212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Semiconductor device
#13802Rounded contact fingers on substrate/PCB for crack prevention
#13803Method for manufacturing high-frequency module device
#13804Clipless and wireless semiconductor die package and method for making the same
#13805Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
#13806Wafer-level processing of chip-packaging compositions including bis-maleimides
#13807Method of fabricating leadframe based flash memory cards including singulation by straight line cuts
#13808Luminescent diode, fabrication method thereof, and backlight assembly having the same
#13809Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package
#13810Package structure and manufacturing method thereof
#13811Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
#13812Hidden plating traces
#13813Multi-die package and method for fabricating same
#13814Low stress stacked die packages
#13815Stacked die semiconductor package
#13816Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same
#13817Multichip leadframe package
#13818LED with compound encapsulant lens
#13819Test pads on flash memory cards
#13820Camera module fabrication method including the step of removing a lens mount and window from the mold
#13821Package method for flash memory card and structure thereof
#13822Compliant terminal mountings with vented spaces and methods
#13823Microelectronic packages and methods therefor
#13824Microelectronic devices and methods for manufacturing microelectronic devices
#13825Electronic circuit device and manufacturing method thereof
#13826Lighting system having lenses for light sources emitting rays at different wavelengths
#13827VISIBLE LIGHT COMMUNICATION ORIENTED ILLUMINATION DEVICE
#13828Semiconductor light emitting device and semiconductor light emitting apparatus
#13829Light-emitting diode emitting uniformly light all around
#13830Semiconductor device with semiconductor device components embedded in a plastic housing composition
#13831Vertical power semiconductor component, semiconductor device and methods for the production thereof
#13832Semiconductor device having a metal plate conductor
#13833Semiconductor device and method of manufacturing the same
#13834Multi-chip package sharing temperature-compensated self-refresh signal and method thereof
#13835Semiconductor device and method for producing the same
#13836Semiconductor device
#13837Semiconductor chip and semiconductor device
#13838Stacked packages with interconnecting pins
#13839Techniques for packaging multiple device components
#13840Semiconductor component including semiconductor chip and method for producing the same
#13841Microelectronic elements with compliant terminal mountings and methods for making the same
#13842Stack-type semiconductor package and manufacturing method thereof
#13843Package having exposed integrated circuit device
#13844Semiconductor device having semiconductor element, insulation substrate and metal electrode
#13845Electronic package with integral electromagnetic radiation shield and methods related thereto
#13846Compliant terminal mountings with vented spaces and methods
#13847Circuit board, semiconductor device, and manufacturing method of circuit board
#13848Semiconductor device and electronic control unit using the same
#13849Luminescent device and method for manufacturing the same
#13850Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device
#13851Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components
#13852Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
#13853Ribbon bonding in an electronic package
#13854Stackable molded packages and methods of making the same
#13855Method of making light emitting device having a molded encapsulant
#13856Light emitting device
#13857LED emitter with radial prismatic light diverter
#13858Integrated current sensor package
#13859Piezoelectric device
#13860Manufacturing method of optical electronic components and optical electronic components manufactured using the same
#13861Package for high power density devices
#13862Schottky Diode Device with Aluminum Pickup of Backside Cathode
#13863Semiconductor device comprising a vertical semiconductor component and method for producing the same
#13864Heat spreader and package structure utilizing the same
#13865SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#13866Semiconductor device with thermoplastic resin to reduce warpage
#13867Semiconductor device and manufacturing method of the same
#13868Packaging method of a plurality of chips stacked on each other and package structure thereof
#13869Device package
#13870Semiconductor package structure and method of manufacture
#13871Semiconductor package
#13872ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE
#13873HEAT FIXTURE FOR WIRE BONDING
#13874Electronics package with an integrated circuit device having post wafer fabrication integrated passive components
#13875Light-receiving module
#13876Multi-strand substrate for ball-grid array assemblies and method
#13877Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors
#13878Negative thermal expansion material filler for low CTE composites
#13879Wireless communication system
#13880Combination quad flat no-lead and thin small outline package
#13881Integrated circuit having bond pad with improved thermal and mechanical properties
#13882Space-efficient package for laterally conducting device
#13883Electronic member fabricating method and ic chip with adhesive material
#13884Printed circuit board having embedded electronic components and manufacturing method thereof
#13885Manufacturing method of optical electronic components and optical electronic components manufactured using the same
#13886Semiconductor device and mold for resin-molding semiconductor device
#13887Semiconductor device having a molded package
#13888Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device
#13889System-in-package structure
#13890Thermal enhanced upper and dual heat sink exposed molded leadless package
#13891Semiconductor device
#13892Microelectronic devices having a curved surface and methods for manufacturing the same
#13893Multichip stacking structure
#13894Multiple stacked die window csp package and method of manufacture
#13895Semiconductor chip mounted interposer, semiconductor device, semiconductor chip interposer fabrication method, bare chip mounted interposer, and interposer sheet
#13896Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same
#13897Flip chip MLP with conductive ink
#13898Structure and method for thin single or multichip semiconductor QFN packages
#13899Chip package structure
#13900DEVICE AND METHOD FOR ASSEMBLING A TOP AND BOTTOM EXPOSED PACKAGED SEMICONDUCTOR
#13901Substrate panel with plating bar structured to allow minimum kerf width
#13902Microelectromechanical component
#13903Surface processing agent for tin or tin alloy material
#13904Carbon nanotube reinforced metallic layer
#13905Adhesion by plasma conditioning of semiconductor chip surfaces
#13906Method and system for hermetically sealing packages for optics
#13907Microelectronic component assemblies having lead frames adapted to reduce package bow
#13908Method of making exposed pad ball grid array package
#13909Method for packaging microelectronic devices
#13910Light emitting device
#13911Sensor system having a substrate and a housing, and method for manufacturing a sensor system
#13912Semiconductor device and method of manufacturing the same
#13913Semiconductor device and method of manufacturing the same
#13914Metal core, package board, and fabricating method thereof
#13915Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes
#13916Microelectronic package having a stiffening element and method of making same
#13917Leadless semiconductor package and method of manufacture
#13918Method of manufacturing a semiconductor package using lead frame having through holes or hollows therein
#13919Semiconductor device and method of manufacturing the same
#13920SEMICONDUCTOR DEVICE
#13921High-power LED chip packaging structure and fabrication method thereof
#13922Light emitting device
#13923White light emitting diode
#13924High-temperature solder, high-temperature solder paste and power semiconductor using same
#13925Semiconductor device having high frequency components and manufacturing method thereof
#13926Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing
#13927Individualized low parasitic power distribution lines deposited over active integrated circuits
#13928Method of making semiconductor package having exposed heat spreader
#13929Method for packaging a semiconductor device
#13930Radio-frequency system in package including antenna
#13931Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method
#13932Dicing and die bonding adhesive tape
#13933Intermediate connection for flip chip in packages
#13934Semiconductor packages having leadframe-based connection arrays
#13935Circuit substrate and method of manufacture
#13936Semiconductor integrated circuit
#13937SEMICONDUCTOR DEVICE
#13938Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices
#13939Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
#13940Flip-chip semiconductor device manufacturing method
#13941Semiconductor component and method of manufacture
#13942Liquid epoxy resin composition
#13943Light emitting device with blue light LED and phosphor components
#13944Semiconductor package with heat sink, stack package using the same and manufacturing method thereof
#13945Semiconductor package structure and method of manufacture
#13946Semiconductor device and method of manufacturing the same
#13947Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing
#13948Packaged device and method of forming same
#13949Interconnecting element between semiconductor chip and circuit support and method
#13950Semiconductor package form within an encapsulation
#13951Stackable semiconductor package and method for its fabrication
#13952Integrated circuit stacking system with integrated passive components
#13953Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides
#13954Integrated circuit package system with lead structures including a dummy tie bar
#13955Semiconductor device having a heat spreader exposed from a seal resin
#13956Ultra-thin quad flat no-lead (QFN) package
#13957Semiconductor devices including voltage switchable materials for over-voltage protection
#13958Method for manufacturing a microelectromechanical component, and a microelectromechanical component
#13959High efficiency phosphor for use in LEDs
#13960Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof
#13961White LED illumination device
#13962Charge compensated nitride phosphors for use in lighting applications
#13963Optical element sealing structure, optical coupler, and optical element sealing method
#13964Semiconductor die package using leadframe and clip and method of manufacturing
#13965Micromechanical pressure sensor system
#13966Method of fabricating an exposed die package
#13967Integrated circuit package system with heat sink
#13968Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure
#13969Method of forming a leaded molded array package
#13970Micro chip-scale-package system
#13971Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate
#13972Method of manufacturing a semiconductor device
#13973INTEGRATED CIRCUIT PACKAGE SYSTEM
#13974Reversible leadless package and methods of making and using same
#13975Resin-sealing and molding apparatus of optical device
#13976Semiconductor device
#13977Flashlights utilizing unique LED light sources
#13978Integrated circuit package system with channel
#13979INTEGRATED CIRCUIT PACKAGE SYSTEM
#13980Wafer scale heat slug system
#13981Fluorescent substance
#13982Semiconductor device and method for producing it, and use of an electrospinning method
#13983Semiconductor device
#13984INTEGRATED CIRCUIT PACKAGE SYSTEM
#13985Semiconductor chip having bond pads
#13986Semiconductor chip having bond pads
#13987Package and package module of the package
#13988Bumped chip carrier package using lead frame and method for manufacturing the same
#13989Stacked integrated circuit leadframe package system
#13990Integrated circuit package system including ribbon bond interconnect
#13991Semiconductor device
#13992Semiconductor chip package with a metal substrate and semiconductor module having the same
#13993Low voltage drop and high thermal performance ball grid array package
#13994Integrated circuit package system using heat slug
#13995Method for fabricating semiconductor package
#13996Semiconductor package system with thermal die bonding
#13997Integrated circuit package system with mold clamp line critical area having widened conductive traces
#13998Integrated circuit package system with a heat sink
#13999Integrated circuit package system including shield
#14000Offset integrated circuit package-on-package stacking system
#14001Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same
#14002Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
#14003Semiconductor package that includes stacked semiconductor die
#14004Method for fabricating semiconductor package with stacked chips
#14005Semiconductor device and method of manufacturing the same
#14006Integrated circuit package to package stacking system
#14007Integrated circuit leadless package system
#14008Integrated circuit package system with multi-planar paddle
#14009Etched leadframe flipchip package system
#14010Thermally enhanced power semiconductor package system
#14011Semiconductor device
#14012Semiconductor chip having bond pads
#14013Stackable power semiconductor package system
#14014Light-emitting diode with UV-blocking nano-particles
#14015Three wavelength LED structure
#14016Semiconductor device, fabrication method therefor, and film fabrication method
#14017Manufacturing method of semiconductor device and semiconductor device
#14018Micro lead frame packages and methods of manufacturing the same
#14019Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
#14020BRACE FOR WIRE LOOP
#14021Packaging methods
#14022Nitride semiconductor light emitting device and method for manufacturing the same
#14023Heat resistant masking tape
#14024Liquid epoxy resin composition
#14025Liquid epoxy resin composition
#14026White light LED production method
#14027White light emitting device
#14028Mm-wave antenna using conventional IC packaging
#14029Constant voltage diode
#14030Semiconductor device and method of manufacturing the same
#14031Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device
#14032Reduction of macro level stresses in copper/low-K wafers
#14033Coupling substrate for semiconductor components and method for producing the same
#14034Method for making stacked integrated circuits (ICs) using prepackaged parts
#14035Multi-stack chip package with wired bonded chips
#14036IC card with bonding wire connections of different lengths
#14037IC card
#14038Electrode package for semiconductor device
#14039Lead arrangement and chip package using the same
#14040Low profile semiconductor package
#14041IC card
#14042CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#14043Power module having at least two substrates
#14044Manufacturing method for magnetic sensor and lead frame therefor
#14045Methods and apparatus for Flip-Chip-On-Lead semiconductor package
#14046Ultrathin leadframe BGA circuit package
#14047Semiconductor package with redistributed pads
#14048Method of making stacked die package
#14049Method of manufacturing flash memory cards
#14050Fabrication method for a chip packaging structure
#14051Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device
#14052Device for making an in-mold circuit
#14053METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD
#14054Board on chip package and method of manufacturing the same
#14055Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the same
#14056Chip stack structure having shielding capability and system-in-package module using the same
#14057Semiconductor device with inclined through holes
#14058Printed wiring board
#14059Semiconductor device and manufacturing method thereof
#14060Semiconductor device
#14061Package device with electromagnetic interference shield
#14062Electronic-part built-in substrate and manufacturing method therefor
#14063Active device bases and leadframes utilizing the same
#14064Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture
#14065Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die
#14066Methods for a multiple die integrated circuit package
#14067Integrated circuit package system including high-density small footprint system-in-package
#14068Semiconductor unit, and power conversion system and on-vehicle electrical system using the same
#14069Packaging for high speed integrated circuits
#14070Substrate frame
#14071Integrated circuit packaging
#14072Multiple die integrated circuit package
#14073Three-dimensionally integrated electronic assembly
#14074Wavelength converter, lighting system, and lighting system assembly
#14075Led device
#14076Relay module and electrical component unit
#14077Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
#14078METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY
#14079Semiconductor component and method for production of a semiconductor component
#14080Method for manufacturing a semiconductor device
#14081Method of making light emitting device with silicon-containing encapsulant
#14082Embedded inductor and application thereof
#14083Embedded inductor element and chip package applying the same
#14084Semiconductor device and power supply device using the same
#14085Semiconductor mount substrate, semiconductor device and method of manufacturing semiconductor package
#14086Semiconductor device with improved encapsulation
#14087Integrated circuit package encapsulating a hermetically sealed device
#14088Semiconductor device with reduced package cross-talk and loss
#14089Semiconductor chip package and fabrication method thereof
#14090Semiconductor device and method for producing the same
#14091Semiconductor package with controlled solder bump wetting
#14092Closed loop thermally enhanced flip chip BGA
#14093Integrated chip device in a package
#14094Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking
#14095Semiconductor component and methods to produce a semiconductor component
#14096Circuit device and method of manufacturing the same
#14097Semiconductor structure and method of assembly
#14098Semiconductor structure and method of manufacture
#14099Multi-chip package structure
#14100Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages