Semiconductor chip assembly and method for manufacturing the same

Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping

Method of manufacturing semiconductor package

Bridge interconnection with layered interconnect structures

Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers

Package substrate and flip-chip package circuit including the same

Stackable molded microelectronic packages

Pad design for reliability enhancement in packages

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Methods of packaging semiconductor devices and structures thereof

Power module semiconductor device

Quad flat no lead package and method of making

Extremely thin package

Rare earth aluminum garnet-type inorganic oxide, phosphor and light-emitting device using same

Electron beam curable resin composition, reflector resin frame, reflector, semiconductor light-emitting device, and molded article production method

Reflecting resin sheet, light emitting diode device and producing method thereof

Engineered-phosphor LED packages and related methods

Method for producing a plurality of optoelectronic components and optoelectronic component

Method of forming package-on-package (PoP) structure having a chip package with a plurality of dies attaching to first side of an interposer with a die formed thereon

Package-on-package semiconductor device

Methods of packaging semiconductor devices and packaged semiconductor devices

Bump structure and method of forming same

Methods, circuits and systems for a package structure having wireless lateral connections

Semiconductor package

Packaged semiconductor devices and packaging devices and methods

Integrated interposer solutions for 2D and 3D IC packaging

Semiconductor device

Integrated electronic package and method of fabrication

Combined packaged power semiconductor device

3D packages and methods for forming the same

Method for manufacturing semiconductor device

Method of making integrated circuit

Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesive

LED device and coating liquid used for production of same

Method for producing an electronic assembly

Semiconductor package

Lighting fixture providing variable CCT

Bandwidth limiting methods for GaN power transistors

Light emitting device with an adhered heat-dissipating structure

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Light emitting device module

Submount based light emitter components and methods

LED light source packaging method, LED light source package structure and light source module

Process for forming package-on-package structures

Package on-package with cavity in interposer

Systems and methods for bonding semiconductor elements

LED module and LED module packaging structure

Semiconductor device

Package in package (PiP) electronic device and manufacturing method thereof

Semiconductor package with trace covered by solder resist

Microelectronic packages having radio frequency stand-off layers

Ring structures in device die

Metal pad for laser marking

Method for making semiconductor device with lead frame made from top and bottom components and related devices

Over-mold plastic packaged wide band-gap power transistors and MMICS

Over-mold packaging for wide band-gap semiconductor devices

Power semiconductor package with multi-section conductive carrier

Three-dimensional stack of leaded package and electronic member

Semiconductor device and method for manufacturing the same

Semiconductor device with encapsulated lead frame contact area and related methods

Connectable package extender for semiconductor device package

Direct/laminate hybrid encapsulation and method of hybrid encapsulation

Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device

Lead frame based MEMS sensor structure

Light emitting device and method of manufacturing the same

Integrated RF front end system

Package of finger print sensor and fabricating method thereof

Image sensor package

Method of manufacturing a multichip package structure

Light emitting device having wavelength converting layer

Structure of a semiconductor array

Integrated circuit package assembly

Semiconductor device

Semiconductor device including plural semiconductor chips stacked on substrate

Printed wiring board, semiconductor package, and method for manufacturing printed wiring board

Molded chip package and method of manufacturing the same

Multi chip package and method for manufacturing the same

Fabrication method of package having ESD and EMI preventing functions

Smart card module, smart card, and method for producing a smart card module

Wiring board and electronic device

Electronic component module

Semiconductor device and automobile

Solid state photomultipliers array of enhanced fill factor and simplified packaging

Semiconductor device

Optical semiconductor lighting apparatus

Semiconductor device including filling material provided in space defined by three semiconductor chips

Semiconductor device with mechanical lock features between a semiconductor die and a substrate

Interconnect structure with improved conductive properties and associated systems and methods

Packaging substrate and package structure

Semiconductor package

Metal base substrate, power module, and method for manufacturing metal base substrate

Memory device comprising programmable command-and-address and/or data interfaces

Method of manufacturing a multichip package structure

Circuit assemblies with multiple interposer substrates, and methods of fabrication

Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system

Power amplifier modules with bifet and harmonic termination and related systems, devices, and methods

Power amplifier modules including bipolar transistor with grading and related systems, devices, and methods

Power amplifier modules including wire bond pad and related systems, devices, and methods

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Lighting device

Semiconductor device including sense insulated-gate bipolar transistor

Chip package and method for forming the same

Package structure and method for fabricating the same

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Chip package and method for forming the same

Method for interconnecting stacked semiconductor devices

Devices and methods for processing singulated radio-frequency units

Conductive contacts having varying widths and method of manufacturing same

Semiconductor device

Electronic device module and manufacturing method thereof

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor package and fabrication method thereof and carrier structure

Semiconductor device and a manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device with notched main lead

Semiconductor device with step portion having shear surfaces

Semiconductor device having a cooling body with a groove

Flexible microelectronic systems and methods of fabricating the same

Thermal airflow sensor

Devices and systems comprising drivers for power conversion circuits

Method of forming wafer-level molded structure for package assembly

Stacked dies with wire bonds and method

Semiconductor package and method of manufacturing the same

Semiconductor device

Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure

Apparatus and method for chip placement and molding

Integrated circuit package substrate

Substrate, semiconductor package thereof and process of making same

DC-DC converter having terminals of semiconductor chips directly attachable to circuit board

Semiconductor package

Substrate pad structure

Structure, electronic element module, heat exchanger, fuel rod, and fuel assembly

Process for preparing red-emitting phosphors

Process for preparing red-emitting phosphors

Hot-melt type curable silicone composition for compression molding or laminating

LED luminescence apparatus and method of driving the same

Low forward voltage rectifier

Solid state lighting devices incorporating notch filtering materials

Semiconductor device and method of fabricating semiconductor device

Method of manufacturing stacked semiconductor package

Stacked semiconductor die assemblies with die support members and associated systems and methods

Stacked semiconductor die assemblies with support members and associated systems and methods

Method of manufacturing a carrier tape

Binding wire and semiconductor package structure using the same

Semiconductor device and method of forming bump-on-lead interconnection

Semiconductor package with switch node integrated heat spreader

Low-profile footed power package

Nonvolatile memory device having authentication, and methods of operation and manufacture thereof

High CRI solid state lighting devices with enhanced vividness

Light-emitting device, illumination light source, and illumination device

Sensor apparatus and method for producing a sensor apparatus

Integrated circuit package including miniature antenna

Light-emitting device, light-emitting device package, and light unit

Integrated circuit package and method of forming the same

Package structure with direct bond copper substrate

Zero stand-off bonding system and method

Warpage reduction and adhesion improvement of semiconductor die package

Apparatus and method for electrostatic spraying or electrostatic coating of a thin film

Power management applications of interconnect substrates

Through polymer via (TPV) and method to manufacture such a via

Chip-scale packaging with protective heat spreader

Semiconductor apparatus including a heat dissipating member

Method of fabricating a semiconductor package

Method of fabricating a packaging substrate including a carrier having two carrying portions

Passive device substrate

Single package dual channel memory with co-support

Resin composition and method for manufacturing the same

Method of protecting microelectro mechanical system device

Sensor package having stacked die

Biocompatible packaging

Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide

Semiconductor device having semiconductor element bonded to base body by adhesive member

Semiconductor device having fin-type active patterns and gate nodes

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor devices and methods of making semiconductor devices

Packages and packaging methods for semiconductor devices, and packaged semiconductor devices

Semiconductor device

Semiconductor device and production method for same

Module comprising a semiconductor chip

Quad flat no-lead package and manufacturing method thereof

Combined QFN and QFP semiconductor package

Semiconductor device

Integrated circuit module for a dual-interface smart card

Phosphor, phosphor-containing composition and light-emitting unit using phosphor, and image display device and lighting device using light-emitting unit

Composition of a solder, and method of manufacturing a solder connection

Electronic device module and manufacturing method thereof

Method for making a sensor device using a graphene layer

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Packages with metal line crack prevention design

Semiconductor sensor device and method of producing a semiconductor sensor device

Method of manufacturing resin-encapsulated semiconductor device, and lead frame

Conductive pads and methods of formation thereof

Chip package structure and manufacturing method thereof

Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold

Systems and devices with common mode noise suppression structures and methods

Light-emitting device and method of manufacturing the same

Light emitting device

Phosphor, light emitting device and lighting apparatus

Semiconductor devices having hybrid stacking structures and methods of fabricating the same

Power semiconductor package with a common conductive clip

Thin stack packages

Package structure and its fabrication method

Semiconductor device

Recessed semiconductor substrates and associated techniques

Method and materials for warpage thermal and interconnect solutions

LPS solder paste based low cost fine pitch pop interconnect solutions

Semiconductor device including a cap facing a semiconductor chip and a bump electrode provided between the semiconductor chip and the cap

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Wafer level device and method with cantilever pillar structure

Electromagnetic interference shield for semiconductor chip packages

Semiconductor package and method of manufacturing the same

Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring

Method for manufacturing an electronic package

Space transformer

Semiconductor device having lead frame with notched inner leads

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package

Semiconductor package on which semiconductor chip is mounted on substrate with window

Semiconductor die package with multiple mounting configurations

Semiconductor device and semiconductor device casing

Method for manufacturing electrical connections in a semiconductor device and the semiconductor device

Anisotropic conductive film and method of producing the same

Optoelectronic package and method of manufacturing the same

Semiconductor packages and methods of forming the same

Semiconductor device having semiconductor chips in resin and electronic circuit device with the semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package

Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers

Semiconductor packages and methods of forming the same

Semiconductor devices including through-silicon via

Stacked die integrated circuit

Power semiconductor device

Semiconductor module package and method of manufacturing the same

Pressure sensor device with through silicon via

Semiconductor device having semiconductor chip mounted on lead frame

Lead frame with mold lock structure

High power electronic component with multiple leadframes

Semiconductor device and method of manufacturing semiconductor device

Electronic device, electronic apparatus, and moving object

Stress buffer layer for integrated microelectromechanical systems (MEMS)

Electronic module and method of manufacturing the same

Light emitting apparatus with recessed reflective resin and protruding reflection frame

Photosensor having an emitter-encapsulating portion, receiver-encapsulating portion, and circuit-encapsulating portion connected to one another with a conductive leadframe

Semiconductor device and manufacturing method thereof

Light emitting device and method for manufacturing the same including a light-reflective resin

Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof

Method of manufacturing illumination device, illumination device, illumination device manufacturing system, method of classifying color tone of light emitting devices, and method of classifying light emitting devices

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

Methods for high precision microelectronic die integration

Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer

Power semiconductor package with conductive clips

3D packages and methods for forming the same

Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices

Wafer-based electronic component packaging

Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication

Electronic device including soldered surface-mount component

Semiconductor package with lead mounted power bar

Manufacturing method of semiconductor device and semiconductor device

Positional relationship among components of semiconductor device

Lead built-in type circuit package and method for producing same

Packages with through-vias having tapered ends

Packaging mechanisms for dies with different sizes of connectors

Isolation rings for packages and the method of forming the same

Integrated circuit package

Method for manufacturing semiconductor device and semiconductor device

Methods for controlling warpage in packaging

Semiconductor packages and data storage devices including the same

Light emitting module and light irradiating apparatus

Color-mixing light-emitting diode module

Garnet-based phosphor doped with thorium and light emitting device using the same

Mirco-electro-mechanical system module and manufacturing method thereof

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Circuit board having bypass pad

Mold chase for integrated circuit package assembly and associated techniques and configurations

Interconnect structure for package-on-package devices and a method of fabricating

Methods for making semiconductor device with sealing resin

Exposed die power semiconductor device

Single mask package apparatus

Combined substrate

Solution for reducing poor contact in info packages

Semiconductor package and method

Semiconductor device packaging having plurality of wires bonding to a leadframe

Package-on-package assembly with wire bond vias

Package structure to enhance yield of TMI interconnections

Enhanced board level reliability for wafer level packages

Embedded die flip-chip package assembly

Solder ball protection in packages

Mounting member, electronic component, and method for manufacturing module

Semiconductor device with lead terminals having portions thereof extending obliquely

Semiconductor device having plated outer leads exposed from encapsulating resin

Semiconductor package with thermal via and method for fabrication thereof

Semiconductor device

Electronic component having encapsulated wiring board and method for manufacturing the same

Method for producing a multiplicity of optoelectronic semiconductor components

Light emitting apparatus, illumination apparatus and display apparatus

Modular driver module for light fixtures with LED luminaires