Lead frame having outer leads coated with a four layer plating

Production process for manufacturing such semiconductor package

Leadframes for improved moisture reliability of semiconductor devices

Electronic module and method of assembling the same

Thin package system with external terminals

Semiconductor devices with multiple heat sinks

Light emitting device

Adhesive composition and sheet having an adhesive layer of the composition

Semiconductor device and method for manufacturing thereof

Method of producing image display unit

Method for applying a structure of joining material to the back surfaces of semiconductor chips

CHIP PACKAGE METHOD

Method of improving power distribution in wirebond semiconductor packages

Liquid crystal display apparatus

PHOSPHOR, LIGHT EMITTING DEVICE USING PHOSPHOR, AND DISPLAY AND LIGHTING SYSTEM USING LIGHT EMITTING DEVICE

Resin sealing and molding method of electronic component

Encapsulation of a chip module

Re-enforced ball-grid array packages for semiconductor products

Power semiconductor device in lead frame employing connecting element with conductive film

Integrated circuit package system using etched leadframe

Semiconductor insulation structure

Stack structure of carrier board embedded with semiconductor components and method for fabricating the same

Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside

Semiconductor device and fabrication method thereof

Conductor substrate, semiconductor device and production method thereof

Semiconductor package with position member

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

Semiconductor assembly for improved device warpage and solder ball coplanarity

Light emitting device and fluorescent material

Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same

Integrated circuit support structures and their fabrication

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

Electronic component packaging structure and method for producing the same

Semiconductor device

Universal chip package structure

Manufacturing method for semiconductor device

Arrangement of conductive pads on grid array package and on circuit board

Electronic apparatus

Semiconductor module having a coupling substrate, and methods for its production

Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Integrated circuit package system

Semiconductor packaging process and carrier for semiconductor package

Semiconductor package having an interfacial adhesive layer

Lead frame package structure with high density of lead pins arrangement

Phosphor, light emitting device by using the same and manufacturing method of the same

Wiring board, semiconductor device, and method of manufacturing the same

Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same

Microelectronic package having multiple conductive paths through an opening in a support substrate

Semiconductor device and a manufacturing method of the same

Microelectronic packages and methods therefor

Power semiconductor module

Module type multiphase inverter

Magnetic device having a conductive clip

Power module with a magnetic device having a conductive clip

Method of forming a magnetic device having a conductive clip

Relay board and semiconductor device having the relay board

Electronic device and manufacturing method of the same

Semiconductor device

Solder joint intermetallic compounds with improved ductility and toughness

Semiconductor chip and semiconductor device

Electronic device, semiconductor device using same, and method for manufacturing semiconductor device

Semiconductor device having metallic lead and electronic device having lead frame

Semiconductor device and semiconductor device production method

Semiconductor device and a manufacturing method of the same

Method of forming a molded array package device having an exposed tab and structure

Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die

Integrated circuit package system with multi-surface die attach pad

LIGHT EMITTING DIODE AND THE PACKAGE STRUCTURE THEREOF

Printed circuit board and manufacturing method thereof

Metal salts of quinolinols and quinolinol derivatives as corrosion inhibitors

Metal salts of quinolinols and quinolinol derivatives in curable compositions

Method of assembly for multi-flip chip on lead frame on overmolded IC package

Semiconductor device and method for manufacturing the same

Die package and method for making the same

PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE

Method and system for hermetically sealing packages for optics

Light emitting device package and backlight unit using the same

Semiconductor device with improved design freedom of external terminal

Stacked die semiconductor package

Packaged die on PCB with heat sink encapsulant and methods

Cavity chip package

Package of leadframe with heatsinks

Molded semiconductor package

Optoelectronics processing module and method for manufacturing thereof

Semiconductor device with a resin-sealed optical semiconductor element

Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film

Electronic plug unit

Semiconductor manufacturing method

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Method for manufacturing an adhesive substrate with a die-cavity sidewall

Method for manufacturing substrate with cavity

Method of forming a semiconductor device

Method for manufacturing substrate with cavity

THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Wire sweep resistant semiconductor package and manufacturing method therefor

Display device and manufacturing method of the same

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

Method of encapsulating packaged microelectronic devices with a barrier

SEMICONDUCTOR DEVICE

Semiconductor package with internal shunt resistor

BGA package with stacked semiconductor chips and method of manufacturing the same

Integrated circuit protruding pad package system

Integrated circuit package system with adhesive restraint

Semiconductor package

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Method for manufacturing electronic modules

INDUCTIVE STRUCTURE

Rigid-flexible printed circuit board for package on package and manufacturing method

Manufacturing method of a semiconductor device to suppress generation of whiskers

Semiconductor package with a support structure and fabrication method thereof

Method of manufacturing quad flat non-leaded semiconductor package

Semiconductor Light Emitting Device

Semiconductor chip having bond pads

Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor package

Method of manufacturing a semiconductor device

Electronic device and manufacturing method therefor

Semiconductor device having metallic plate with groove

External contact material for external contacts of a semiconductor device and method of making the same

Semiconductor package having plate interconnections

Semiconductor chip having bond pads and multi-chip package

Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof

Multi-part lead frame with dissimilar materials

Multi-part lead frame with dissimilar materials

Structure of IC packaging and method forming the same

Semiconductor device and automotive AC generator

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES

Multi-chip stack structure

Carrier-free semiconductor package with stand-off member and fabrication method thereof

Electronic circuit module and manufacturing method thereof

Support with solder ball elements and a method for populating substrates with solder balls

Electronic device and method of manufacturing same

Semiconductor package and manufacturing method thereof

THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME

Multi-chip stacking package structure

MATRIX PACKAGE SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND MOLDING PROCESS THEREOF

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and method of manufacturing the same

Semiconductor device, lead frame used in the semiconductor device and electronic equipment using the semiconductor device

Resin mold type semiconductor device

Semiconductor package with a conductive post and wiring pattern

Die pad for semiconductor packages and methods of making and using same

Metal contact systems for semiconductor-based pressure sensors exposed to harsh chemical and thermal environments

Stack type package module and method for manufacturing the same

Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives

Semiconductor device and method of packaging the same

Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness

Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices

Stacked chip package using photosensitive polymer and manufacturing method thereof

Multi-chip package type semiconductor device

Thin film led

Semiconductor module

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device

Surface acoustic wave device and manufacturing method thereof

Computing device including a stacked semiconductor device

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Semiconductor packages for surface mounting and method of producing same

Ball grid array interface structure and method

Stacked chip package using warp preventing insulative material and manufacturing method thereof

Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices

Microfeature workpiece substrates having through-substrate vias, and associated methods of formation

Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader

Land grid array semiconductor device packages

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

Semiconductor device and manufacturing method thereof

STACKING SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF

Reversible-multiple footprint package and method of manufacturing

Lead frame-based semiconductor device packages incorporating at least one land grid array package

Power semiconductor device having lines within a housing

Light emitting diode package with diffuser and method of manufacturing the same

Substrate-based white light diode

Light source with UV LED and UV reflector

Semiconductor device and method of manufacturing the same

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Method for producing semiconductor device and semiconductor device

Liquid crystal display device and manufacturing method thereof

High CRI LED lamps utilizing single phosphor

Printed circuit board and method thereof and a solder ball land and method thereof

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Thermally enhanced cavity down ball grid array package

Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features

Heat-conducting packaging of electronic circuit units

Underfilled semiconductor die assemblies and methods of forming the same

Semiconductor component comprising an interposer substrate

Power semiconductor device comprising a semiconductor chip stack and method for producing the same

Semiconductor device

Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly

Semiconductor device

MOSFET package

MOSFET package

Leadframe package with dual lead configurations

High current semiconductor device system having low resistance and inductance

Bi-directional switch, and use of said switch

Semiconductor connection component

Applicant screening

METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY

Method and apparatus for fine pitch solder joint

Semiconductor device and a manufacturing method of the same

Multichip packages with exposed dice

Method and device for attaching a chip in a housing

Semiconductor device, laminated semiconductor device, and wiring substrate

Semiconductor device with improved contacts

Semiconductor component and method of manufacture

Mount for a programmable electronic processing device

Multi-chip semiconductor device package

Stack structure with semiconductor chip embedded in carrier

Printed circuit board, semiconductor package and multi-stack semiconductor package using the same

Thin IC package for improving heat dissipation from chip backside

Semiconductor module

Semiconductor device and a manufacturing method of the same

Method of fabrication for chip scale package for a micro component

Method for fabricating wafer level semiconductor package with build-up layer

Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same

Integrated circuit package structure with gap through lead bar between a die edge and an attachment point corresponding to a conductive connector

Package frame and semiconductor package using the same

Semiconductor assembly and packaging for high current and low inductance

Capacitive element, method of manufacture of the same, and semiconductor device

Microelectronic imaging units

Diode housing

Phosphor-converted LED devices having improved light distribution uniformity

Photosensitive device that easily achieves a required photosensitive response

Circuit board and manufacturing method thereof

Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side

Method and apparatus for removing encapsulating material from a packaged microelectronic device

Packaged integrated circuit having a heat spreader and method therefor

Apparatuses and methods facilitating functional block deposition

Solder composition for electronic devices

LED package having recess in heat conducting part

LIGHT-EMITTING MODULE AND LIGHT-EMITTING UNIT

Multi-wavelength LED provided with combined fluorescent materials positioned over and underneath the LED component

Method for fabricating semiconductor package with heat sink

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Package module having a stacking platform

SEMICONDUCTOR DEVICE

Chip-sized flip-chip semiconductor package and method for making the same

Multilayered circuit substrate and semiconductor package structure using the same

Stack package implementing conductive support

Semiconductor pressure sensor

SEMICONDUCTOR DEVICE

Jig structure for manufacturin a stacked memory card

Application of autonomic self healing composites to integrated circuit packaging

Semiconductor device

Enhanced multi-die package

Radio frequency over-molded leadframe package

Light-emitting diode and vehicular lamp

Light emitting chip carrier structure

Semiconductor device

Physical quantity sensor and manufacturing method therefor

Semiconductor device and method of manufacturing the same

Method of making a stacked die package

Roll-to-roll fabricated encapsulated semiconductor circuit devices

Roll-to-roll fabricated electronically active device

Methods of bonding two semiconductor devices

Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

Laminated electronic component and method for producing the same

Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure

Semiconductor package

Dual BGA alloy structure for improved board-level reliability performance

Semiconductor device, power amplifier device and PC card

Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device

Semiconductor device having capacitors for reducing power source noise

Multi-chip semiconductor package featuring wiring chip incorporated therein, and method for manufacturing such multi-chip semiconductor package

METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE

Packaged integrated circuit with enhanced thermal dissipation

Semiconductor package and manufacturing method thereof

Package structure having recession portion on the surface thereof and method of making the same

Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package

Method of forming a connecting conductor and wirings of a semiconductor chip

Method and apparatus for attaching microelectronic substrates and support members

Method of manufacturing electronic circuit device

Semiconductor device having a ferroelectric capacitator

Packaging method for segregating die paddles of a leadframe

Low pass filter and electronic device

Magnetic sensor

Oxynitride phosphor and light-emitting instrument

Connection element for a semiconductor component and method for producing the same

Method and apparatus for attaching microelectronic substrates and support members

Wafer-level-chip-scale package and method of fabrication

Reduced inductance in ball grid array packages

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Ball grid array package and substrate within

Semiconductor chip package

Wiring substrate and semiconductor package implementing the same

Electronic component and electronic configuration

Packaging for high speed integrated circuits

Semiconductor device and method of manufacturing the same

Stacked semiconductor package having adhesive/spacer structure and insulation

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits