212690 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
Sub-classes:3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
#23DIC packaging with hot spot thermal management features
#33DIC packaging with hot spot thermal management features
#43DIC packaging with hot spot thermal management features
#5Shield cap and method for manufacturing the same
#63DIC packaging with hot spot thermal management features
#7Semi-hermetic semiconductor package
#8Method for mounting an electrical component in which a hood is used, and a hood that is suitable for use in this method
#9Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#10Electronic module and method of manufacturing the same
#11Printed circuit board
#12Chip packages and methods of manufacture thereof
#13Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#143DIC packaging with hot spot thermal management features
#15Chip-scale semiconductor die packaging method
#16SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#17Chip assembly with chip-scale packaging
#18Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
#19Radiofrequency power semiconductor module with cavity housing, and method for producing it