Semiconductor device and method of manufacturing the same

EMI shielding in semiconductor packages

Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball

Method for singulating packaged integrated circuits and resulting structures

Die-to-die gap control for semiconductor structure and method

Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package

Light emitting diode and method for fabricating the same

Electronic device and method of fabricating an electronic device

Semiconductor package and method for manufacturing the same

Semiconductor package and method for manufacturing the same

Ball grid array semiconductor package and method of manufacturing the same

Semiconductor package including a plurality of chips

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Packaging devices and methods of manufacture thereof

3D die stacking structure with fine pitches

Semiconductor devices and methods of forming thereof

Transformer input matched transistor

Semiconductor device and method for producing semiconductor device

Motor incorporating power converter, and air conditioner, water heater, and ventilation blower incorporating the motor

Method for manufacturing semiconductor device

Light emitting apparatus

Electronic package structure

Semiconductor integrated circuit device

Electronic package structure

Semiconductor device and method for manufacturing same

Semiconductor die laminating device with independent drives

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Chip on package structure and method

Semiconductor package having magnetic connection member

Package-on-package device

Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern

Chip on package structure and method

Semiconductor device and method for manufacturing a semiconductor device

Die up fully molded fan-out wafer level packaging

Microelectronic packages having layered interconnect structures and methods for the manufacture thereof

Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process

Stacked semiconductor package including a smaller-area semiconductor chip

Semiconductor device packages using a thermally enhanced conductive molding compound

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

Transistor arrangement

Lateral super junctions with high substrate breakdown and build in avalanche clamp diode

Switching circuit

Light emitting device, and method for manufacturing thereof

Electronic component assembly apparatus

System-in-package module with memory

Contactless communication unit connector assemblies with signal directing structures

Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages

Manufacturing method of forming an etch-back type semiconductor package with locking anchorages

Semiconductor package and method of fabricating the same

Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof

3-D package having plurality of substrates

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Package on package structure and method of manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor package device and manufacturing method thereof

Vibrator, manufacturing method of vibrator, electronic device, electronic apparatus, and moving object

Flow sensor and method for manufacturing the same

Apparatus and method for self-aligning chip placement and leveling

Method of manufacturing a semiconductor package including a surface profile modifier

Method of manufacturing a semiconductor device

Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements

Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

Lighting device including phosphor cover and method of manufacturing the same

Power module package

Integrated fan-out structure with openings in buffer layer

Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)

Electrically insulating thermal interface on the discontinuity of an encapsulation structure

Semiconductor packages and methods for forming semiconductor package

Semiconductor device, semiconductor device mounting structure and power semiconductor device

Chip-stacked semiconductor package and method of manufacturing the same

Methods and configuration for manufacturing flip chip contact (FCC) power package

Light emitting device package

Light emitting device, light emitting device package including the device and lighting apparatus including the package

Printed wiring board, method for manufacturing printed wiring board and package-on-package

Semiconductor device and method of forming conductive layer over substrate with vents to channel bump material and reduce interconnect voids

Semiconductor device and method for manufacturing the same

Composite resin and electronic device

LED assembly

Modular driver module for light fixtures with LED luminaires

Light emitting device with light reflecting member having protrusion over bonding ball of wire

Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit board

Power semiconductor module and method for producing a power semiconductor module

Transistor arrangement with semiconductor chips between two substrates

Semiconductor bonding structures and methods

Semiconductor device and method of manufacturing the same, and power supply apparatus

Metal redistribution layer for molded substrates

Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration

Semiconductor device

Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer

Semiconductor package

Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP

Package carrier and manufacturing method thereof

Chip package and method for forming the same

Semiconductor device and method of controlling warpage in reconstituted wafer

Semiconductor device and method of forming dual fan-out semiconductor package

Copper ball bond features and structure

Multi-chip package and method of formation

Multi-chip package structure and method of forming same

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

LED package structures for preventing lateral light leakage and method of manufacturing the same

Fluorophor and method for production thereof and illuminator

Flip chip assembly process for ultra thin substrate and package on package assembly

Semiconductor device

Hollow metal pillar packaging scheme

Semiconductor device and measurement device having an oscillator

Power semiconductor device

Printed wiring board and method for manufacturing the same

Methods and apparatus for package on package devices with reversed stud bump through via interconnections

Microcapsular quantum dot-polymer composite, method for producing the composite, optical elements, and method for producing the optical elements

Phosphor, method for manufacturing same, light emitting device, and image display device

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Circuit module and method of producing the same

Circuit module and method of producing circuit module

Integrated fan-out structure with guiding trenches in buffer layer

Through via package

Methods and apparatus for package on package devices

Semiconductor device having a boundary structure, a package on package structure, and a method of making

Apparatus and method for a component package

Radiation hardened microelectronic chip packaging technology

Light-reflective anisotropic conductive adhesive agent, and light emitting device

Lead frame strips with electrical isolation of die paddles

Multichip power semiconductor device

Stacked semiconductor package and method for manufacturing the same

Packages, packaging methods, and packaged semiconductor devices

ESD protection device

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation

Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same

Chip package having a patterned conducting plate and method for forming the same

Semiconductor interconnect structure

Packaged semiconductor device having an encapsulated semiconductor chip

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device and method for manufacturing the same

Wafer level dicing method

3D semiconductor device and structure

Power semiconductor package with gate and field electrode leads

Semiconductor packages having multiple lead frames and methods of formation thereof

Electronic device packages having bumps and methods of manufacturing the same

Electronic package structure comprising a magnetic body and an inductive element and method for making the same

Fluoride fluorescent material and method for producing the same as well as light emitting device using the same

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Semiconductor device and method of forming pad layout for flipchip semiconductor die

SEMICONDUCTOR PACKAGE

Semiconductor packages including heat exhaust part

Lead frame having a perimeter recess within periphery of component terminal

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

Integrated camera module and method of making same

Semiconductor package with embedded die and its methods of fabrication

Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices

Light-emitting module, and illumination light source and illumination device using same

Semiconductor package

Packages with interposers and methods for forming the same

Semiconductor package

Multi-chip structure and method of forming same

Alignment structures and methods of forming same

Semiconductor package and method of manufacturing the same

Light-emitting device

Method for manufacturing a fan-out WLP with package

Method for fabricating multi-chip stack structure

Semiconductor device, and method of manufacturing semiconductor device

Semiconductor package with lead frame and recessed solder terminals

Semiconductor device

Electronic component and method

Semiconductor device

Image forming apparatus, chip, and chip package to reduce cross-talk between signals

Field-effect transistor stack voltage compensation

Packaging a semiconductor device having wires with polymerized insulator skin

Vehicular lamp

Light source device and display unit

Electronic device

MEMS switch device and method of fabrication

Semiconductor device and method of manufacturing the same

Segmented bond pads and methods of fabrication thereof

Multichip device including a substrate

Pad configurations for an electronic package assembly

Through package via (TPV)

Method for manufacturing semiconductor device and semiconductor device

Wafer scale package for high power devices

Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a MEMS microphone and packaged device obtained thereby

Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation

Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package

Light emitting device

Method and apparatus for molding encapsulant of light emitting device

Chip component

Method of manufacturing semiconductor device

Multi-chip package and method of manufacturing the same

Light emitting device, illuminating device and method of manufacturing light emitting device

Light-emitting module and lighting apparatus

Molding composition for semiconductor package and semiconductor package using the same

Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Semiconductor devices

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

Semiconductor device and method of forming through mold hole with alignment and dimension control

Non-leaded type semiconductor package and method of assembling same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus

Semiconductor module

Apparatus comprising and a method for manufacturing an embedded MEMS device

Method of packaging integrated circuits and a molded package

Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed

Semiconductor device, method of manufacturing the semiconductor device, and electronic device

Methods for producing semiconductor devices

EMI package and method for making same

Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer

Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals

Electronic device and method for fabricating an electronic device

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Substrate for semiconductor package and process for manufacturing

Mechanisms for forming bonding structures

Semiconductor device and manufacturing method thereof

Light emitting device and method of manufacturing the same

Light emitting device including resin member surrounding sides of light emitting element

Light-emitting device

Self-illuminating CMOS imaging package

Method for package-on-package assembly with wire bonds to encapsulation surface

Method of forming a semiconductor package

LED module having a highly reflective carrier

Semiconductor device having a bulge portion and manufacturing method therefor

Current sensor device

Dam structure for enhancing joint yield in bonding processes

Interconnect structure and method of fabricating same

Coreless package structure and method for manufacturing same

Semiconductor module with interlocked connection

Die-on-interposer assembly with dam structure and method of manufacturing the same

Thin wafer handling and known good die test method

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Semiconductor device with pre-molding chip bonding

Package on-package process for applying molding compound

Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device

Methods of forming conductive and insulating layers

Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same

Methods of forming conductive jumper traces

Light strings including jacketed LED assemblies

Power semiconductor module and power module

Method of forming molded panel embedded die structure

Semiconductor device, transmission system, method for manufacturing semiconductor device, and method for manufacturing transmission system

Circuit configuration for radar applications

Wire tail connector for a semiconductor device

Package assembly for embedded die and associated techniques and configurations

Bonding structure for forming a package on package (PoP) structure and method for forming the same

Underfill material flow control for reduced die-to-die spacing in semiconductor packages

Semiconductor device and method of stacking semiconductor die on a fan-out WLCSP

Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package

Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding

Radio frequency shielding within a semiconductor package

Semiconductor package

Method of manufacturing semiconductor device including grinding semiconductor wafer

Electric component module and method of manufacturing the same

Package with solder regions aligned to recesses

Semiconductor device and method for manufacturing the same

Semiconductor device with integrated antenna

Magnetic shield, semiconductor device, and semiconductor package

Electronic circuit arrangement and method of manufacturing the same

Copper post solder bumps on substrates

Dual lead frame semiconductor package and method of manufacture

Power converters having capacitive energy transfer elements and arrangements of energy storage elements for power converters

Packaging methods and packaged semiconductor devices

Memory module in a package

Semiconductor package structure and semiconductor process

Semiconductor device and an electronic device

Semiconductor device and method for manufacturing semiconductor device

Multi-layer conversion material for down conversion in solid state lighting

Semiconductor device and method of manufacturing the same

Electric magnetic shielding structure in packages

Light emitting device, and method for manufacturing circuit board

Through silicon vias for semiconductor devices and manufacturing method thereof

Semiconductor device

Semiconductor device with overlapped lead terminals

Semiconductor device

Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die

Semiconductor device

Chip arrangement and method for manufacturing a chip arrangement

Light emitting device and light emitting device package

Delta modulated low-power EHF communication link

Electronic modules having grounded electromagnetic shields

Acoustic wave device

Semiconductor package and fabrication method thereof

Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant

Semiconductor package and method of manufacturing the same

Semiconductor device

Power module comprising two substrates and method of manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Wafer-level packaging of integrated devices, and manufacturing method thereof

Small footprint semiconductor package

Semiconductor light emitting device

Electronic device and manufacturing method of electronic device

Stacked electronic device

Semiconductor device

Fan-out package structure and methods for forming the same

Semiconductor package including a substrate with a stepped sidewall structure

Integrated circuit structure and method for reducing polymer layer delamination

Hybrid semiconductor package

Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor module and driving device for switching element

TSV structures and methods for forming the same

Fabrication method of semiconductor package