage-preventive circuit board

Thermal interface

Semiconductor device with intermediate connector

Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device

Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device

Electromagnetic wave absorber, method of manufacturing the same and appliance using the same

Method of manufacturing a semiconductor device

Multi-chip package structure

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same

Chip package structure

Method and apparatus for applying body bias to integrated circuit die

Chip assembly package

Semiconductor package

Semiconductor integrated circuit device

Methods of making microelectronic assemblies including compliant interfaces

Semiconductor chip package and multichip package

Multi-chip package structure

Semiconductor device having layered chips

Semiconductor integrated circuit device

Image sensor package and method for manufacturing the same

Pixelated cadmium zinc telluride based photon counting mode detector

Printed circuit board and package having oblique vias

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

Attachment of integrated circuit structures and other substrates to substrates with vias

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Capacitor having an anodic metal oxide substrate

Capacitor having an anodic metal oxide substrate

Silicon carrier for optical interconnect modules

Method of attaching non-adhesive thermal interface materials

Integrated circuit package substrate having a thin film capacitor structure

Integrating passive components on spacer in stacked dies

Thermal interface material bonding

Semiconductor module with a semiconductor stack, and methods for its production

Packaging substrates for integrated circuits and soldering methods

Flexible package with rigid substrate segments for high density integrated circuit systems

Wire loop grid array package

Multiple chip package module having inverted package stacked over die

Stress distribution package

Wire bonding package

Chip assembly with glue-strengthening holes

Method of assembling a ball grid array package with patterned stiffener layer

Integrated circuit package substrate having a thin film capacitor structure

System and method for delivering power to a semiconductor device

System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures

Manufacturing method of a semiconductor device

Substrate structure capable of reducing package singular stress

Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process

Flip-chip solder bump formation using a wirebonder apparatus

Method for making a package substrate without etching metal layer on side walls of die-cavity

Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device

Semiconductor device including multi-chip

Data storage device and refreshing method for use with such device

Multilayer inductor with shielding plane

Method of manufacturing a semiconductor device and a semiconductor device

Patterned plasma treatment to improve distribution of underfill material

Method for ball grid array chip packages having improved testing and stacking characteristics

Ball grid array package substrates with a modified central opening and method for making the same

Local reduction of compliant thermally conductive material layer thickness on chips

Copper-based chip attach for chip-scale semiconductor packages

Semiconductor packages for enhanced number of terminals, speed and power performance

Stacked die semiconductor device

Microelectronic device signal transmission by way of a lid

Semiconductor package with improved solder joint reliability

Die extender for protecting an integrated circuit die on a flip chip package

Methods to prevent mechanical flexure related BGA failure

Combination back grind tape and underfill for flip chips

Semiconductor packaging

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Method of forming land grid array packaged device

Fan out type wafer level package structure and method of the same

Field programmable gate array incorporating dedicated memory stacks

Module board having embedded chips and components and method of forming the same

Semiconductor device

Arrangement of a chip package constructed on a substrate and substrate for production of the same

Semiconductor device and a method of manufacturing the same

Offset-bonded, multi-chip semiconductor device

Thinned die integrated circuit package

Integrated solder and heat spreader fabrication

Method for fabricating chip package

Stacked integrated circuit packages and methods of making the packages

Silicon chip carrier with conductive through-vias and method for fabricating same

Integrated circuit and method of manufacturing an integrated circuit and package

Multi-chips bumpless assembly package and manufacturing method thereof

Stackable integrated circuit packaging

Semiconductor package with a chip on a support plate

Integrated circuit package overlay

Chip package and electrical connection structure between chip and substrate

Method of manufacturing semiconductor device and system of manufacturing semiconductor device

Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling

Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling

Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling

Ball grid array package with heat sink device

Component packaging apparatus, systems, and methods

Stacked microelectronic assemblies with central contacts

Packages for image sensitive electronic devices

Stacked semiconductor device

Semiconductor package with heat spreader

Stacked chip semiconductor device

Formation of circuitry with modification of feature height

Semiconductor device and manufacturing method thereof

Circuit module

Component packaging apparatus, systems, and methods

Analysis of integrated circuits for high frequency performance

Multi-chip package type memory system

Integrating passive components on spacer in stacked dies

Semiconductor device and its manufacturing method, and semiconductor device manufacturing system

Fabrication method for semiconductor package heat spreaders

Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light

Semiconductor device and method of making the same

Low coefficient of thermal expansion (CTE) semiconductor packaging materials

Routing scheme for differential pairs in flip chip substrates

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor chip, semiconductor device, circuit board, and electronic instrument

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus

Semiconductor device and method of manufacturing the same, circuit board and electronic device

Semiconductor device

Semiconductor device, its manufacturing method, circuit board, and electronic unit

Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)

Module assembly and method for stacked BGA packages

Highly reliable stack type semiconductor package

Chip adhesive

Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same

Lead frame, resin-encapsulated semiconductor device, and method of producing the same

High performance chip carrier substrate

Digital output MEMS pressure sensor and method

Method and apparatus for filling vias

Method of manufacturing a semiconductor device

Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument

Semiconductor/printed circuit board assembly, and computer system

Techniques for packaging multiple device components

In-line die attaching and curing apparatus for a multi-chip package

Raised solder-mask-defined (SMD) solder ball pads for a laminate electronic circuit board

Structure and method for lead free solder electronic package interconnections

Optical device mounted substrate assembly

Micropin heat exchanger

High-frequency module and communication apparatus

Substrate-based package for integrated circuits

High wireability microvia substrate

Electric connection terminal and method of manufacturing the same, semiconductor device and method of mounting the same

Semiconductor device having semiconductor chips mounted on package substrate

Semiconductor chip package having decoupling capacitor and manufacturing method thereof

Encapsulated lead having step configuration

Heat spreader and semiconductor device package having the same

Micropin heat exchanger

Semiconductor package

Heat spreader and semiconductor device package having the same

Semiconductor chip package and method

Multi-chip module

Stacked BGA packages

Wafer level stack structure for system-in-package and method thereof

Integrated circuit carrier apparatus method and system

Semiconductor element, semiconductor device, and method for manufacturing semiconductor element

EMI shielded integrated circuit packaging apparatus method and system

Semiconductor component and sensor component for data transmission devices

Stair step printed circuit board structures for high speed signal transmissions

Etching method and method of manufacturing circuit device using the same

Integrated circuit device and the manufacturing method thereof

Transfer mold semiconductor packaging processes

Method and system for hermetically sealing packages for optics

Semiconductor chip, chip stack package and manufacturing method

Test system with interconnect having conductive members and contacts on opposing sides

Stacked memory, memory module and memory system

Hyperbga buildup laminate

Image pickup device and a manufacturing method thereof

Semiconductor device and method of manufacturing the same

Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

Flip chip interconnection pad layout

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor package having ultra-thin thickness and method of manufacturing the same

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

FBGA arrangement

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Multi-chips module assembly package

Integrated circuit package having a resistant layer for stopping flowed glue

Semiconductor device

Fabrication method of semiconductor package with heat sink

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Structure and method of making capped chips having vertical interconnects

Method of RFIC die-package configuration

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Magnetic thin film, magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device

Carrier for cleaning sockets for semiconductor components having contact balls

Heat sinkable package

Semiconductor device

Arrangement for improving the reliability of semiconductor modules

Semiconductor package having discrete non-active electrical components incorporated into the package

Integrated interconnect package

Semiconductor chip and semiconductor device including lamination of semiconductor chips

BGA package with component protection on bottom

Multi-surface contact IC packaging structures and assemblies

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

High density microvia substrate with high wireability

RFIC die-package configuration

Chip package with die and substrate

Semiconductor device and method of fabricating the same

Microvia structure and fabrication

Circuit device

Solderless electronics packaging and methods of manufacture

Chip package with die and substrate

Stacked semiconductor packages

Manufacturing method of ball grid array package

Constructing of an electronic assembly having a decoupling capacitor

Circuit device

Capacitor and method of producing same

Electronic component and panel and method for producing the same

Ball grid array package and method thereof

Cavity-down semiconductor package with heat spreader

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Back-face and edge interconnects for lidded package

Multilayered substrate for semiconductor device

Semiconductor chip package and method for making the same

Circuit device

Power module flip chip package

Chip package structure and process for fabricating the same

Wiring substrate for mounting semiconductor components

Method for fabricating a semiconductor package with multi layered leadframe

Optoelectronic semiconductor device and light signal input/output device

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

Structure and method of making capped chips using sacrificial layer

Method of manufacturing a semiconductor device

Deformable semiconductor device

Stacked semiconductor device and semiconductor chip control method

Semiconductor device and semiconductor module

Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same

Stacked package module

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Integrated circuit packaging system

Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area

Chip package and electrical connection structure between chip and substrate

Optical semiconductor housing with transparent chip and method for making same

Thermopile IR detector package structure

Apparatus including circuit board and heat sink and method of making the apparatus

Substrate for a semiconductor device

Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate

Optimization of routing layers and board space requirements for a ball grid array package

Method for producing a multichip module and multichip module

Optimization of routing layers and board space requirements for a ball grid array land pattern

High power light emitting diode device

Integrated circuit package

Semiconductor device and its manufacturing method

Ball grid array package with patterned stiffener surface and method of assembling the same

Optical device and production method thereof

Ball grid array (BGA) package having corner or edge tab supports

Chip package with degassing holes

Inter-chip and intra-chip wireless communications systems

Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same

Integrated circuit incorporating flip chip and wire bonding

Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Semiconductor device and method of fabricating the same

Conductive trace structure and semiconductor package having the conductive trace structure

Semiconductor component and system having stiffener and circuit decal

Lead frame, semiconductor device, and method for manufacturing semiconductor device

Semiconductor device protection cover, and semiconductor device unit including the cover

Routing for reducing impedance distortions

Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Substrate for pre-soldering material and fabrication method thereof

Method of manufacturing a semiconductor device

Stress compensation layer systems for improved second level solder joint reliability

Heatsink device and method

Method of producing an electronic component and a panel with a plurality of electronic components

Method and apparatus for a dual substrate package

Semiconductor apparatus and method of fabricating the same

Semiconductor module and method for producing a semiconductor module

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another

Memory expansion and chip scale stacking system and method

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Electronic assembly with thermally separated support

Manufacturing method of electronic components embedded substrate

Method and system for packaging ball grid arrays

Method for producing a protection for chip edges and system for the protection of chip edges