212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Memory devices with controllers under memory packages and associated systems and methods
#2702Electronic package having a supporting board and package carrier thereof
#2703Flip-chip on leadframe having partially etched landing sites
#2704Flex circuit for accessing pins of a chip carrier
#2705MEMS grid for manipulating structural parameters of MEMS devices
#2706Semiconductor light-emitting device, method for producing same, and display device
#2707Method of manufacturing semiconductor device
#2708Semiconductor device
#2709Semiconductor device, package, and vehicle
#2710Flat no-lead packages with electroplated edges
#2711Semiconductor device and method for manufacturing semiconductor device
#2712Thermally conductive sheet and semiconductor device
#2713Substrate structures and methods of manufacture
#2714Semiconductor device
#2715Semiconductor device with frame having arms and related methods
#2716Semiconductor device and method of manufacturing thereof
#2717Method for fabricating stack die package
#2718Light emitting device
#2719Light-emitting element and light-emitting diode
#2720Stackable molded microelectronic packages
#2721Semiconductor packages including molded stacked die with terrace-like edges
#2722Semiconductor package including a device and lead frame used for the same
#2723Adhesive film and semiconductor package using adhesive film
#2724Semiconductor Devices Having Insulating Substrates and Methods of Formation Thereof
#2725Semiconductor device and method of manufacturing the same
#2726Reduced-warpage laminate structure
#2727Semiconductor chip package comprising side wall marking
#2728Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure
#2729Coated narrow band red phosphor
#2730Single-package wireless communication device
#2731Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#2732Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#2733Semiconductor package and manufacturing method thereof
#2734Semiconductor chip mounted on a packaging substrate
#2735Semiconductor device with a gap control electrode and method of manufacturing the semiconductor device
#2736Printed circuit board
#2737Radiation-hard electronic device and method for protecting an electronic device from ionizing radiation
#2738Semiconductor package and method of manufacturing the same
#2739Encapsulated semiconductor package and method of manufacturing thereof
#2740Thermally conductive structure for heat dissipation in semiconductor packages
#2741Semiconductor device, corresponding methods of production and use and corresponding apparatus
#2742Interface board, a multichip package (MCP) test system including the interface board, and an MCP test method using the MCP test system
#2743Method for fabricating an electronic device and a stacked electronic device
#2744Solid-state imaging device, manufacturing method thereof, and electronic apparatus
#2745Three-dimensional package structure
#2746Semiconductor device
#2747Semiconductor device and method of controlling warpage in reconstituted wafer
#2748Pad structure design in fan-out package
#2749Semiconductor device
#2750Semiconductor device and a method of making a semiconductor device
#2751Leadless semiconductor packages, leadframes therefor, and methods of making
#2752Semiconductor device and method of using a standardized carrier in semiconductor packaging
#2753Circuit package with internal and external shielding
#2754Frame elements for package structures comprising printed circuit boards (PCBs)
#2755Packaged electronic device having integrated antenna and locking structure
#2756Light emitting device mount, leadframe, and light emitting apparatus
#2757Chip-stacked semiconductor package and method of manufacturing the same
#2758Semiconductor device with discrete blocks
#2759Semiconductor package
#2760Coated bond wires for die packages and methods of manufacturing said coated bond wires
#2761Metal pad for laser marking
#2762Power management application of interconnect substrates
#2763Semiconductor package with coated bonding wires and fabrication method thereof
#2764Wavelength conversion member, molded body, wavelength conversion apparatus, sheet member, light emitting apparatus, light guide apparatus and display apparatus
#2765Electronic device having a bonding wire connected to a terminal at an alloyed portion
#2766Light-emitting device package having a device to prevent permeation of foreign substances
#2767Light emitting device
#2768Semiconductor packages and methods of forming the same
#2769Solderless interconnection structure and method of forming same
#2770Circuit package with segmented external shield to provide internal shielding between electronic components
#2771Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use
#2772Semiconductor device and package including solder bumps with strengthened intermetallic compound
#2773Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
#2774Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium
#2775Leadframe package with pre-applied filler material
#2776Semiconductor chip module and semiconductor package including the same
#2777Method for producing optical semiconductor device and optical semiconductor device
#2778Light-emitting device, integrated light-emitting device, and light-emitting module
#2779Integrated circuit package
#2780Material layer stack, light emitting element, light emitting package, and method of fabricating light emitting element
#2781Offset-printing method for three-dimensional package
#2782Offset-printing method for three-dimensional printed memory with multiple bits-per-cell
#2783Semiconductor structure and manufacturing method thereof
#2784Optocoupler with indication of light source power supply failure
#2785Integrated device comprising embedded package on package (PoP) device
#2786Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
#2787Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
#2788Configurable routing for packaging applications
#2789Functionalized interface structure
#2790Die attachment for packaged semiconductor device
#2791Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#2792LED package structure and manufacturing method thereof
#2793Semiconductor die connection system and method
#2794Integrated fan-out structure and method of forming
#2795Semiconductor device
#2796Method for producing fluoride fluorescent material
#2797MEMS grid for manipulating structural parameters of MEMS devices
#2798Offset-printing method for three-dimensional printed memory
#2799Semiconductor package assemblies with system-on-chip (SOC) packages
#2800Compact semiconductor package and related methods
#2801Semiconductor package embedded with a plurality of chips
#2802Semiconductor device and production method therefor
#2803Backside redistribution layer (RDL) structure
#2804Warpage control in package-on-package structures
#2805Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
#2806Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
#2807Semiconductor device and metering apparatus
#2808Optical fingerprint sensor package
#2809Active optical component with passive optical component and encapsulant for an optical device and electrical device including the same
#2810Wavy interconnect for bendable and stretchable devices
#2811Acoustic wave device and method of manufacturing the same
#2812Production of optoelectronic components
#2813Light-emitting device package containing oxynitride-based phosphor and lighting apparatus containing same
#2814Semiconductor light-emitting device
#2815Method of fabricating semiconductor light emitting device
#2816Laser marking in packages
#2817Method for manufacturing semiconductor package
#2818System-level packaging structures
#2819Fully molded miniaturized semiconductor module
#2820Semiconductor device, embedded capacitor unit, semiconductor package, and method of manufacturing embedded capacitor unit
#2821Low cost hybrid high density package
#2822Semiconductor device having terminals directly attachable to circuit board
#2823Power overlay structure and method of making same
#2824Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
#2825Oxynitride phosphor, manufacturing method therefor, and light emitting device package using same
#2826Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device
#2827Wiring board, electronic device, and electronic module
#2828Light-emitting element package
#2829Non-volatile memory and devices that use the same
#2830Light emitting diodes, components and related methods
#2831Warpage control of semiconductor die package
#2832Wafer-level packaging using wire bond wires in place of a redistribution layer
#2833Semiconductor package and method of forming the same
#2834Conductive contacts having varying widths and method of manufacturing same
#2835Semiconductor package
#2836System on package (SoP) having through silicon via (TSV) interposer with memory controller connected to multiple printed circuit boards (PCB)
#2837Flexible device including sliding interconnection structure
#2838Printed circuit board and semiconductor packages including the same
#2839Acoustic wave device and method of manufacturing the same
#2840Power converter package with integrated output inductor
#2841Integrated circuit (IC) package comprising electrostatic discharge (ESD) protection
#2842Semiconductor device, intelligent power module and power conversion apparatus
#2843Method of manufacturing light emitting device
#2844Light-emitting diode (LED), LED package and apparatus including the same
#2845Light-emitting device
#2846Semiconductor device packages, packaging methods, and packaged semiconductor devices
#2847Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#2848Production of optoelectronic components
#2849Method for manufacturing wire bonding structure, wire bonding structure, and electronic device
#2850Electronic apparatus and method for fabricating the same
#2851Semiconductor device and manufacturing method thereof
#2852Semiconductor packaging and manufacturing method thereof
#2853Semiconductor device
#2854Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the same
#2855Semiconductor device
#2856Memory system
#2857Quantum dot, quantum dot film and LED package and display device including the same
#2858Quantum dot, quantum dot film and LED package and display device including the same
#2859Light emitting device
#2860Light emitting device package assembly and method of fabricating the same
#2861Back-to-back stacked dies
#2862Semiconductor device having wire formed with loop portion and method for producing the semiconductor device
#2863Semiconductor device
#2864Electronic device and method of making same
#2865Packaged device with additive substrate surface modification
#2866Thermal dissipation through seal rings in 3DIC structure
#2867Methods for producing semiconductor devices
#2868Packaged semiconductor device having leadframe features preventing delamination
#2869Proximity sensor and manufacturing method therefor
#2870Semiconductor devices and semiconductor packages including magnetic shielding layers and methods of manufacturing semiconductor devices and semiconductor packages
#2871Optoelectronic device and method for producing an optoelectronic device
#2872Method for fabricating glass substrate package
#2873Semiconductor device and manufacturing method thereof
#2874Semiconductor devices with through electrodes and methods of fabricating the same
#2875Semiconductor device
#2876Packaged semiconductor chips having heat dissipation layers and ground contacts therein
#2877Thermosetting resin molded article
#2878Three-dimensional one-time-programmable memory comprising off-die address/data-translator
#2879LED module having LED element connected to metal layer exposed by opening in multi-layer resist
#2880Surface-modified phosphor and light emitting device
#2881LED assembly
#2882Red phosphor, white light emitting device and lighting apparatus
#2883Semiconductor light emitting device
#2884LED module with multi-layer resist
#2885Chip on chip attach (passive IPD and PMIC) flip chip BGA using new cavity BGA substrate
#2886Method of manufacturing a semiconductor package
#2887Optical coupling device
#2888Electronic package and fabrication method thereof
#2889Method of assembly semiconductor device with through-package interconnect
#2890Method for producing a light emitting device
#2891Package on-package method
#2892Semiconductor device having through silicon vias and manufacturing method thereof
#2893Devices and methods of packaging semiconductor devices
#2894Three dimensional integrated circuits stacking approach
#2895Integrated fan-out package structures with recesses in molding compound
#2896Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
#2897Through package via (TPV)
#2898Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
#2899Semiconductor device
#2900Substrate structure with selective surface finishes for flip chip assembly
#2901Semiconductor package having a substrate structure with selective surface finishes
#2902Semiconductor package and method of forming the same
#2903Semiconductor device and manufacturing method thereof
#2904Method of fabricating integrated circuits having a recessed molding package and corresponding package
#2905Integrated circuits protected by substrates with cavities, and methods of manufacture
#2906Lead frame and semiconductor device
#2907EMI shielding composition and process for applying it
#2908Contactless communication unit connector assemblies with signal directing structures
#2909Semiconductor module
#2910Optoelectronic component and method of production thereof
#2911Portable light-emitting device without pre-stored power sources and LED package structure thereof
#2912Stacked die integrated circuit
#2913Semiconductor device having conductive shield layer
#2914Multi-chip package having encapsulation body to replace substrate core
#2915Printed interconnects for semiconductor packages
#2916Semiconductor devices and methods of forming thereof
#2917Packaging devices and methods of manufacture thereof
#2918Resin-encapsulated semiconductor device and its manufacturing method
#2919Semiconductor leadframes and packages with solder dams and related methods
#2920Semiconductor device and method for manufacturing the same
#2921Semiconductor device
#2922Semiconductor package
#2923Semiconductor device and method comprising redistribution layers
#2924Methods for controlling warpage in packaging
#2925Stacked-die MEMS resonator system
#2926Transistors having offset contacts for reduced off capacitance
#2927Interconnect structure for package-on-package devices and a method of fabricating
#2928Forming recesses in molding compound of wafer to reduce stress
#2929Package on-package (PoP) structure including stud bulbs
#2930Microelectronic element with bond elements to encapsulation surface
#2931Electric magnetic shielding structure in packages
#2932Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same
#2933Shielded module having compression overmold
#2934Semiconductor module and method of manufacturing semiconductor module
#2935Resin-encapsulatd semiconductor device and method of manufacturing the same
#2936Semiconductor device manufacturing method
#2937LED-based light source utilizing asymmetric conductors
#2938Integrated RF front end system
#2939Electronic device module and method of manufacturing the same
#2940Semiconductor device comprising PN junction diode and Schottky barrier diode
#2941Electronic component device and manufacturing method thereof
#2942Semiconductor device and method of manufacture
#2943Semiconductor structure and manufacturing method thereof
#2944Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#2945Shaped lead terminals for packaging a semiconductor device for electric power
#2946Integrated power module
#2947Semiconductor device
#2948Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same
#2949Semiconductor device
#2950Releasable carrier and method
#2951Capacitor sensor structure, circuit board structure with capacitor sensor, and package structure of capacitive sensor
#2952Multi-stacked electronic device with defect-free solder connection
#2953Light-emitting apparatus and light-emitting module including the same
#2954Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules
#2955Integrated fan-out structure with openings in buffer layer
#2956Embedded die-down package-on-package device
#2957Electronic apparatus and method for fabricating the same
#2958Semiconductor packages with thermal-enhanced conformal shielding and related methods
#2959Thin recon interposer package without TSV for fine input/output pitch fan-out
#2960Semiconductor device and method of manufacturing the same
#2961Semiconductor device with lead terminals having portions thereof extending obliquely
#2962Thermally conductive sheet and semiconductor device
#2963Semiconductor package device and manufacturing method thereof
#2964Semiconductor device
#2965Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad
#2966Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP
#2967Smart pixel surface mount device package
#2968Devices and methods related to high power diode switches with low DC power consumption
#2969Stabilized quantum dot structure and method of making a stabilized quantum dot structure
#2970Optoelectronic component and method of producing an optoelectronic component
#2971Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#2972Method for manufacturing semiconductor device
#29733DIC stacking device and method of manufacture
#2974Chip package
#2975Semiconductor integrated circuit device
#2976Package structure
#2977Semiconductor device, semiconductor device manufacturing method and semiconductor device mounting structure
#2978Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure
#2979Packaging structure, packaging method and template used in packaging method
#2980Method for manufacturing semiconductor device
#2981Method for manufacturing a chip arrangement including a ceramic layer
#2982Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same
#2983Molding type power module
#2984Proximity sensing using EHF signals
#2985Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods
#2986Power amplifier modules with harmonic termination circuit and related systems, devices, and methods
#2987Light-emitting device and method of manufacturing same
#2988Semiconductor device that facilitates a reduction in the occurrences of cracking in a semiconductor layer accompanying thermal stress
#2989Molded semiconductor package
#2990Semiconductor device having recessed edges and method of manufacture
#2991Die package with low electromagnetic interference interconnection
#2992Die packaging with fully or partially fused dielectric leads
#2993Semiconductor device and manufacturing method thereof
#2994Semiconductor device and method of manufacture thereof
#2995Power amplifier modules with power amplifier and transmission line and related systems, devices, and methods
#2996Semiconductor package in package
#2997Integrated circuit package substrate
#2998Semiconductor package with small gate clip and assembly method
#2999Power semiconductor package device having locking mechanism, and preparation method thereof
#3000Method for making semiconductor device with sidewall recess and related devices