212691 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene