H01L2924/1779 - CPC Classification Index

ClassID:

212712 ⎘

H01L2924/1779 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Frame; Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

Sub-classes:

H01L2924/17791 » The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene 1

Recent Application in this class:

20180342466

2018-11-29

Semiconductor device package and method of manufacturing the same