212710 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Frame; Material with a principal constituent of the material being a non metallic, non metalloid inorganic material Ceramics, e.g. crystalline carbides, nitrides or oxides
PACKAGE STRUCTURE
#2PACKAGE AND SEMICONDUCTOR DEVICE
#3Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Package
#4Package for a semiconductor device
#5Semiconductor device