H01L2924/176 - CPC Classification Index

ClassID:

212700 ⎘

H01L2924/176 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Frame Material

Sub-classes:

H01L2924/177 » with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof 5
H01L2924/17786 » with a principal constituent of the material being a non metallic, non metalloid inorganic material 0
H01L2924/1779 » with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy 1
H01L2924/17793 » with a principal constituent of the material being a solid not provided for in groups to , e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond 1
H01L2924/17798 » with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams 0

Recent Application in this class:

20260033331

2026-01-29

THERMALLY ENHANCED EMBEDDED DIE PACKAGE

20240038619

2024-02-01

THERMALLY ENHANCED EMBEDDED DIE PACKAGE

20210225717

2021-07-22

Semiconductor package

20180277396

2018-09-27

Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader

20180061733

2018-03-01

Method of fabricating a chip module with stiffening frame and orthogonal heat spreader

20180061732

2018-03-01

Chip module with stiffening frame and orthogonal heat spreader

20160358836

2016-12-08

Method of fabricating a chip module with stiffening frame and directional heat spreader