212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Optical coupling device, manufacturing method thereof, and power conversion system
#3302Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals
#3303Shielded EHF connector assemblies
#3304Flip-chip light emitting diode and method for manufacturing the same
#3305Light emitting device package
#3306Light-emitting apparatus
#3307Circuit device and method for the production thereof
#3308Integrated antennas in wafer level package
#3309Antenna on ceramics for a packaged die
#3310Semiconductor device
#3311Chip package structure having a shielded molding compound
#3312Semiconductor device and manufacturing method of same
#3313Substrate having a conductive structure within photo-sensitive resin
#3314Semiconductor package with multi-section conductive carrier
#3315Singulation method for semiconductor package with plating on side of connectors
#3316Method of manufacturing a semiconductor device having scribe lines
#3317Interconnect structure for semiconductor package and method of fabricating the interconnect structure
#3318Semiconductor device
#3319Apparatus for manufacturing semiconductor package and method for manufacturing semiconductor package using the same
#3320Package structures and method of forming the same
#3321Methods for making a multilevel leadframe by etching a conductive sheet from two opposite sides
#3322Amplifier
#3323Magnetically coupled galvanically isolated communication using lead frame
#3324Curable silicone composition, and optical semiconductor device
#3325Method for fabrication of a luminescent structure
#3326Light emitting device
#3327Light-emitting device and method for producing the same
#3328Phosphor in inorganic binder for LED applications
#3329Method of manufacturing semiconductor device
#3330Semiconductor packages and methods of forming the same
#3331Semiconductor device and manufacturing method thereof
#3332Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
#3333Electronic component, semiconductor package, and electronic device using the same
#3334Semiconductor chip package having contact pins at short side edges
#3335Packaged semiconductor device having stacked attached chips overhanging the assembly pad
#3336Methods for forming package-on-package structures having buffer dams
#3337Phosphor having inorganic oxide with cerium and terbium activators, light-emitting device illumination light source, and illumination device using same
#3338TABLET ULTRASOUND SYSTEM
#3339Method for producing light emitting device
#3340Hollow metal pillar packaging scheme
#3341Package-on-package type stack package and method for manufacturing the same
#3342Off substrate kinking of bond wire
#3343Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
#3344Method of manufacturing semiconductor package
#3345Metal layout for radio-frequency switches
#3346Semiconductor substrate and manufacturing method thereof
#3347Semiconductor device
#3348Semiconductor device
#3349Electronic package structure and fabrication method thereof
#3350Sensor system and method for identifying faults related to a substrate
#3351Pulse oximetry devices and systems and methods of making the same
#3352Chip package, package substrate and manufacturing method thereof
#3353Methods for adhesive bonding of electronic devices
#3354Ultraviolet light emitting device
#3355Display light sources with quantum dots
#3356Optoelectronic light-emitting component and leadframe assemblage
#3357Compact opto-electronic modules and fabrication methods for such modules
#3358Semiconductor package including exposed connecting stubs
#3359Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure
#3360Package structure for power converter and manufacture method thereof
#3361Semiconductor packaging and manufacturing method thereof
#3362DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
#3363Semiconductor device and method for manufacturing semiconductor device
#3364Power module and fabrication method for the same
#3365Semiconductor device
#3366Semiconductor device and structure
#3367Device comprising a ductile layer and method of making the same
#3368Systems for adhesive bonding of electronic devices
#3369Package carrier, semiconductor package, and process for fabricating same
#3370Curable silicone composition, cured product thereof, and optical semiconductor device
#3371Electronic package
#3372Electronic package and conductive structure thereof
#3373Power conversion device having two serially-connected switching elements
#3374Light emitting device including a connection wiring
#3375Method of manufacturing a circuit device
#3376Semiconductor device and electronic apparatus of a cascode-coupled system
#3377Multi-chip structure and method of forming same
#3378Package having substrate with embedded metal trace overlapped by landing pad
#3379Package-on-package assembly with wire bonds to encapsulation surface
#3380Manufacturing method of interconnect structure
#3381Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package
#3382Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing
#3383Electronic package
#3384Isolation method for a stand alone high voltage laterally-diffused metal-oxide semiconductor (LDMOS) transistor
#3385Lead portion of semiconductor device
#3386Semiconductor device
#3387Manufacturing method of semiconductor device and semiconductor device
#3388Method of producing a semiconductor package
#3389Semiconductor packages, methods of manufacturing the same, electronic systems including the same, and memory cards including the same
#3390Manufacturing method of semiconductor device
#3391Fingerprint sensor package and method for fabricating the same
#3392Connection pads for a fingerprint sensing device
#3393Semiconductor pressure sensor
#3394Adhesive film and method for manufacturing semiconductor device
#3395Light emitting device
#3396Layered polymer structures and methods
#3397Lighting device with plural fluorescent materials
#3398LED packaging structure having stacked arrangement of protection element and LED chip
#3399Method of manufacturing semiconductor device
#3400Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same
#3401Semiconductor apparatus and manufacturing method for same
#3402Semiconductor package with die paddle
#3403Packaged semiconductor device having leadframe features preventing delamination
#3404Semiconductor device and method for manufacturing the same
#3405Semiconductor device
#3406Semiconductor package with PoP structure and refresh control method thereof
#3407Light-emitting device with sealing member comprising zinc sulfide particles
#3408Method of manufacturing semiconductor device
#3409Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#3410Package with multiple plane I/O structure
#3411Semiconductor apparatus and manufacturing method for same
#3412Package carrier
#3413Semiconductor device
#3414Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
#3415Method of manufacturing a semiconductor device including through silicon plugs
#3416Embedded semiconductive chips in reconstituted wafers, and systems containing same
#3417Power strip and electric power measurement system
#3418Adhesive and light-emitting device
#3419Curable silicone composition, cured product thereof, and optical semiconductor device
#3420Package, light emitting device, and methods of manufacturing the package and the light emitting device
#3421Optoelectronic component and method for the production thereof
#3422Light emitting device
#3423Shaped phosphor to reduce repeated reflections
#3424Light emitting device package having lead electrode with varying thickness
#3425Method of manufacturing light emitting element
#3426Semiconductor light emitting device
#3427Wafer level packaging for proximity sensor
#3428Optical sensor device
#3429Method of manufacturing semiconductor device
#3430Carrier array and light emitting diode package
#3431Chip package-in-package
#3432Functional block stacked 3DIC and method of making same
#3433Packaged semiconductor devices and methods of packaging semiconductor devices
#3434Packaged semiconductor devices having ribbon wires
#3435Semiconductor device
#3436Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof
#3437Electronic device
#3438Stacked chip-on-board module with edge connector
#3439Electronic device having a lead with selectively modified electrical properties
#3440Process for manufacturing a package for a surface-mount semiconductor device and semiconductor device
#3441Chip package and a wafer level package
#3442Electronic devices and methods of manufacturing electronic devices
#3443Thermal interface material layer and package-on-package device including the same
#3444Semiconductor module with reinforcing board
#3445Semiconductor package with cantilever pads
#3446Mold release film and process for producing semiconductor package
#3447Mold release film and process for producing semiconductor package
#3448Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#3449Discrete three-dimensional one-time-programmable memory
#3450Molded proximity sensor
#3451Current sensor
#3452Method of manufacturing fluoride phosphor, white light emitting apparatus, display apparatus, and lighting device
#3453Wafer level package for a MEMS sensor device and corresponding manufacturing process
#3454Architectures for an implantable stimulator device having a plurality of electrode driver integrated circuits with shorted electrode outputs
#3455Dielectric filmless electronic module and method for manufacturing same
#3456Light emitting device
#3457Composite substrate for light emitting diodes
#3458Solution for reducing poor contact in info packages
#3459Solder joint structure for ball grid array in wafer level package
#3460Method of making an electromagnetic interference shield for semiconductor chip packages
#3461Semiconductor package having a metal paint layer
#3462High-temperature cycling BGA packaging
#3463Semiconductor device and method of making the same
#3464Semiconductor device and lead frame having two leads welded together
#3465Semiconductor device and production method therefor
#3466Semiconductor device and its manufacturing method
#3467Integrated circuit with printed bond connections
#3468Making a flat no-lead package with exposed electroplated side lead surfaces
#3469Lighting device
#3470LED flip chip structures with extended contact pads formed by sintering silver
#3471Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#3472Integrated circuit package with probe pad structure
#3473Memory module in a package
#3474Compact semiconductor package and related methods
#3475Semiconductor devices with impedance matching-circuits
#3476EMI/RFI shielding for semiconductor device packages
#3477Semiconductor package, module substrate and semiconductor package module having the same
#3478Power field-effect transistor (FET), pre-driver, controller, and sense resistor integration for multi-phase power applications
#3479Land structure for semiconductor package and method therefor
#3480Integrated circuit (IC) package with a solder receiving area and associated methods
#3481Bond via array for thermal conductivity
#3482Integrated circuit device with shaped leads and method of forming the device
#3483Microelectronic packages having hermetic cavities and methods for the production thereof
#3484Power module and method for manufacturing the same
#3485Structure of battery protection circuit module package coupled with holder, and battery pack having same
#3486Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips
#3487Package apparatus and manufacturing method thereof
#3488Single layer low cost wafer level packaging for SFF SiP
#3489Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
#3490Method of packaging integrated circuits
#3491Semiconductor device
#3492Semiconductor device and manufacturing method for the same
#3493Radio frequency isolation structure with racetrack
#3494Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
#3495Substrate-less stackable package with wire-bond interconnect
#3496Interposer substrate and method of fabricating the same
#3497Interposer substrate and method of fabricating the same
#3498Semiconductor device
#3499Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same
#3500Semiconductor device
#3501Semiconductor package having improved package-on-package interconnection
#3502Method for manufacturing laminate, method for manufacturing sealed substrate laminate, sealed substrate laminate, and sealed substrate
#3503Integrated circuit package pad and methods of forming
#3504Visibility event navigation method and system
#3505Racetrack layout for radio frequency shielding
#3506Reduced-warpage laminate structure
#3507Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit board
#3508Wiring substrate, method of manufacturing the same and electronic component device
#3509Light emitting device mount, leadframe, and light emitting apparatus
#3510Light emitting device and method of manufacturing the same
#3511Method of manufacturing light emitting device
#3512Nanostructure semiconductor light emitting device
#3513Semiconductor device and an electronic device
#3514Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
#3515Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#3516Reduced-warpage laminate structure
#3517Integrated circuit package with embedded bridge
#3518Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication
#3519Semiconductor device and measurement device
#3520Resin-encapsulated semiconductor device and its manufacturing method
#3521Resin package with a groove for an embedded internal lead
#3522Tamper resistant electronic hardware assembly with a non-functional die used as a protective layer
#3523Via structure for packaging and a method of forming
#3524LED assembly and liquid crystal display device including the same
#3525Light emitting diode constructions and methods for making the same
#3526Light emitting device and method for manufacturing the same
#3527Radiation-emitting optoelectronic device
#3528Semiconductor device
#3529Memory devices with controllers under memory packages and associated systems and methods
#3530Semiconductor package and method of forming the same
#3531Semiconductor packages having through electrodes and methods of fabricating the same
#3532Semiconductor packages and fabrication method thereof
#3533Semiconductor chip for sensing temperature and semiconductor system including the same
#3534Semiconductor device and manufacturing method thereof
#3535System and method for an improved fine pitch joint
#3536Semiconductor device and manufacturing method thereof
#3537Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
#3538Semiconductor device and manufacturing method thereof
#3539Semicondutor device and method of manufacture
#3540Display apparatus and method of manufacturing the same
#3541Semiconductor device
#3542LED module
#3543Composite substrate, light emitting device, and method of manufacturing the light emitting device
#3544Thin film light emitting diode
#3545Light-emitting device
#3546Light emitting device and method of manufacturing the same
#3547Ball amount process in the manufacturing of integrated circuit
#3548Semiconductor package and fabrication method thereof
#3549Chip card module arrangement, chip card arrangement and method for producing a chip card arrangement
#3550Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)
#3551Package structure and fabrication method thereof
#3552Power module and fabrication method for the same
#3553Method for manufacturing semiconductor device
#3554Printed circuit board and semiconductor package
#3555Electronic component, electronic module, manufacturing method therefor, and electronic apparatus
#3556Methods of fabricating an electronic package structure
#3557Radio-frequency devices with gate node voltage compensation
#3558Semiconductor device, semiconductor device package, and lightning apparatus
#3559Light emitting device package and light system including the same
#3560Fluoride phosphor and light emitting device, and methods of manufacturing the same
#3561SMD type LED package device, method for manufacturing the same, and light-emitting apparatus
#3562Lighting emitting diode with light extracted from front and back sides of a lead frame
#3563Reliability improvement of polymer-based capacitors by moisture barrier
#3564Semiconductor light emitting device and semiconductor light emitting device package including the same
#3565Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line
#3566Light emitting diode (LED) components and methods
#3567Electronic circuit comprising PN junction and schottky barrier diodes
#3568Semiconductor device including an embedded surface mount device and method of forming the same
#3569Wafer-level stack chip package and method of manufacturing the same
#3570Semiconductor device
#3571Semiconductor device
#3572Chip using triple pad configuration and packaging method thereof
#3573Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus
#3574Method for manufacturing semiconductor device, and semiconductor device
#3575Mold package and manufacturing method thereof
#3576Packaged semiconductor devices and methods of packaging semiconductor devices
#3577Underfill dispensing in 3D IC using metrology
#3578Method of manufacturing a semiconductor device
#3579Method of manufacturing semiconductor device
#3580System and method for an improved interconnect structure
#3581Circuit carrier, method for producing a circuit carrier, method for producing a circuit arrangement, method for operating a circuit arrangement and method for producing a semiconductor module
#3582Transfer mold type sensor device
#3583P-n separation metal fill for flip chip LEDs
#3584Light emitting device and adaptive driving beam headlamp system
#3585LED and LED packaging method thereof
#3586Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip
#3587Integrated fan-out structure and method
#3588Package including a semiconductor die and a capacitive component
#3589Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#3590Thermo-compression bonding system, subsystems, and methods of use
#3591Chip assemblage, press pack cell and method for operating a press pack cell
#3592Semiconductor device
#3593Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods of manufacturing the semiconductor device
#3594Semiconductor device and method of manufacturing semiconductor device
#3595Semiconductor device
#3596Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor module
#3597Method for making an anti-crack electronic device
#3598Oxynitride phosphor powder
#3599Method for producing a pulverulent precursor material, pulverulent precursor material, and use of pulverulent precursor material
#3600SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern