Thermal dissipation through seal rings in 3DIC structure

Semiconductor package

Semiconductor device and method of forming insulating layer around semiconductor die

Bonding structure and method

Semiconductor device and method of land grid array packaging with bussing lines

Methods of fabricating semiconductor stack packages

Mold release film and method of process for producing a semiconductor device using the same

Composite wafer including a molded wafer and a second wafer

Production method of phosphor

Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP

Composite reconstituted wafer structures

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Resin-encapsulated semiconductor device and its manufacturing method

Method of manufacturing semiconductor device and semiconductor device

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Package arrangement including external block comprising semiconductor material and electrically conductive plastic material

Composite reconstituted wafer structures

Composite reconstituted wafer structures

Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus

Semiconductor device and method of forming duplex plated bump-on-lead pad over substrate for finer pitch between adjacent traces

Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip

Semiconductor package structure and fabrication method thereof

Semiconductor device and method of forming inductor over insulating material filled trench in substrate

Semiconductor device and fabrication method for same

Removable indicator structure in electronic chips of a common substrate for process adjustment

Package for three dimensional integrated circuit

Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant

Directly cooled substrates for semiconductor modules and corresponding manufacturing methods

Red phosphor, method for producing red phosphor, white light source, illuminating device, and liquid crystal display device

Integrated-circuit module with waveguide transition element

Stackable package by using internal stacking modules

3D packages and methods for forming the same

Semiconductor device and method of forming stress-reduced conductive joint structures

Semiconductor device and method of forming high routing density interconnect sites on substrate

Contact pads with sidewall spacers and method of making contact pads with sidewall spacers

Multi-solder techniques and configurations for integrated circuit package assembly

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units

Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer

Proximity detector device with interconnect layers and related methods

Wafer process for molded chip scale package (MCSP) with thick backside metallization

Lighting device

Chip embedded substrate and method of producing the same

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor device including a DC-DC converter

Package with a fan-out structure and method of forming the same

Electrical system and core module thereof

Electronic assembly for mounting on electronic board

Lead and lead frame for power package

No-exposed-pad ball grid array (BGA) packaging structures and method for manufacturing the same

Semiconductor package

Low profile leaded semiconductor package

Light emitting diode

Package and a method of manufacturing the same

Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation

Integrated circuit package assemblies including a glass solder mask layer

Semiconductor device

Semiconductor device manufacturing method and semiconductor device

Package with passive devices and method of forming the same

Build-up package for integrated circuit devices, and methods of making same

Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding

Circuit module and production method therefor

Electric power semiconductor device and method for producing same

Method apparatus and material for radio frequency passives and antennas

Embedded die-down package-on-package device

Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components

Method for manufacturing electronic devices

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and semiconductor module

Chip package and method of manufacturing the same

Semiconductor device and method of forming shielding layer over active surface of semiconductor die

Light emitting diode device and method for manufacturing same

Compact LED package with reflectivity layer

Phosphor and light emitting device

Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package and LED package manufactured thereby

Method for plating a semiconductor package lead

Method for forming chip-on-wafer assembly

Method of mounting semiconductor element, and semiconductor device

System and method of sensing current in a power semiconductor device

Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device

Microelectronic devices and methods for filling vias in microelectronic devices

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

Semiconductor device

Multi-chip semiconductor power device

Semiconductor device and method for manufacturing the same

Semiconductor component with moisture barrier for sealing semiconductor body

Extremely high frequency systems and methods of operating the same

Method for fabricating stack die package

Semiconductor lighting devices and methods

Ambient light monitoring in a lighting fixture

Formulation for packaging an electronic device and assemblies made therefrom

Method of manufacturing substrate for chip packages and method of manufacturing chip package

Package-on-package structure with reduced height

Wafer level chip scale packaging intermediate structure apparatus and method

Fan-out interconnect structure and method for forming same

Package on-package joint structure with molding open bumps

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Packaging devices, methods of manufacture thereof, and packaging methods

Package-on-package structure and method of forming same

Package on-package structure

Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package

Stack die package

Power overlay structure and method of making same

Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect

Packaging mechanisms for dies with different sizes of connectors

Semiconductor device and method of forming an inductor on polymer matrix composite substrate

Color stable red-emitting phosphors

Smart card module arrangement

3D shielding case and methods for forming the same

System and method for an improved interconnect structure

Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate

Semiconductor package and electronic system including the same

Package alignment structure and method of forming same

Semiconductor package

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die

Surface treatment method and apparatus for semiconductor packaging

Ball amount process in the manufacturing of integrated circuit

Packaging devices and methods of manufacture thereof

Interconnect structures and methods of forming same

Package having substrate with embedded metal trace overlapped by landing pad

Method and apparatus for printing integrated circuit bond connections

Chip carrier structure, chip package and method of manufacturing the same

Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB

Insulating structure, a method of forming an insulating structure, and a chip scale isolator including such an insulating structure

Light emitting device

Three-dimensional integrated circuit (3DIC)

Semiconductor package including antenna substrate and manufacturing method thereof

Semiconductor module and boost rectifier circuit

Multi-chip package and method of manufacturing the same

Illuminating apparatus

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor device and method of forming micro-vias partially through insulating material around bump interconnect

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Dual-flag stacked die package

Semiconductor device

Semiconductor packages with thermal-enhanced conformal shielding and related methods

Current sensors and methods

Semiconductor device including a plurality of magnetic shields

Decoupling MIM capacitor designs for interposers and methods of manufacture thereof

Semiconductor package and method of forming the same

Epoxy resin composition and electronic component device

Component built-in board and method of manufacturing the same, and mounting body

Method of fabricating three dimensional integrated circuit

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Packaging methods and packaged semiconductor devices

Molding compound structure

Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device

Module and method of manufacturing a module

Semiconductor device including electromagnetic absorption and shielding

Chip arrangement and a method of manufacturing a chip arrangement

Phosphor materials and related devices

Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance

Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules

Discrete phosphor chips for light-emitting devices and related methods

Barrier with integrated self cooling solid state light sources

Electronic control unit and rotating electric machine

Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate

Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof

Resin-encapsulated semiconductor device and method of manufacturing the same

Semiconductor device, semiconductor package, and electronic device

Package with metal-insulator-metal capacitor and method of manufacturing the same

Light emitting device including light emitting element, outer connection electrodes and resin layer

Device including a semiconductor chip and wires

3D semiconductor package interposer with die cavity

Semiconductor device and method of forming conductive vias with trench in saw street

Semiconductor device having flat leads

Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package

Mounting structure and manufacturing method for same

Electronic component, mother substrate, and electronic component manufacturing method

Semiconductor device and method of manufacturing the same

Decoupling MIM capacitor designs for interposers and methods of manufacture thereof

Method of processing a substrate

Electrically conductive adhesive compound and adhesive tape

Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package

PoP device

Manufacturing and evaluation method of a semiconductor device

Finger sensor including encapsulating layer over sensing area and related methods

Power MOSFETs with improved efficiency for multi-channel class D audio amplifiers and packaging therefor

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Semiconductor device

Semiconductor package and method of manufacturing the same

Method for fabricating a semiconductor chip panel

Wafer-level packaging mechanisms

Sensor package

Two-axis vertical mount package assembly

Stacked semiconductor package including connections electrically connecting first and second semiconductor packages

Lead frame

Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the same

External storage device and method of manufacturing external storage device

Stacked half-bridge package

Semiconductor light emitting device and method for manufacturing same

System and method for an improved fine pitch joint

Sensor system and cover device for a sensor system

Semiconductor device and method of forming embedded wafer level chip scale packages

Method of manufacturing semiconductor device and semiconductor device

Method of manufacturing semiconductor device, block stacked body, and sequential stacked body

Package on package (PoP) bonding structures

Post-passivation interconnect structure and method of forming the same

Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages

LED lamp incorporating remote phosphor and diffuser with heat dissipation features

Method for reducing underfill filler settling in integrated circuit packages

Dicing tape-integrated film for semiconductor back surface

Semiconductor device having conductive via and manufacturing process

Semiconductor device and method of making bumpless flipchip interconnect structures

Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form

Semiconductor device and method of simultaneous molding and thermalcompression bonding

Light emitting device

Substrate contact opening

Optical element, optoelectronic component and method for the production thereof

Power module

Antenna apparatus and method

Current sensor substrate and current sensor

Semiconductor package having supporting plate and method of forming the same

Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices

Semiconductor devices having insulating substrates and methods of formation thereof

Normally off power electronic component

Semiconductor device and method of forming low profile fan-out package with vertical interconnection units

Apparatus for package reinforcement using molding underfill

Multichip package semiconductor device

Semiconductor device and method of manufacturing the same

Light-emitting device with reflective resin

Light-emitting device, light-emitting device assembly, and electrode-bearing substrate in which a fragile region is formed in a substrate, and light emitting device cut from light-emitting device assembly

Stacked packaging using reconstituted wafers

System and method for fine pitch PoP structure

Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress

Thermoset polymides for microelectronic applications

Method of manufacturing a semiconductor device using markings on both lead frame and sealing body

Device comprising a ductile layer and method of making the same

Electronic devices with embedded die interconnect structures, and methods of manufacture thereof

Semiconductor packages and methods of fabrication thereof

Electronic component device

Packaged microelectronic components

Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus

Semiconductor memory chips and stack-type semiconductor packages including the same

Chip arrangements and methods for manufacturing a chip arrangement

Package for an integrated circuit

Plasma treatment for semiconductor devices

Warpage control of semiconductor die package

Electronic component, method of manufacturing same, composite module including electronic component, and method of manufacturing same

Stacked chip-on-board module with edge connector

Light-emitting device including case and sealant

Package structures including a capacitor and methods of forming the same

Method for fabricating a semiconductor and semiconductor package

Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values

Packaged nano-structured component and method of making a packaged nano-structured component

Driver integrated circuit

Discrete device mounted on substrate

Multi-solder techniques and configurations for integrated circuit package assembly

Semiconductor device with conductive vias

Semiconductor packaging structure and method

Semiconductor package having multi-phase power inverter with internal temperature sensor

Light emitting device and method for manufacturing the same

Adjustable pick-up head and method for manufacturing a device

Tablet ultrasound system

PACKAGE SUBSTRATE AND CHIP PACKAGE USING THE SAME

Power semiconductor module and power converter using the same

IGBT die structure with auxiliary P well terminal

Semiconductor device and manufacturing method thereof

Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices

Stacked dual-chip packaging structure and preparation method thereof

Integrated antennas in wafer level package

Light emitting device package and light emitting device having lead-frames

Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component

Method of and device for manufacturing LED assembly using liquid molding technologies

Top gated method for manufacturing a data carrier

Tablet ultrasound system

Electrical, mechanical, computing/ and/or other devices formed of extremely low resistance materials

Semiconductor device and method of confining conductive bump material with solder mask patch

System in package manufacturing method using wafer-to-wafer bonding

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Embedded chip packages and methods for manufacturing an embedded chip package

Fan-out wafer level package structure

Bump-on-trace interconnection structure for flip-chip packages

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

Packaging devices, methods of manufacture thereof, and packaging methods

Semiconductor packages and methods of formation thereof

Shielded EHF connector assemblies

Semiconductor package with bonding wires of reduced loop inductance

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)

Semiconductor device and method of forming conductive ink layer as interconnect structure between semiconductor packages

DIE DOWN INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SPREADER AND LEADS

POP structures and methods of forming the same

MEMS sensor package systems and methods

Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device

Techniques for packaging multiple device components

Package structure and method for manufacturing package structure

Stacked multi-chip integrated circuit package

Power quad flat no-lead (PQFN) package in a single shunt inverter circuit

Packaged IC having printed dielectric adhesive on die pad

Semiconductor package and method for fabricating the same

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP

Three dimensional integrated circuits stacking approach

Apparatus and method for a component package

LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING

Semiconductor device and method of using a standardized carrier in semiconductor packaging