212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Power semiconductor component with a power semiconductor chip and method for producing the same
#13502Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#13503Method for fabricating chip package structure
#13504Integrated circuit die with pedestal
#13505Semiconductor device with lead frames
#13506Memory card
#13507Semiconductor device including a DC-DC converter
#13508Folding chip planar stack package
#13509Semiconductor radiation source and light curing device
#13510Semiconductor device and memory card using the same
#13511Systems and methods for producing white-light light emitting diodes
#13512Semiconductor light-emitting device
#13513Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
#13514Connecting device for electronic components
#13515HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#13516Method of packaging integrated circuit devices using preformed carrier
#13517Separation method for cutting semiconductor package assemblage for separation into semiconductor packages
#13518Method for fabricating a BGA device and BGA device
#13519Manufacturing method of a package structure
#13520Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assembly
#13521Conductor composition, a mounting substrate and a mounting structure utilizing the composition
#13522Semiconductor device
#13523Light emitting device
#13524SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
#13525Stacked semiconductor device
#13526Stack package utilizing through vias and re-distribution lines
#13527Semiconductor device and a method of manufacturing the same
#13528Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#13529METHOD FOR MANUFACTURING PLASTIC PACKAGING OF MEMS DEVICES AND STRUCTURE THEREOF
#13530Semiconductor device
#13531Electronic component and its manufacturing method
#13532Accelerated B-Stage curing process for thermosetting resins and FBGA assembly process utilizing the accelerated B-Stage curing process
#13533Physical quantity sensor and lead frame used for same
#13534Power transistor and power semiconductor device
#13535Manufacturing method of a semiconductor device
#13536Power electronics equipments
#13537Method for producing semiconductor package
#13538Manufacturing method of semiconductor device
#13539Microelectronic devices and methods for manufacturing microelectronic devices
#13540OPTICAL COMMUNICATION MODULE
#13541Wavelength-converting casting composition and light-emitting semiconductor component
#13542Method for producing semiconductor components
#13543Carrierless chip package for integrated circuit devices, and methods of making same
#13544Aluminum bump bonding for fine aluminum wire
#13545Semiconductor device and method of manufacturing thereof
#13546Heat-radiating tape carrier package and method for manufacturing the same
#13547Power semiconductor module
#13548METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES
#13549Multichip module with improved system carrier
#13550Integrated circuit package system
#13551Multichip package system
#13552Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
#13553Semiconductor device
#13554Semiconductor device
#13555Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
#13556Leadless leadframe implemented in a leadframe-based BGA package
#13557Connecting a plurality of bond pads and/or inner leads with a single bond wire
#13558Chip package and wafer treating method for making adhesive chips
#13559Method for making QFN package with power and ground rings
#13560Vertical semiconductor power switch, electronic component and methods of producing the same
#13561Epoxy resin composition for encapsulating semiconductor and semiconductor device
#13562Resin composition and semiconductor device produced by using the same
#13563Method for fabricating a semiconductor package
#13564Method for manufacturing semiconductor device
#13565Silicone Adhesive
#13566Method for manufacturing light emitting diode package
#13567Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
#13568Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof
#13569RF power module
#13570MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
#13571Semiconductor device packaging
#13572Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
#13573Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
#13574Integrated circuit package on package system
#13575Integrated circuit package system having interconnect stack and external interconnect
#13576Semiconductor device and method of manufacturing the same
#13577Package structure for electronic device
#13578Gold-bumped interposer for vertically integrated semiconductor system
#13579Integrated circuit package system
#13580Integrated circuit package in package system
#13581Semiconductor package system with substrate having different bondable heights at lead finger tips
#13582Lead frame and light emitting device package using the same
#13583High power light emitting device assembly utilizing ESD protective means sandwiched between dual sub-mounts
#13584Integrated circuit leaded stacked package system
#13585Semiconductor chip package having a slot type metal film carrying a wire-bonding chip
#13586Ball grid array substrate having window and method of fabricating same
#13587Semiconductor device and method of manufacturing the same
#13588SiP module with a single sided lid
#13589Chip package and method for fabricating the same
#13590Layer between interfaces of different components in semiconductor devices
#13591SEMICONDUCTOR DEVICE WITH BATTERY
#13592Semiconductor device having capacitors for reducing power source noise
#13593Microelectromechanical microphone packaging system
#13594Microelectonic packages and methods therefor
#13595Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means
#13596Semiconductor package structure and method for manufacturing the same
#13597Method for designing semiconductor package, system for aiding to design semiconductor package, and computer program product therefor
#13598Sub-assembly
#13599MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#13600Semiconductor packaging method
#13601Electronic device
#13602Semiconductor device and method of manufacturing semiconductor device
#13603Manufacturing method for a solid-state imaging apparatus, and the solid-state imaging apparatus
#13604Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same
#13605Semiconductor device
#13606Semiconductor Chip For Driving Light Emitting Element, Light Emitting Device And Lighting Equipment
#13607Semiconductor device with semiconductor device components embedded in plastic package compound
#13608Stackable integrated circuit package system with multiple interconnect interface
#13609Semiconductor device with a semiconductor chip using lead technology and method of manufacturing the same
#13610Stacked integrated circuit package system
#13611Flip-Chip Device Having Underfill in Controlled Gap
#13612Stackable integrated circuit package system
#13613Thermally-enhanced ball grid array package structure and method
#13614Semiconductor device and semiconductor module therewith
#13615Power semiconductor device and method for producing it
#13616Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
#13617INTEGRATED CIRCUIT CHIP AND PACKAGE
#13618Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages
#13619No lead package with heat spreader
#13620Multi-row lead frame
#13621Semiconductor bulk resistance element
#13622Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device
#13623LED ASSEMBLY AND MANUFACTURING METHOD
#13624Light emitting device package and method of manufacturing the same
#13625Method for manufacturing thin film transistor
#13626Method of resin sealing electronic part
#13627Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface
#13628Manufacturing method of semiconductor device
#13629Manufacturing method of semiconductor device
#13630Semiconductor device and manufacturing the same
#13631Epoxy resin composition and semiconductor device
#13632Light emitting diode substrate, method of manufacturing the same, and liquid crystal display device using the same
#13633Light emitting device including adhesion layer
#13634Light emitting diode package structure having high light extraction efficiency and method of manufacturing the same
#13635Phosphor, production method thereof and light emitting instrument
#13636Integrated circuit package system with L-shaped leadfingers
#13637Integrated circuit package system with bonding lands
#13638Method for manufacturing semiconductor package capable of potting thermosetting resin while being heated
#13639Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same
#13640Semiconductor device
#13641Ball grid array package
#13642SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#13643Electronic circuit, a semiconductor device and a mounting substrate
#13644Substrate of chip package and chip package structure thereof
#13645Semiconductor package including transformer or antenna
#13646Integrated circuit package system with die on base package
#13647Stacked integrated circuit package-in-package system with recessed spacer
#13648Semiconductor module and method of manufacturing the same
#13649Semiconductor apparatus containing multi-chip package structures
#13650Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies
#13651Semiconductor pressure sensor and die for molding a semiconductor pressure sensor
#13652Method of manufacturing circuit device
#13653Electronic device and method of manufacturing the same
#13654Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
#13655Semiconductor chip package having an adhesive tape attached on bonding wires
#13656Wafer level chip packaging
#13657Integrated circuit package system with exposed interconnects
#13658Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules
#13659Integrated circuit package system with heat sink
#13660Connection structure and method for fabricating the same
#13661Method of fabricating a 3-D package stacking system
#13662Semiconductor device
#13663Semiconductor component with semiconductor chip and adhesive film, and method for its production
#13664Stacked chip semiconductor device and method for manufacturing the same
#13665Coreless substrate and manufacturing thereof
#13666Multi-chip module for battery power control
#13667COL-TSOP with nonconductive material for reducing package capacitance
#13668LED Illumination Apparatus and Card-Type LED Illumination Source
#13669OPTICAL COUPLING DEVICE
#13670Method for making a surface acoustic wave device package
#13671Method for producing a surface-mountable semiconductor component
#13672Method for manufacturing physical quantity sensor
#13673Method for fabricating semiconductor package
#13674Solder bump confinement system for an integrated circuit package
#13675BORATE CHLORIDE-BASED PHOSPHOR, AND LIGHT-EMITTING DIODE, FLUORESCENT LAMP AND PLASMA DISPLAY PANEL INCLUDING THE SAME
#13676Phosphor based light source component
#13677SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS
#13678Semiconductor device
#13679Plurality of devices attached by solder bumps
#13680Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
#13681Semiconductor device with an improved solder joint
#13682Semiconductor device having through contact blocks with external contact areas
#13683Module part
#13684Stacked integrated circuit package system with face to face stack configuration
#13685Semiconductor device package and methods for producing same
#13686Stacked semiconductor structure and fabrication method thereof
#13687Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#13688Lead frame including suspending leads having trenches formed therein
#13689Semiconductor device and manufacturing method thereof
#13690Semiconductor device, electronic device, and manufacturing method of the same
#13691Electronic module with stacked semiconductors
#13692Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same
#13693Electronic circuit module and method for fabrication thereof
#13694Interconnect substrate, semiconductor device, and method of manufacturing the same
#13695Wafer level chip scale package system
#13696INTEGRATED CIRCUIT SYSTEM WITH WAFERSCALE SPACER SYSTEM
#13697Method for manufacturing a surface mount device
#13698Fabrication of an integrated circuit package
#13699Method of packaging semiconductor die without lead frame or substrate
#13700Semiconductor arrangement
#13701Method of manufacturing semiconductor device
#13702Hybrid multilayer substrate and method for manufacturing the same
#13703Semiconductor device and method of manufacturing thereof
#13704Circuit device
#13705Low temperature co-fired ceramic module and method of manufacturing the same
#13706Wiring board and semiconductor apparatus
#13707Power semiconductor component having chip stack
#13708Semiconductor device
#13709Bonding pad structure
#13710Cascoded rectifier package
#13711Plastic ball grid array package with integral heatsink
#13712Thin integrated circuit device packages for improved radio frequency performance
#13713Integrated circuit underfill package system
#13714Semiconductor package
#13715Circuit board, semiconductor package having the same, and method of manufacturing the circuit board
#13716INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS
#13717Multi-chips module package and manufacturing method thereof
#13718Aluminum leadframes for semiconductor QFN/SON devices
#13719Semiconductor device
#13720Semiconductor light emitting device with transparent substrate and reflective slope
#13721Method of manufacturing multi-layer wiring board
#13722Manufacturing method of semiconductor device
#13723Methods for fabricating stiffeners for flexible substrates
#13724Semiconductor apparatus manufacturing method
#13725Mold flash removal process for electronic devices
#13726Semiconductor device and manufacturing method of them
#13727Semiconductor device sealed with electrical insulation sealing member
#13728Flip-attached and underfilled stacked semiconductor devices
#13729Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein
#13730Wafer level stack structure for system-in-package and method thereof
#13731Semiconductor device, interposer chip and manufacturing method of semiconductor device
#13732Low profile semiconductor system having a partial-cavity substrate
#13733Integrated circuit package system including wide flange leadframe
#13734In-line apparatus and method for manufacturing double-sided stacked multi-chip packages
#13735CHIP CARD MODULE
#13736Integrated circuit package system
#13737STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
#13738Padless die support integrated circuit package system
#13739Integrated circuit package system with multiple molding
#13740Adhesive film and method for forming metal film using same
#13741Circuit board and package structure thereof
#13742Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package
#13743Electronic component and method for its assembly
#13744Integrated circuit package system with image sensor system
#13745OVERMOLDED OPTICAL PACKAGE
#13746Dicing/die bonding film and method of manufacturing the same
#13747Nonvolatile memory system
#13748Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device
#13749Semiconductor chip package with attached electronic devices, and integrated circuit module having the same
#13750Integrated circuit having second substrate to facilitate core power and ground distribution
#13751Substrate and semiconductor device
#13752Thermally enhanced semiconductor package and method of producing the same
#13753Semiconductor wafer scale package system
#13754Managed memory component
#13755Semiconductor package with integrated heatsink and electromagnetic shield
#13756DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#13757Leadless lead-frame
#13758Low cost method to produce high volume lead frames
#13759Semiconductor package
#13760Semiconductor package structure and fabrication method thereof
#13761Semiconductor package and process for making the same
#13762CHIP PACKAGE WITH BUILT-IN CAPACITOR STRUCTURE
#13763CIRCUIT BOARD, CIRCUIT APPARATUS, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD
#13764Light emitting device and method for producing the same
#13765Camera module for compact electronic equipments
#13766Strip for integrated circuit packages having a maximized usable area
#13767Method of manufacturing light emitting apparatus
#13768Stacked module and manufacturing method thereof
#13769Method of manufacturing wiring substrate
#13770Semiconductor device package and method for manufacturing same
#13771Method for fabricating a flip chip system in package
#13772Packaged semiconductor device with dual exposed surfaces and method of manufacturing
#13773SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF
#13774Manufacturing method for white light emitting diode device including two step cure process
#13775Semiconductor device and electronic component module using the same
#13776Light-emitting diode device generating light of multi-wavelengths
#13777Light emitting device with blue light LED and phosphor components
#13778Semiconductor-element mounting substrate, semiconductor device, and electronic equipment
#13779Method for manufacturing mold type semiconductor device
#13780SEMICONDUCTOR PACKAGE HAVING IMPROVED SOLDER JOINT RELIABILITY AND METHOD OF FABRICATING THE SAME
#13781Structure of Ball Grid Array package
#13782Semiconductor device
#13783Circuit module
#13784Connecting module having passive components
#13785Dynamic quantity sensor
#13786Managed memory component
#13787Semiconductor device and a method of manufacturing the same
#13788Multi-chip ball grid array package and method of manufacture
#13789Integrated circuit package-in-package system
#13790Low profile managed memory component
#13791Stacked integrated circuit package-in-package system
#13792Multi-chip package system
#13793Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates
#13794Interconnected IC packages with vertical SMT pads
#13795Circuit board and electronic assembly
#13796Package structure of thin lead-frame
#13797Overhang integrated circuit package system
#13798Heterogeneously integrated microsystem-on-a-chip
#13799Semiconductor device
#13800SEMICONDUCTOR DEVICE