ClassID:

212676

H01L2924/16593 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Connection portion, e.g. seal; Material with a principal constituent of the material being a solid not provided for in groups  - , e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond