Printed circuit board

Inductor and electric power supply using it

Semiconductor device having multilayer printed wiring board and manufacturing method of the same

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Polymer matrices for polymer solder hybrid materials

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Multilayer printed circuit board

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Microelectonic packages and methods therefor

Semiconductor device

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages

High performance electrical connector

Substrate having a functionally gradient coefficient of thermal expansion

Customizable power and ground pins

Method of forming a thin film capacitor

Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board

Interconnect substrate, semiconductor device, and method of manufacturing the same

Apparatus for solder crack deflection

Nanoengineered thermal materials based on carbon nanotube array composites

Array capacitors for broadband decoupling applications

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Integrated circuit package to provide high-bandwidth communication among multiple dice

Semiconductor component having plate, stacked dice and conductive vias

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Column grid array using compliant core

Composite carbon nanotube thermal interface device

Lead pin, circuit, semiconductor device, and method of forming lead pin

Hybrid module and method of manufacturing the same

Semiconductor device and radiation detector employing it

HEAT DISSIPATION DEVICE AND METHOD FOR MAKING THE SAME

INTEGRATED INDUCTOR STRUCTURE AND METHOD OF FABRICATION

Tier structure with tier frame having a feedthrough structure

Semiconductor device and radiation detector employing it

Multilayer printed wiring board

Manufacturing process for chip package without core

Voltage regulators and systems containing same

Method and structure for reduction of soft error rates in integrated circuits

Semiconductor device and electronic apparatus of multi-chip packaging

System and method for processor power delivery and thermal management

Lead-free semiconductor package

Contact Structures Comprising A Core Structure And An Overcoat

Split thin film capacitor for multiple voltages

Wiring substrate and bonding pad composition

Integrated electronic chip and interconnect device and process for making the same

Semiconductor device mounting chip having tracing function

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Apparatuses and associated methods for improved solder joint reliability

Inductive filters and methods of fabrication therefor

System-in-a-package based flash memory card

Adherence of a solid-state image-sensing device to a substrate

INTEGRATED CAPACITOR FOR WAFER LEVEL PACKAGING APPLICATIONS

Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions

Multilayer printed wiring board

Semiconductor device and method of manufacturing the same

Multilayer printed wiring board

Image pickup device and method of manufacturing the same

Semiconductor device and radiation detector employing it

Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same

Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same

Capacitive element, semiconductor device, and method of manufacturing the capacitive element

Semiconductor devices including peripherally located bond pads, intermediates thereof, and assemblies and packages including the semiconductor devices

Support elements for semiconductor devices with peripherally located bond pads

Miniature optical element for wireless bonding in an electronic instrument

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Chip heat dissipation structure and manufacturing method

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Placement of absorbing material in a semiconductor device

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Integrated transformer structure and method of fabrication

Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same

Apparatus and method for manufacturing thermal interface device having aligned carbon nanotubes

Method of making an electronic assembly

Substrate bump formation

Capacitor design for controlling equivalent series resistance

Capacitor pad network to manage equivalent series resistance

Semiconductor component having plate and stacked dice

Semiconductor die attachment for high vacuum tubes

Process for fabricating chip embedded package structure

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

System to control effective series resistance of decoupling capacitor

Semiconductor device and method for manufacture thereof, circuit board, and electronic instrument

Integrated inductor and method of fabrication

System to control effective series resistance of power delivery circuit

Wafer-level diamond spreader

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Methods to deposit metal alloy barrier layers

Cavity-down stacked multi-chip package

Method forming split thin film capacitors with multiple voltages

Thermally conductive composite and uses for microelectronic packaging

Semiconductor device having multilayer printed wiring board

Substrate having a functionally gradient coefficient of thermal expansion

Integrated circuit package with carbon nanotube array heat conductor

Control unit and method for producing the same

Voltage droop suppressing circuit

High wireability microvia substrate

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

Semiconductor package and method for its manufacture

Semiconductor package

Electronic assembly having multi-material interconnects

Laser metallization for ceramic device

Wafer-level diamond spreader

Voltage droop suppressing active interposer

Microelectronic packages and methods therefor

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Extended thin film capacitor (TFC)

Interposer containing bypass capacitors for reducing voltage noise in an IC device

Semiconductor die package with internal bypass capacitors

Apparatus for providing capacitive decoupling between on-die power and ground conductors

Printed wiring board

System and method for processor power delivery and thermal management

Encapsulation of pin solder for maintaining accuracy in pin position

Thermal interface material with aligned carbon nanotubes

Circuit carrier and fabrication method thereof

Semiconductor package, method of production of same, and semiconductor device

Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor

Semiconductor die attachment for high vacuum tubes

Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate

Chip embedded package structure

Semiconductor die attachment for high vacuum tubes

Multilayer printed wiring board

Integrated circuit package with low modulus layer and capacitor/interposer

Nanoengineered thermal materials based on carbon nanotube array composites

Die down semiconductor package

Methods of forming channels on an integrated circuit die and die cooling systems including such channels

Microelectronic packaging and methods for thermally protecting package interconnects and components

Phase change material containing fusible particles as thermally conductive filler

Extended thin film capacitor (TFC)

Metallic solder thermal interface material layer and application of the same

Delivery regions for power, ground and I/O signal paths in an IC package

Capacitor-related systems for addressing package/motherboard resonance

Integrated circuit package with chip-side signal connections

Semiconductor device

Method of manufacturing multi-layer printed circuit board

Thin-film capacitor device, mounting module for the same, and method for fabricating the same

Multi-layer substrate module and wireless terminal device

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Method of making an integrated circuit

Method for interconnecting an integrated circuit multiple die assembly

Printed circuit board and method for manufacturing printed circuit board

Lithography device for semiconductor circuit pattern generation

Multilayer wiring board including stacked via structure

Semiconductor device

I/O architecture for integrated circuit package

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

Methods for maskless lithography

Lead-free integrated circuit package structure

Integrated circuit package overlay

High wireability microvia substrate

Electronic device with reduced entrapment of material between die and substrate electrical connections

Laminated socket contacts

Flexible and elastic dielectric integrated circuit

Membrane 3D IC fabrication

Method of fabrication for a thermal spreader using thermal conduits

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Integrated circuit die/package interconnect

Thermal interface material with aligned carbon nanotubes

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

Semiconductor package

Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board

I/O architecture for integrated circuit package

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Stress-controlled dielectric integrated circuit

Copper paste and wiring board using the same

Method for fabricating thermally enhanced semiconductor device

Multi-dice chip scale semiconductor components

Interconnections

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Semiconductor device and an electronic device

Contact structures and methods for making same

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

Printed wiring board and manufacturing method therefor