Package frame and method of manufacturing semiconductor package using the same

Semiconductor package with dual second level electrical interconnections

Semiconductor device and measurement device

Light emitting device, package, and methods of manufacturing the same

Method of manufacturing light emitting diode package

Light emitting device package and light emitting apparatus including the package

Mechanisms for forming package structure

Semiconductor packages including upper and lower packages and heat dissipation parts

Die attachment for packaged semiconductor device

Interconnect structures and methods of forming same

Semiconductor package

Lead frame and manufacturing method of lead frame

Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic device

Power module and method of packaging the same

Package with metal-insulator-metal capacitor and method of manufacturing the same

Method of forming metal pads with openings in integrated circuits including forming a polymer plug extending into a metal pad

Interconnect structure for wafer level package

Memory systems including an input/output buffer circuit

Light-emitting device

Radical polymerizable adhesive composition and method of producing electrical connection body

Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same

Package assembly and method for manufacturing the same

Electronic module having an electrically insulating structure with material having a low modulus of elasticity

Electronic module and the fabrication method thereof

Lighting system

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

3D packages and methods for forming the same

Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof

Semiconductor device with discrete blocks

Package on package structure and method for forming the same

Semiconductor device with a plate-shaped lead terminal

Power semiconductor module and method for manufacturing the same

Semiconductor package

Electronic device with first and second contact pads and related methods

Semiconductor component having inner and outer semiconductor component housings

Semiconductor module, semiconductor device, and vehicle

Packaged semiconductor devices and packaging methods thereof

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Substrate for semiconductor package and process for manufacturing

Power converter package with integrated output inductor

Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip

Patterned lead frame

Electronic device and method for manufacturing same

Power semiconductor device

Electronic module and method for producing an electronic module

IC module, dual IC card, and method for manufacturing IC module

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Optoelectronic semiconductor component

Light-emitting dies incorporating wavelength-conversion materials and related methods

Embedded package and method thereof

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Circuit substrate interconnect

Semiconductor package and method of manufacturing the same

Semiconductor stack packages

Integrated circuit devices having through-silicon vias and methods of manufacturing such devices

Chip package and method for forming the same

Package-on-Package with via on pad connections

Semiconductor packages and modules with integrated ferrite material

Phosphor, production method for same, light-emitting device, image display device, pigment, and ultraviolet absorber

Semiconductor device

Light emitting diode package having series connected LEDs

Optoelectronic component and method of production thereof

Light emitting device having first and second wavelength converter parts

Package-on-package structures

Semiconductor device

Package-on-package Structure

Power module with a plurality of patterns with convex and concave side

Semiconductor device and method comprising redistribution layers

Semiconductor package having metal layer

Semiconductor device

Semiconductor package with small gate clip and assembly method

Packaged device with additive substrate surface modification

Semiconductor device

Integration of backside heat spreader for thermal management

Substrate for alternative semiconductor die configurations

Printed interconnects for semiconductor packages

Light-emitting module

Fluoride fluorescent material, method for producing the same, and light emitting device

Packages for semiconductor devices and methods for assembling same

Package arrangement, a package, and a method of manufacturing a package arrangement

Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

Packaged RF amplifier devices with grounded isolation structures and methods of manufacture thereof

Semiconductor light-emitting device, method for producing same, and display device

Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

Wafer-level flip chip device packages and related methods

Wafer-level flip chip device packages and related methods

Light emitting device

Self-aligned floating mirror for contact vias

Method of manufacturing a LED package structure for preventing lateral light leakage

Semiconductor device and method of manufacturing the same

Light emitting device

Semiconductor package and method of manufacturing the semiconductor package

Three dimensional integrated circuits stacking approach

Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same

Semiconductor devices and methods of manufacture thereof

Semiconductor device

Electronic device module and method of manufacturing the same

Method for manufacturing a resin-encapsulated semiconductor device

Semiconductor device and method of adaptive patterning for panelized packaging

Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure

Pressure application apparatus and pressure application method

Wiring substrate and light emitting device

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Light emitting apparatus and lighting apparatus

Light emitting device including light emitting element with phosphor

Semiconductor device manufacturing method and semiconductor device

Semiconductor package assemblies with system-on-chip (SOC) packages

BVA interposer

Wafer process for molded chip scale package (MCSP) with thick backside metallization

Semiconductor device having a die and through-substrate via

Semiconductor device including protective film over a substrate

Semiconductor package including an embedded surface mount device and method of forming the same

Semiconductor package

Semiconductor module and semiconductor device

Semiconductor device

Inter-connection of a lead frame with a passive component intermediate structure

Semiconductor device and manufacturing method for same

Single or multi chip module package and related methods

Optical lens, light emitting device, and lighting device having the same

Devices and methods related to metallization of ceramic substrates for shielding applications

Power conversion device

Package and light-emitting device

LED packages with chips having insulated surfaces

Three-dimensional chip-to-wafer integration

Package structures and methods of forming

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device and manufacturing method thereof

Integrated circuit package fabrication with die attach paddle having middle channels

LED lighting apparatus

Packaged semiconductor devices and methods of packaging thereof

Patterned grounds and methods of forming the same

Integrated circuit with electromagnetic communication

Semiconductor device package and methods of packaging thereof

Integrating multi-output power converters having vertically stacked semiconductor chips

Semiconductor device including semiconductor chips stacked over substrate

Intramodule radio frequency isolation

Multi-chip silicon substrate-less chip packaging

Wiring substrate and method for manufacturing wiring substrate

Integrating multi-output power converters having vertically stacked semiconductor chips

Semiconductor package having routing traces therein

Embedding additive particles in encapsulant of electronic device

Method of manufacturing a semiconductor device and inspecting an electrical characteristic thereof using socket terminals

Semiconductor device

Inorganic phosphor, manufacture thereof, light-emitting device, and image display utilizing inorganic phosphor

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Light emitting device package

High efficiency module

Method of manufacturing semiconductor device

Semiconductor packages with a substrate between a pair of substrates

Integrated circuit with on-die decoupling capacitors

Temporary bonding scheme

Method of manufacturing a package-on-package type semiconductor package

Method for making a microelectronic assembly having conductive elements

Semiconductor packages and methods of forming the same

Semiconductor device

Electronic device and semiconductor package with thermally conductive via

Semiconductor device and metering apparatus

Flexible LED device with wire bond free die

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Semiconductor device and method of manufacturing the same

Wire bond sensor package

Method of manufacturing a semiconductor device having bit line structures disposed in trenches

Multiple bond via arrays of different wire heights on a same substrate

Packages and methods of manufacture thereof

Radio frequency module including segmented conductive ground plane

Method for manufacturing ceramic substrate

Thin plastic leadless package with exposed metal die paddle

Systems and methods for thermal dissipation

Radio frequency module including segmented conductive top layer

Multi-stacked electronic device with defect-free solder connection

Via density in radio frequency shielding applications

Photocoupling device manufacturing method, photocoupling device, and power conversion system

Light emitting device package

High power light emitting device and method of making the same

Sensor package with exposed sensor array and method of making same

Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure

Nitride phosphor and method for producing the same

Heat dissipation solution for advanced chip packages

High-frequency component and high-frequency module including the same

Package on package and a method of fabricating the same

Interposer substrate and method for fabricating the same

Light emitting device and method for manufacturing light emitting device

Package on package devices and methods of packaging semiconductor dies

Stack packages and methods of manufacturing the same

Miniaturized SMD diode package and process for producing the same

Method of manufacturing electronic device

Semiconductor device and method of manufacturing the same

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Semiconductor package on package structure and method of forming the same

Support member, wiring substrate, method for manufacturing wiring substrate, and method for manufacturing semiconductor package

Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure

Semiconductor package having etched foil capacitor integrated into leadframe

Semiconductor device, and method for assembling semiconductor device

Electronic component with a leadframe

Method for forming package systems having interposers

Carrier system for processing semiconductor substrates, and methods thereof

Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3D integrated circuits

Memory controller, method thereof, and electronic devices having the memory controller

Light emitting device package and display device including the same

Semiconductor device

Solder layer of a semiconductor chip arranged within recesses

Semiconductor packages having EMI shielding layers, methods of fabricating the same, electronic systems including the same, and memory cards including the same

Stacked synchronous buck converter having chip embedded in outside recess of leadframe

Semiconductor device and lead frame used for the same

Semiconductor die connection system and method

Wafer level flat no-lead semiconductor packages and methods of manufacture

Method for manufacturing semiconductor device

Lighting devices with illumination regions having different gamut properties

SMD, IPD, and/or wire mount in a package

Light emitting device and method for manufacturing the same

Optical semiconductor structure for emitting light through aperture

Metal insulator metal capacitor and method for making the same

Functional spacer for SIP and methods for forming the same

Wire bond mold lock method and structure

Offset contacts for reduced off capacitance in transistor switches

Semiconductor device

Method for reducing cross contamination in integrated circuit manufacturing

Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet

Adhesive composition, adhesive sheet and production process for semiconductor device

Light-emitting apparatus

Light emitting device having surface-modified luminophores

Method of manufacturing nanostructure semiconductor light emitting device

Package-on-package structure and methods for forming the same

Thermally enhanced package-on-package structure

Integrated fan-out package structures with recesses in molding compound

Electronic device

Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics

Device with pillar-shaped components

Pad design for reliability enhancement in packages

Electronic device

Semiconductor device and method of manufacturing the same

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Methods of fabricating QFN semiconductor package and metal plate

Lead frame with anchor-shaped lead

Heat conductive insulating sheet, power module, and manufacturing method thereof

Photocoupler

Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate

Sensor and method for producing a sensor

Fluorescent material and light emitting device using same and method for manufacturing fluorescent material

Power semiconductor device and power conversion device

Chip capacitors

Electronic device and mounting structure of the same

Electronic device module and method of manufacturing the same

Circuit substrate and method for manufacturing the same

White light emitting diode, manufacturing method and packaging material thereof

Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same

Integrated system and method of making the integrated system

Semiconductor device

Semiconductor device with face-to-face chips on interposer and method of manufacturing the same

Semiconductor package for thermal dissipation

Semiconductor device and method for making semiconductor device

Semiconductor device with metal film and method for manufacturing semiconductor device with metal film

Semiconductor device and method for manufacturing same

Wiring substrate

Printed circuit board for semiconductor package

Matrix lid heatspreader for flip chip package

Method of fabricating semiconductor package, semiconductor chip supporting carrier and chip mounting device

Packaging structural member

Ultra-thin power transistor and synchronous buck converter having customized footprint

Lighting device and LED luminaire

Power semiconductor module

Printed circuit board and package substrate

Substrate and method for manufacturing semiconductor package

Batwing LED with remote phosphor configuration

Phosphor, manufacturing method therefor, and light-emitting device using the phosphor

Phosphor, manufacturing method thereof, and light-emitting device using the phosphor

Semiconductor device

Red flip chip light emitting diode, package, and method of making the same

Fan-out package structure and methods for forming the same

Universal surface-mount semiconductor package

Semiconductor device having low on resistance

Multiple bond via arrays of different wire heights on a same substrate

Surface finish for wirebonding

Method of forming a component having wire bonds and a stiffening layer

Semiconductor device

Semiconductor package

Embedded semiconductor device package and method of manufacturing thereof

Semiconductor packages and methods of packaging semiconductor devices

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Methods of packaging semiconductor devices and packaged semiconductor devices

Thermally enhanced structure for multi-chip device

Glass/ceramic replacement of epoxy for high temperature hermetically sealed non-axial electronic packages

Substrate design with balanced metal and solder resist density

Method of manufacturing semiconductor package including forming a recessed region in a substrate

Semiconductor device

LED array member and integrated control module assembly having active circuitry

Curable silicone composition, cured product thereof, and optical semiconductor device

Method of making a system-in-package device, and a system-in-package device

Electronic device and method for manufacturing the same

Wiring board, and electronic device

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Optoelectronic semiconductor chip encapsulated with an ALD layer and corresponding method for production

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Semiconductor device with a heat-dissipating plate

Package structure and fabrication method thereof

High-voltage energy storage module and method for producing the high-voltage energy storage module

LED package with red-emitting phosphors

Bonding package components through plating