212677 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Connection portion, e.g. seal; Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
SEMICONDUCTOR DEVICE
#2LIQUID METAL THERMAL INTERFACE
#3Solid metal foam thermal interface material
#4Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member
#5Methods for forming semiconductor device packages
#6Semiconductor device packages
#7Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process