212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Memory devices with controllers under memory packages and associated systems and methods
#902Stacked semiconductor die assemblies with die substrate extensions
#903Semiconductor device and method for manufacturing semiconductor device
#904Cavity wall structure for semiconductor packaging
#905Semiconductor package structure on a PCB and semiconductor module including the same
#906Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells
#907Light emitting device
#908Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
#909Packages with Si-substrate-free interposer and method forming same
#910Package with thinned substrate
#911Method for fabricating a semiconductor and semiconductor package
#912Solder material for semiconductor device
#913EMI shield for molded packages
#914Discrete power transistor package having solderless DBC to leadframe attach
#915Non-vertical through-via in package
#916Semiconductor package structure
#917Method of fabricating semiconductor package structure
#918Magneto-resistive effect element
#919LED light bulb
#920Package-on-package (PoP) semiconductor package and electronic system including the same
#921Package structures and methods of forming
#922Semiconductor package
#923Chip package and manufacturing method thereof
#924Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
#925Sensor package and manufacturing method thereof
#926Wafer level chip scale packaging intermediate structure apparatus and method
#927Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#928Forming recesses in molding compound of wafer to reduce stress
#929ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY
#930Redistribution layer structures for integrated circuit package
#931Integrated circuit package with pre-wetted contact sidewall surfaces
#932Build-up package for integrated circuit devices, and methods of making same
#933Method of fabricating package structure
#934Multi-chip structure and method of forming same
#935Light source device and display unit
#936Semiconductor packages and methods of forming the same
#937Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#938Semiconductor device and method of manufacture
#939Stacked semiconductor die assemblies with die support members and associated systems and methods
#940Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#941Semiconductor device and method
#942Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
#943Semiconductor device having through silicon vias and manufacturing method thereof
#944Universal surface-mount semiconductor package
#945Method for fabricating semiconductor package and semiconductor package using the same
#946Composite wafer, semiconductor device and electronic component
#947Embedded semiconductive chips in reconstituted wafers, and systems containing same
#948VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
#949Tablet ultrasound system
#950Semiconductor device
#951Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad
#952Package stack structure and method for manufacturing the same
#953Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring
#954Method for manufacturing semiconductor package structure
#955Methods related to shielded module having compression overmold
#956Semiconductor package having routable encapsulated conductive substrate and method
#957Semiconductor package and method of fabricating the same
#958Packaging mechanisms for dies with different sizes of connectors
#959Package structure and manufacturing method thereof
#960Semiconductor package
#961Integrated circuit packaging
#962Semiconductor device and method for manufacturing the same
#963Semiconductor device having EMI shielding structure and related methods
#964Power module and motor drive circuit
#965Method of manufacturing an electronic device and electronic device manufactured thereby
#966Quad flat no lead package and method of making
#967Thermosetting composition, and method for manufacturing thermoset resin
#968Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#969Package-on-package structure
#970LED lighting apparatus
#971RF devices with enhanced performance and methods of forming the same
#972Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
#973Semiconductor device
#974Semiconductor device having an oscillator and an associated integrated circuit
#975RF devices with enhanced performance and methods of forming the same
#976Sensing device and method for fabricating the same
#977Method for fabricating electronic package with conductive pillars
#978Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages
#979Packaged semiconductor devices and methods of packaging semiconductor devices
#980Semiconductor device
#981Packages with through-vias having tapered ends
#982Antenna apparatus and method
#983Light-emitting device
#984Light emitting device, and method for manufacturing thereof
#985Substrate interposer on a leaderframe
#986Semiconductor package
#987Semiconductor package having a high reliability
#988Microelectronic packages with high integration microelectronic dice stack
#989Semiconductor package and method of manufacturing the same
#990Adhesive bonding composition and electronic components prepared from the same
#991Method for fabricating electronic package
#992Semiconductor Package
#993Internally-shielded microelectronic packages and methods for the fabrication thereof
#994METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS
#995SINGLE CRYSTAL PHOSPHOR, PHOSPHOR-CONTAINING MEMBER AND LIGHT-EMITTING DEVICE
#996Multi-purpose non-linear semiconductor package assembly line
#997Semiconductor with external electrode
#998Chip package
#999POWER CONVERTER HAVING A CONDUCTIVE CLIP
#1000Modified leadframe design with adhesive overflow recesses
#1001Semiconductor die package including a one-body clip
#1002Power semiconductor device with first and second sealing resins of different coefficient of thermal expansion
#1003Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells
#1004Scalable High-Bandwidth Connectivity
#1005Leadframe with vertically spaced die attach pads
#1006Three-dimensional package structure
#1007Printed circuit board and semiconductor package
#1008Red flip chip light emitting diode, package, and method of making the same
#1009Semiconductor device package including embedded conductive elements
#1010Package-on-package assembly with wire bonds to encapsulation surface
#1011Chip package structure
#1012Chip package
#1013SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#1014Lead frame, semiconductor device, and method for manufacturing semiconductor device
#1015Thermal interface adhesion for transfer molded electronic components
#1016LIGHT-EMITTING MODULE
#1017Packaged electronic device having integrated antenna and locking structure
#1018Semiconductor device and manufacturing method of the same
#1019METHOD OF FABRICATING ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE ELECTRONIC COMPONENTS
#1020Semiconductor package structure and method of manufacturing the same
#1021Package on package structure and method for forming the same
#1022Method for manufacturing package structure
#1023Thermal dissipation through seal rings in 3DIC structure
#1024Semiconductor device and method for producing the semiconductor device
#1025Packaged semiconductor devices and methods of packaging semiconductor devices
#1026Stacked memory device, a system including the same and an associated method
#1027Semiconductor device comprising PN junction diode and schottky barrier diode
#1028Integrated circuit package assembly
#1029Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
#1030Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates
#1031Method for fabricating carrier-free semiconductor package
#1032Method of forming a packaged semiconductor device having enhanced wettable flank and structure
#1033Co-packaged die on leadframe with common contact
#1034Method of manufacturing semiconductor module and semiconductor module
#1035Wafer-level chip-scale package including power semiconductor and manufacturing method thereof
#1036Fine pitch bva using reconstituted wafer with area array accessible for testing
#1037Light emitting device
#1038Epoxy resin composition and electronic component device
#1039Optical device
#1040Semiconductor component and illumination device
#1041Semiconductor device
#1042QFN pre-molded leadframe having a solder wettable sidewall on each lead
#1043Semiconductor device and method of manufacture
#1044LIGHT SOURCE WITH TUNABLE CRI
#1045Semiconductor package and method of fabricating semiconductor package
#10463D packages and methods for forming the same
#1047Semiconductor structure and manufacturing method thereof
#1048Surface treatment method and apparatus for semiconductor packaging
#1049Structures and methods for reliable packages
#1050Manufacturing method of package structure
#1051Printed circuit board
#1052EHF secure communication device
#1053LED package with integrated features for gas or liquid cooling
#1054Semiconductor packages having dummy connectors and methods of forming same
#1055Stacking integrated circuits containing serializer and deserializer blocks using through via
#1056Semiconductor device
#1057Semiconductor device with discrete blocks
#1058Methods for controlling warpage in packaging
#1059Semiconductor device package and method for manufacturing the same
#1060Semiconductor die connection system and method
#1061Package structure and method of forming the same
#1062Solder ball protection in packages
#1063Package with interlocking leads and manufacturing the same
#1064Wire bond wires for interference shielding
#1065Method for stress reduction in semiconductor package via carrier
#1066Single-package wireless communication device
#1067Forming large chips through stitching
#1068Fan-out package having a main die and a dummy die
#1069Signal coupling device
#1070Sensor package structure
#1071Stacked semiconductor die assemblies with support members and associated systems and methods
#1072Mechanisms for forming bonding structures
#1073Methods and apparatus for isolation barrier with integrated magnetics for high power modules
#1074Fluoride-based phosphors for light emitting device
#1075Method of fabricating semiconductor package
#1076Semiconductor device
#1077Semiconductor device and package assembly including the same
#1078Electric power conversion apparatus
#1079Method of manufacturing light emitting device
#1080Light-emitting package
#1081Light-emitting device and backlight including light-emitting device
#10823-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACTERISTICS
#1083Stacked semiconductor system having interposer of half-etched and molded sheet metal
#1084Anisotropic conductive film and method of producing the same
#1085Alignment mark design for packages
#1086Pad structure design in fan-out package
#1087Fan-out semiconductor package
#1088Method for manufacturing semiconductor device
#1089Semiconductor device and method of manufacturing the same
#1090Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP
#1091Method of Manufacturing a Multi-Chip Semiconductor Power Device
#1092High-speed semiconductor modules
#1093Semiconductor package and method of forming the same
#1094Packages with Si-substrate-free interposer and method forming same
#1095Packaged semiconductor device with a particle roughened surface
#1096Interconnect structure for package-on-package devices
#1097Integrated circuit package pad and methods of forming
#1098Fan-out antenna packaging structure and preparation thereof
#1099Through-holes of a semiconductor chip
#1100Internally-shielded microelectronic packages and methods for the fabrication thereof
#1101Method of manufacturing package structure
#1102Power semiconductor device and power conversion device
#1103Semiconductor device and method for manufacturing semiconductor device
#1104Semiconductor chip
#1105Plurality of lead frames electrically connected to inductor chip
#1106Via structure for packaging and a method of forming
#1107Light emitting device and method of manufacturing the same, and display device
#1108Package structure and manufacturing method thereof
#1109Heat spreading device and method
#1110Methods and apparatus for sensor diagnostics
#1111Molded circuit substrates
#1112Semiconductor device including sense insulated-gate bipolar transistor
#1113Light emitting diode (LED) components and methods
#1114Manufacturing method of semiconductor package
#1115Integrated fan-out package including voltage regulators and methods forming same
#1116Integrated circuit structure having dies with connectors of different sizes
#1117Bridge interconnection with layered interconnect structures
#1118Package with component connected with carrier via spacer particles
#1119Integrated circuits protected by substrates with cavities, and methods of manufacture
#1120Electromagnetic signal focusing structures
#1121Packaging photon building blocks with top side connections and interconnect structure
#1122Manufacturing method of LED package structure
#1123Light-emitting element including intermediate connection and branches
#1124Method for manufacturing semiconductor device
#1125Asymmetric transient voltage suppressor device and methods for formation
#1126Heterogeneous fan-out structure and method of manufacture
#1127Die-on-interposer assembly with dam structure and method of manufacturing the same
#1128Embedded 3D interposer structure
#1129Semiconductor bonding structures and methods
#1130Integrated circuit package including miniature antenna
#1131Dynamic random access memory (DRAM) mounts
#1132Semiconductor package
#11333DIC packaging with hot spot thermal management features
#1134Package structure and method
#1135Semiconductor chip, method for mounting semiconductor chip, and module in which semiconductor chip is packaged
#1136Plating interconnect for silicon chip
#1137Semiconductor device assemblies including multiple shingled stacks of semiconductor dies
#1138Bonding package components through plating
#1139Package with metal-insulator-metal capacitor and method of manufacturing the same
#1140Bottom package exposed die MEMS pressure sensor integrated circuit package design
#1141Post-passivation interconnect structure and method of forming the same
#1142Power module, power converter and manufacturing method of power module
#1143Method for fabricating a semiconductor and semiconductor package
#1144Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer
#1145Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
#1146Semiconductor device with thin redistribution layers
#1147Method for fabricating electronic package
#1148Substrate pad structure
#1149Power device package structure
#1150Integrated circuit packages and methods of forming same
#1151Positional relationship among components of semiconductor device
#1152Circuit board and circuit module
#1153Thermally conductive structure for heat dissipation in semiconductor packages
#1154Substrate design for semiconductor packages and method of forming same
#1155Inverted leads for packaged isolation devices
#1156Semiconductor device packages, packaging methods, and packaged semiconductor devices
#1157LTHC as charging barrier in InFO package formation
#1158Structure and method of forming a joint assembly
#1159Method of forming contact holes in a fan out package
#1160Electric magnetic shielding structure in packages
#1161Semiconductor package with dual sides of metal routing
#1162Semiconductor device and method of manufacturing the same
#1163Integrated fan-out packages with embedded heat dissipation structure
#1164Thermal interface material layer and package-on-package device including the same
#1165Planarization of semiconductor packages and structures resulting therefrom
#1166Stray field suppression in magnetic sensor Wheatstone bridges
#1167Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
#1168Power module, power converter device, and electrically powered vehicle
#1169Electronic device package and fabricating method thereof
#1170Integrated circuit packages and methods of forming same
#1171Semiconductor device
#1172Arrangement and thermal management of 3D stacked dies
#1173Arrangement and thermal management of 3D stacked dies
#1174Molded proximity sensor
#1175Package on package thermal transfer systems and methods
#1176Semiconductor package structures and methods of manufacture
#1177Semiconductor device with island and associated leads
#1178Wavelength conversion member, molded body, wavelength conversion apparatus, sheet member, light emitting apparatus, light guide apparatus and display apparatus
#1179Semiconductor device
#1180Memories and memory components with interconnected and redundant data interfaces
#1181Power supply circuit and related methods for generating a power supply voltage in a semiconductor package
#1182Wafer level package for a mems sensor device and corresponding manufacturing process
#1183Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells
#1184Shielded electronic component package
#1185Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#1186Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
#1187Electrolyte for a solid-state battery
#1188Package with passive devices and method of forming the same
#1189Packages with Si-substrate-free interposer and method forming same
#1190Package-on-package semiconductor assemblies and methods of manufacturing the same
#1191Device with pillar-shaped components
#11923D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
#1193Package-on-package structures and methods for forming the same
#1194Package on package with integrated passive electronics method and apparatus
#1195Stacked semiconductor package having mold vias and method for manufacturing the same
#1196Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant
#1197Single-shot encapsulation
#1198Fan-out package and methods of forming thereof
#1199Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate
#1200Semiconductor device