212648 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
HYBRID BONDING METHODS AND DEVICE ASSEMBLIES FORMED USING THE SAME
#2Laminate and electronic device
#3Semiconductor package having a trench penetrating a main body
#4Semiconductor packages including interconnection members
#5Miniaturized SMD diode package and process for producing the same
#6Miniaturized SMD diode package and process for producing the same
#7Three-dimensional structure in which wiring is provided on its surface
#8Power semiconductor package with conductive clip
#9Semiconductor device reducing risks of a wire short-circuit and a wire flow
#10Interposer and electronic device using the same
#11SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY VERTICALLY STACKING SEMICONDUCTOR DEVICES, AND MANUFACTURING METHOD THEREOF
#12SUBSTRATE FOR POWER MODULE AND POWER MODULE
#13Magnetic integration double-ended converter
#14IGBT power semiconductor package having a conductive clip
#15Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same
#16Module with Flat Construction and Method for Placing Components
#17STRUCTURE ON CHIP PACKAGE TO SUBSTANTIALLY MATCH STIFFNESS OF CHIP
#18Method of manufacturing electronic component package
#19Wiring substrate and electronic device
#20Wafer level package with die receiving through-hole and method of the same
#21Semiconductor device and method of manufacturing the same
#22Method of manufacturing a device having a contacting structure
#23Encapsulation of circuit components to reduce thermal cycling stress