212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Semiconductor device
#3002Heat isolation structures for high bandwidth interconnects
#3003Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same
#3004Method for fabricating a semiconductor chip panel
#3005Illumination light source, illumination apparatus, outdoor illumination apparatus, and vehicle headlight
#3006Resin composition, reflector, lead frame with reflector, and semiconductor light-emitting device
#3007Semiconductor light emitting device having convex portion made with different materials
#3008Curable resin composition, optical element and optical semiconductor device
#3009Low profile integrated circuit (IC) package comprising a plurality of dies
#3010Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same
#3011Semiconductor device and manufacturing method thereof
#3012Package substrate and semiconductor package including the same
#3013Wiring board and electronic device
#3014Electronic device with periphery contact pads surrounding central contact pads
#3015Integrated package design with wire leads for package-on-package product
#3016Mixed impedance leads for die packages and method of making the same
#3017Electrically insulating thermal interface on the discontinuity of an encapsulation structure
#3018Semiconductor package including substrates spaced by at least one electrical connecting element
#3019Resin composition for sealing semiconductor and semiconductor device
#3020Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereof
#3021Anti-reflective film, electronic device including the same, and apparatus for and method of manufacturing the same
#3022Wiring board with dual stiffeners and dual routing circuitries integrated together and method of making the same
#3023Semiconductor device
#3024Light emitting device
#3025Semiconductor device and method of manufacturing semiconductor device
#3026Electronic device package and fabricating method thereof
#3027Semiconductor device including protective film over a substrate
#3028Substrate design with balanced metal and solder resist density
#3029Semiconductor device that transfers an electric signal with a set of inductors
#3030Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting
#3031Semiconductor package with embedded output inductor
#3032Semiconductor device
#3033Semiconductor device
#3034Semiconductor device having a substrate housed in the housing opening portion
#3035Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#3036Radio frequency shielding within a semiconductor package
#3037Antenna apparatus and method
#3038Light-emitting apparatus
#3039Semiconductor nanoparticle-based light-emitting devices and associated materials and methods
#3040Method for producing semiconductor light-emitting device
#3041Phosphor with preferred orientation, fabricating method thereof, and light-emitting element package structure employing the same
#3042Semiconductor package for thermal dissipation
#3043Apparatus for stacked semiconductor packages and methods of fabricating the same
#30443-D package having plurality of substrates
#3045Semiconductor package
#3046Conical-shaped or tier-shaped pillar connections
#3047Semiconductor device and method for manufacturing the same
#3048Semiconductor device
#3049Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor device
#3050Semiconductor device including electric and magnetic field shielding
#3051Electronic part embedded substrate and method of producing an electronic part embedded substrate
#3052Semiconductor power package and method of manufacturing the same
#3053Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#3054Fingerprint sensor and manufacturing method thereof
#3055Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
#3056Solder material and connected structure
#3057Light emitting device
#3058Optical sensor device
#3059Optical sensor device
#3060Semiconductor device
#3061Package-on-package structures and methods for forming the same
#3062Shielded electronic component package
#3063Bonding material, bonding method and semiconductor device for electric power
#3064Packaging devices and methods of manufacture thereof
#3065Semiconductor device
#3066Power semiconductor module
#3067Semiconductor package and mounting structure thereof
#3068Device, package structure and method of forming the same
#3069Semiconductor device and production method therefor
#3070High efficiency module
#3071Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological method
#3072Electronic component package including electronic component, metal member, and sealing resin
#3073Semiconductor module and drive device equipped with semiconductor module
#3074Package for a surface-mount semiconductor device and manufacturing method thereof
#3075Surface-mount semiconductor device having exposed solder material
#3076Semiconductor device including lead frames with downset
#3077Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by the same
#3078Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern
#3079Light emitting device
#3080Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component
#3081Semiconductor device
#3082Stacked semiconductor die assemblies with support members and associated systems and methods
#3083Mechanisms of forming connectors for package on package
#3084Package-on-package semiconductor assemblies and methods of manufacturing the same
#3085Interconnect structure with improved conductive properties and associated systems and methods
#3086Packaging through pre-formed metal pins
#3087Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
#3088Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#3089Package structure and three dimensional package structure
#3090Molding compound structure
#3091Power semiconductor device and method of manufacturing the same
#3092Semiconductor lead frame, semiconductor package, and manufacturing method thereof
#3093Semiconductor device
#3094Power semiconductor module
#3095Waterproof electronic device and manufacturing method thereof
#3096Thin film based fan out and multi die package platform
#3097Chip package having a patterned conducting plate and a conducting pad with a recess
#3098Semiconductor devices comprising getter layers and methods of making and using the same
#3099Semiconductor device including at least one element
#3100Methods of packaging semiconductor devices and structures thereof
#3101Power module and fabrication method for the same
#3102Phosphor, manufacturing method thereof, and light-emitting device using the phosphor
#3103Electronic component package and method of manufacturing the same
#3104Method for producing semiconductor light-emitting device
#3105Stacked semiconductor die assemblies with die support members and associated systems and methods
#3106Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP
#3107Integrated device die and package with stress reduction features
#3108Semiconductor device
#3109Method of forming a semiconductor package
#3110Semiconductor device and method for manufacturing the same
#3111Semiconductor package and method of fabricating the same
#3112Power semiconductor device
#3113Semiconductor package with clip structure
#3114Integrated clip and lead and method of making a circuit
#3115Semiconductor module having an embedded metal heat dissipation plate
#3116Semiconductor device
#3117Molding structure for wafer level package
#3118Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#3119Semiconductor device and method of forming a thin wafer without a carrier
#3120Manufacturing method of a resin molded article
#3121Resistor and method for manufacturing resistor
#3122Package-on-package (PoP) device comprising bi-directional thermal electric cooler
#3123Fluid directing assembly
#3124Rigid-flex electronic module
#3125Methods of forming conductive and insulating layers
#3126Integrated fan-out structure with guiding trenches in buffer layer
#3127Stacked package device and method for fabricating the same
#3128Methods of packaging semiconductor devices and packaged semiconductor devices
#3129Packaging devices, methods of manufacture thereof, and packaging methods
#3130Semiconductor packages having semiconductor chips disposed in opening in shielding core plate
#3131Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping
#3132Method of manufacturing semiconductor device by applying molding layer in substrate groove
#3133Flexible system-in-package solutions for wearable devices
#3134Sensor module, and sensor chip and processing circuit chip used therefor
#3135Methods for connecting inter-layer conductors and components in 3D structures
#3136Method of embedding a component in a printed circuit board
#3137Magnetic nanocomposite materials and passive components formed therewith
#3138Light emitting device, package, and method for manufacturing these
#3139Light source circuit unit, illuminator, and display
#3140Method of manufacturing light emitting device
#3141Making multilayer 3D capacitors using arrays of upstanding rods or ridges
#3142Multichip integration with through silicon via (TSV) die embedded in package
#3143Package on package bonding structure and method for forming the same
#3144Semiconductor packages having package-on-package structures
#3145Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
#3146Wiring substrate
#3147Fan-out wafer level package structure
#3148Semiconductor device and method for manufacturing the same
#3149Integration of backside heat spreader for thermal management
#3150Integrated circuit comprising at least an integrated antenna
#3151Radical polymerization initiator, multi-branched polymer, varnish, adhesive agent, coating material, sealing material, semiconductor, and electronic device
#3152Light emitting device
#3153Semiconductor device, and alternator and power conversion device which use same
#3154Optical coupling device having a drive circuit on a ground frame to drive a light emitting element on a power frame
#3155Transistor arrangement
#3156Semiconductor device
#3157Semiconductor device having conductive via and manufacturing process for same
#3158Semiconductor package manufacturing method
#3159Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures
#3160Semiconductor module with conductive pin
#3161Electronic components with integral lead frame and wires
#3162Power semiconductor device
#3163Processes for preparing color stable red-emitting phosphors
#3164Power module, power converter device, and electrically powered vehicle
#3165MOSFET with reduced resistance
#31663D die stacking structure with fine pitches
#3167Methods for packaging integrated circuits
#3168Plastic-packaged semiconductor device having wires with polymerized insulating layer
#3169Methods of forming multiple conductive features in semiconductor devices in a same formation process
#3170Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
#3171Combined packaged power semiconductor device
#3172Semiconductor device
#3173Packaging solutions for devices and systems comprising lateral GaN power transistors
#3174Structure and method to minimize warpage of packaged semiconductor devices
#3175Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package
#3176Electronic package assembly
#3177Semiconductor device and method of manufacturing semiconductor device
#3178Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#3179Semiconductor package
#3180Double-sided semiconductor package and dual-mold method of making same
#3181Reliable microstrip routing for electronics components
#3182Packaged semiconductor devices and methods of packaging semiconductor devices
#3183Plated terminals with routing interconnections semiconductor device
#3184Plated terminals with routing interconnections semiconductor device
#3185Cavity package with composite substrate
#3186Semiconductor device
#3187Semiconductor device
#3188Power module and method of manufacturing power module
#3189Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device
#3190Semiconductor package modules, memory cards including the same, and electronic systems including the same
#3191Switching device and electronic circuit
#3192Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#3193Light emitting device package strip
#3194Light emitting diodes and methods with encapsulation
#3195Method for manufacturing semiconductor device including step of simultaneous formation of plurality of contact openings
#3196Process for forming package-on-package structures
#3197Three-dimensional vertical memory comprising dice with different interconnect levels
#3198Chip on package structure and method
#3199System-in-package and fabrication method thereof
#3200Stacked package configurations and methods of making the same
#3201Methods for forming semiconductor device packages
#3202Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical power
#3203Semiconductor device and method of forming wafer level ground plane and power ring
#3204Compound semiconductor device including a sensing lead
#3205Compound semiconductor device including a multilevel carrier
#3206Circuit assemblies with multiple interposer substrates, and methods of fabrication
#3207Plated terminals with routing interconnections semiconductor device
#3208Die-on-interposer assembly with dam structure and method of manufacturing the same
#3209Manufacturing method of chip package structure
#3210Semiconductor devices including control and load leads of opposite directions
#3211Semiconductor device including conductive clip with flexible leads and related methods
#3212Semiconductor package
#3213Semiconductor device packages
#3214Integrated circuit package configurations to reduce stiffness
#3215Method for manufacturing a semiconductor device
#3216Manufacturing method of package substrate and package manufacturing method of semiconductor device
#3217Encapsulating resin composition, semiconductor device using the encapsulating resin composition, and method for manufacturing semiconductor device using the encapsulating resin composition
#3218Laser welding method
#3219Glass interposer with embedded thermoelectric devices
#3220Semiconductor package with integrated output inductor using conductive clips
#3221Electrical overstress recording and/or harvesting
#3222Semiconductor devices having insulating substrates and methods of formation thereof
#3223Light emitting device
#3224Light emitting diode package including color absorbing body member
#3225LED package
#3226Package on package (PoP) bonding structures
#3227Package-on-package semiconductor device
#3228Electronic device and method for production
#3229Semiconductor substrate structure, semiconductor package and method of manufacturing the same
#3230Fan-out interconnect structure and method for forming same
#3231Method of forming contact holes in a fan out package
#3232Semiconductor device and method of manufacturing the same
#3233Package on package architecture and method for making
#3234Multi-stacked electronic device with defect-free solder connection
#3235Current sensor isolation
#3236Nitride semiconductor device
#3237Thermal type flowmeter
#3238Curable resin composition and optical semiconductor device
#3239Electrostatic nozzle, discharge apparatus, and method for manufacturing semiconductor module
#3240Light emitting device and method for manufacturing light emitting device
#3241Semiconductor device and manufacturing method thereof
#3242Integrated circuit package having wirebonded multi-die stack
#3243Semiconductor device and method of forming PoP semiconductor device with RDL over top package
#3244Integrated circuit package
#3245Tunable composite interposer
#3246Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#3247Semiconductor package and mobile device using the same
#3248Chip part and method of making the same
#3249Semiconductor device and method of forming an embedded SoP fan-out package
#3250Lead frames with wettable flanks
#3251Non-vertical through-via in package
#3252Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP
#3253Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package
#3254Electronic package structure having insulated substrate with lands and conductive patterns
#3255Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages
#3256Filter module
#3257Resin sheet for sealing electronic device and method for manufacturing electronic-device package
#3258Method of manufacturing light-emitting device including sealing materials with phosphor particles
#3259Amplifier voltage limiting in radio-frequency devices
#3260Photocoupler having light receiving element, light emitting element and MOSFET on a die pad unit of a mounting member that includes terminals with multiplied conductive regions
#3261Semiconductor module
#3262Alignment structures and methods of forming same
#3263Circuit substrate and method for manufacturing the same
#3264Printed wiring board for package-on-package
#3265Semiconductor device including conductive via with buffer layer at tapered portion of conductive via
#3266Production method for semiconductor element, and semiconductor element
#3267IC module, IC card, and IC module substrate
#3268Light-emitting device and illumination apparatus
#3269Pressing of wire bond wire tips to provide bent-over tips
#3270Signal coupling device
#3271Stacked half-bridge package
#3272Semiconductor package assembly
#3273Fully molded peripheral package on package device
#3274Source down semiconductor devices and methods of formation thereof
#3275Method of manufacturing semiconductor package and semiconductor package
#3276Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivity
#3277Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component
#3278Method for package-on-package assembly with wire bonds to encapsulation surface
#3279Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#3280LED array member and integrated control module assembly with built-in switching converter
#3281Light emitting device, lead frame and resin cavity molding package
#3282Power semiconductor module and composite module
#3283Systems and methods for bonding semiconductor elements
#32843D semiconductor package interposer with die cavity
#3285Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
#3286Packaging devices and methods of manufacture thereof
#3287Method of manufacturing semiconductor device
#3288Semiconductor module with mounting case and method for manufacturing the same
#3289Method of manufacturing semiconductor device and semiconductor device
#3290Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#3291Apparatus and method for inspecting a semiconductor package
#32923D shielding case and methods for forming the same
#3293Hybrid circuit device
#3294LED package with surface textures and methods of formation
#3295Electronic apparatus and method for fabricating the same
#3296Semiconductor package and manufacturing method thereof
#3297Leadless electronic packages for GaN devices
#3298Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#3299Build-up package for integrated circuit devices, and methods of making same
#3300Package structure and methods of forming same