H01L2924/167 - CPC Classification Index

ClassID:

212679 ⎘

H01L2924/167 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

Sub-classes:

H01L2924/16701 » the principal constituent melting at a temperature of less than 400 C 0
H01L2924/16717 » the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C 0
H01L2924/16738 » the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C 0
H01L2924/16763 » the principal constituent melting at a temperature of greater than 1550 C 0

Recent Application in this class:

20240228264

2024-07-11

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

20240132340

2024-04-25

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

20190348401

2019-11-14

Semiconductor device assembly with heat transfer structure formed from semiconductor material

20190229096

2019-07-25

Semiconductor device assembly with heat transfer structure formed from semiconductor material

20190198435

2019-06-27

Integrated interposer solutions for 2D and 3D IC packaging

20170365584

2017-12-21

Semiconductor device assembly with heat transfer structure formed from semiconductor material

20170317019

2017-11-02

Integrated interposer solutions for 2D and 3D IC packaging

20170018510

2017-01-19

Microelectronic assemblies with cavities, and methods of fabrication

20160343687

2016-11-24

Semiconductor device assembly with heat transfer structure formed from semiconductor material

#10

20160311677

2016-10-27

Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member

#11

20160293509

2016-10-06

Metal top stacking package structure and method for manufacturing the same

#12

20160276294

2016-09-22

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

#13

20160260644

2016-09-08

Electronic package and fabrication method thereof

#14

20160143148

2016-05-19

Printed circuit board

#15

20160126164

2016-05-05

Cavity package with pre-molded cavity leadframe

#16

20160087671

2016-03-24

High frequency circuit device

#17

20160049342

2016-02-18

Module arrangement for power semiconductor devices

#18

20150262972

2015-09-17

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

#19

20150200151

2015-07-16

Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method

#20

20150137279

2015-05-21

Multi-die sensor device

#21

20150076684

2015-03-19

Semiconductor device

#22

20150076682

2015-03-19

Thinned integrated circuit device and manufacturing process for the same

#23

20150069545

2015-03-12

Semiconductor device and method of manufacturing the same

#24

20150061094

2015-03-05

Cavity package with pre-molded cavity leadframe

#25

20150033554

2015-02-05

Organic module EMI shielding structures and methods

#26

20150008571

2015-01-08

Substrate warpage control using external frame stiffener

#27

20140284764

2014-09-25

Semiconductor package having heat slug and passive device

#28

20140210059

2014-07-31

Organic module EMI shielding structures and methods

#29

20140159224

2014-06-12

Semiconductor device

#30

20140103506

2014-04-17

Semiconductor chip device with polymeric filler trench

#31

20140078677

2014-03-20

Heat sinking and electromagnetic shielding structures

#32

20130293428

2013-11-07

Microelectronic wireless transmission device

#33

20130015564

2013-01-17

Semiconductor device having antenna element and method of manufacturing same

#34

20120292691

2012-11-22

Vertical MOSFET device

#35

20120235289

2012-09-20

Power device with bottom source electrode

#36

20120119969

2012-05-17

Integrated antenna package

#37

20120115279

2012-05-10

Chip-scale semiconductor die packaging method

#38

20120104572

2012-05-03

Semiconductor package module

#39

20120087098

2012-04-12

PACKAGE SUBSTRATE

#40

20120074560

2012-03-29

Integrated circuit packaging system with warpage control and method of manufacture thereof

#41

20120061852

2012-03-15

Semiconductor chip device with polymeric filler trench

#42

20120061133

2012-03-15

High-frequency circuit package and high-frequency circuit device

#43

20120018873

2012-01-26

Method and package for circuit chip packaging

#44

20120007229

2012-01-12

Enhanced thermal management of 3-D stacked die packaging

#45

20110233736

2011-09-29

Integrated circuit packaging system with encapsulation and method of manufacture thereof

#46

20110227209

2011-09-22

Integrated circuit package system with package stacking and method of manufacture thereof

#47

20110227153

2011-09-22

Vertical MOSFET with through-body via for gate

#48

20110205709

2011-08-25

Sandwich structure with double-sided cooling and EMI shielding

#49

20110204496

2011-08-25

CIRCUIT MODULE, ELECTRONIC DEVICE INCLUDING THE SAME, AND CIRCUIT MODULE MANUFACTURING METHOD

#50

20110171779

2011-07-14

Semiconductor device manufacturing method

#51

20110143476

2011-06-16

Electrical coupling of wafer structures

#52

20110140260

2011-06-16

Chip assembly with chip-scale packaging

#53

20110127654

2011-06-02

Semiconductor Package and Manufacturing Methods Thereof

#54

20110096505

2011-04-28

Package substrate

#55

20110037167

2011-02-17

Method and package for circuit chip packaging

#56

20110003421

2011-01-06

Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures

#57

20100013011

2010-01-21

Vertical MOSFET with through-body via for gate

#58

20090261460

2009-10-22

Wafer level integration package

#59

20090224313

2009-09-10

Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface

#60

20090162976

2009-06-25

Method of manufacturing pins of miniaturization chip module

#61

20080315372

2008-12-25

Method of making a wafer level integration package

#62

20080237846

2008-10-02

Semiconductor device and manufacturing method thereof

#63

20060243384

2006-11-02

Method for adhesive bonding in electronic packaging

#64

20060087033

2006-04-27

Molded high density electronic packaging structure for high performance applications

#65

20060012016

2006-01-19

Radiofrequency power semiconductor module with cavity housing, and method for producing it