212682 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400 C and less than 950 C Aluminium [Al] as principal constituent
REINFORCED STRUCTURE WITH CAPPING LAYER
#2REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE SAME
#3Embedded lid for low cost and improved thermal performance
#4Semiconductor structure and manufacturing method thereof
#5Semiconductor structure and manufacturing method thereof
#6Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device
#7Packaged integrated circuit including a switch-mode regulator and method of forming the same
#8Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#9Electronic module and method of manufacturing the same
#10Chip packages and methods of manufacture thereof
#11Semiconductor device and manufacturing method of semiconductor device
#12Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#13Thinned integrated circuit device and manufacturing process for the same
#14Semiconductor device and manufacturing method thereof
#15Copper nanorod-based thermal interface material (TIM)