H01L2924/164 - CPC Classification Index

ClassID:

212670 ⎘

H01L2924/164 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Connection portion, e.g. seal Material

Sub-classes:

H01L2924/165 » with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof 27
H01L2924/16586 » with a principal constituent of the material being a non metallic, non metalloid inorganic material 2
H01L2924/1659 » with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy 60
H01L2924/16593 » with a principal constituent of the material being a solid not provided for in groups to , e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond 0
H01L2924/16598 » with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams 5

Recent Application in this class:

20230420318

SEMICONDUCTOR MODULE

20230223365

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

20210020591

Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof

20210005522

Lid structure and semiconductor device package including the same

20190252287

Electronics package with improved thermal performance

20190122946

System and method for bonding package lid

20180314293

Computing devices with an adhered cover and methods of manufacturing thereof

20180148319

Hermetically sealed MEMS device and its fabrication

20180082936

Fan-out package structure having stacked carrier substrates and method for forming the same

20180049351

Electronic component package structure and electronic device

20170271223

System and method for bonding package lid

20170154861

Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof

20170110426

Lid structure and semiconductor device package including the same

20160322317

Semiconductor device and manufacturing method thereof

20160276294

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

20150364428

Electronic device

20150305210

Electronic component package structure and electronic device

20150262972

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

20150255422

Semiconductor device and manufacturing method thereof

20150214128

System and method for bonding package lid

20140138817

Semiconductor device and manufacturing method thereof

20140027898

Multichip electronic packages and methods of manufacture

20120326294

Multichip electronic packages and methods of manufacture

20120321907

BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS

20120138954

Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chip

20120068325

Substrate bonding with metal germanium silicon material

20120025363

Package structure

20110204457

Semiconductor device having a base, a cavity, a diaphragm, and a substrate

20100308475

COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION METHOD

20100181676

Substrate bonding with metal germanium silicon material