Packaging for high speed integrated circuits

Semiconductor package without chip carrier and fabrication method thereof

Large die package structures and fabrication method therefor

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Side view LED with improved arrangement of protection device

CIRCUIT BOARD STRUCTURE AND METHOD FOR FABRICATING THE SAME

Fabrication method of semiconductor circuit device

Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same

Adhesive/spacer island structure for multiple die package

Method of resin-sealing and molding an optical device

Bumped die and wire bonded board-on-chip package

Semiconductor device and a manufacturing method of the same

ELECTRONIC MODULE WITH STACKED IC CHIP STRUCTURE

Electronic component unit

Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation

Tape wiring substrate and chip-on-film package using the same

MEMS packaging method for enhanced EMI immunity using flexible substrates

Chip package without core and stacked chip package structure thereof

Packaging of a microchip device

Package substrate and semiconductor package using the same

Semiconductor package having pre-plated leads and method of manufacturing the same

MEMS package using flexible substrates, and method thereof

Electro-optical circuitry having integrated connector and methods for the production thereof

Direct FET device for high frequency application

GaN-based light emitting-diode chip and a method for producing same

White semiconductor light emitting device

Camera module fabrication method including singulating a substrate

Package structure for a semiconductor device incorporating enhanced solder bump structure

Integrated circuit for driving semiconductor device and power converter

Wire-bonding method and semiconductor package using the same

SEMICONDUCTOR PACKAGE WITH MOLDED BACK SIDE AND METHOD OF FABRICATING THE SAME

Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna

Ball grid array package enhanced with a thermal and electrical connector

Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure

Surface mount package

Method for manufacturing semiconductor chip package

Lead frame, resin-encapsulated semiconductor device, and method of producing the same

Optical package with double formed leadframe

Method of providing an optoelectronic element with a non-protruding lens

Semiconductor sensor and manufacturing method therefor

White-Light Emitting Device

Phosphor and light-emitting equipment using phosphor

RFID tag and manufacturing method thereof

Substrate warpage control and continuous electrical enhancement

Packaging method for circuit board

Method of reducing warpage in an over-molded IC package

METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE

Semiconductor device manufacturing method

Optical module and optical transmission device

Capacitor mounting type inverter unit having a recessed cover

Semiconductor device with semiconductor device components embedded in a plastics composition

Semiconductor device with improved signal transmission characteristics

Stacked semiconductor package

Adhesive layer forming a capacitor dielectric between semiconductor chips

BUMP FOR OVERHANG DEVICE

Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom

Anti-warp heat spreader for semiconductor devices

Semiconductor device and method of manufacturing the same

System and method for venting pressure from an integrated circuit package sealed with a lid

Apparatus having reduced warpage in an over-molded IC package

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Semiconductor memory device and manufacturing method thereof

Semiconductor die package and method for making the same

Semiconductor device and package, and method of manufacturer therefor

Multi-part lead frame with dissimilar materials

Semiconductor device

Die package with asymmetric leadframe connection

Semiconductor device

Assembly method for semiconductor die and lead frame

Methods of operating electronic devices, and methods of providing electronic devices

Ultrathin semiconductor circuit having contact bumps

Spacer die structure and method for attaching

Method of manufacturing a semiconductor device

Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer

Standoffs for centralizing internals in packaging process

Method of fabricating a stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Stacked die in die BGA package

Heat-dissipating semiconductor package and fabrication method thereof

Optical device and method for manufacturing the same, optical module, and optical transmission device

Light emitting module and lighting unit for vehicle

Molded stiffener for thin substrates

Multi-chip device and method for producing a multi-chip device

Intrinsic thermal enhancement for FBGA package

Packaging logic and memory integrated circuits

Stacked memory card and method for manufacturing the same

Alignment using fiducial features

Reliable integrated circuit and package

Lead frame for semiconductor package

Semiconductor device

Semiconductor device having firmly secured heat spreader

Semiconductor device and system having semiconductor device mounted thereon

Signal isolation in a package substrate

Substrate structure and the fabrication method thereof

Adhesive tape for electronic components

Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material

Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board

Chip-on-board assemblies

Semiconductor device and circuit board

Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same

CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies

Module with built-in component

Module having stacked chip scale semiconductor packages

System for hermetically sealing packages for optics

Package structure of chip and the package method thereof

Lead frame structure with aperture or groove for flip chip in a leaded molded package

Chip-package structure and fabrication process thereof

Electronic component comprising a cooling surface

Power semiconductor module

Light emitting diode device using electrically conductive interconnection section

Light emitting diode package with metal reflective layer and method of manufacturing the same

Side-emitting LED package and manufacturing method of the same

Light emitting diode with larger illumination area

Red garnet phosphors for use in LEDs

Light emitting device and phosphor for the same

Curable composition and process for producing cured fluorinated product

Lead-frame type semiconductor package and lead frame thereof

White LED

Soldered assemblies and methods of making the same

Ball grid array package with thermally-enhanced heat spreader

Method of manufacturing semiconductor device with improved design freedom of external terminal

Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof

Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Microelectronic loop packages

Leadless semiconductor package

Light module

Electronic circuit protection device

Circuit assembly with surface-mount IC package and heat sink

Image display device and light emission device

Semiconductor light-emitting device with wavelength change material

Power unit

Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film

Substrate structure of semiconductor package

Semiconductor package and fabrication method thereof

Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant

Assembly structure and method for chip scale package

Semiconductor device

Lead frame with attached components

Source contact and metal scheme for high density trench MOSFET

Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip

Side-emitting LED package and method of manufacturing the same

Wiring board and method for manufacturing the same

Semiconductor device mounting chip having tracing function

Memory module, cache system and address conversion method

Surface mount type semiconductor device and method of manufacturing the same

Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part

Method of forming overhang support for a stacked semiconductor device

Method of making semiconductor BGA package having a segmented voltage plane

Method of assembling semiconductor devices with LEDs

Method for attaching dice to a package and arrangement of dice in a package

Protection circuit

Methods for packaging an image sensor and a packaged image sensor

Electric component with a protected current feeding terminal

Fuse element with trigger assistance

Epoxy bump for overhang die

Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging

Semiconductor element and manufacturing method thereof

Semiconductor device

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Semiconductor device having capacitive insulation means and communication terminal using the device

Circuit device and method of manufacturing the same

Power module package structure

Semiconductor device

Varied-thickness heat sink for integrated circuit (IC) package

Semiconductor BGA package having a segmented voltage plane

System for assembling electronic components of an electronic system

Stacked semiconductor package assembly having hollowed substrate

Image sensitive electronic device packages

Semiconductor device

Method for efficiently producing removable peripheral cards

Tab package connecting host device element

Lead frame, semiconductor device, method for producing semiconductor device, and injection mold

Methods of making integrated circuits

Solder joints for copper metallization having reduced interfacial voids

Light emitting apparatus and method of manufacturing the same

High power light emitting diode package and fabrication method thereof

Light source with a light-emitting element

White light emitting device

Chip package and wire bonding process thereof

Panel and semiconductor device having a composite plate with semiconductor chips

Semiconductor device

System and method for die attach using a backside heat spreader

Semiconductor package and leadframe therefor having angled corners

Analog data-input device provided with a pressure sensor of a microelectromechanical type

CHIP PACKAGE STRUCTURE

Methods and apparatuses for encapsulating microelectronic devices

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Wafer level pre-packaged flip chip systems

Multi-chip module and methods

Semiconductor device and method for manufacturing the same

Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same

Wafer level pre-packaged flip chip

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

Multilayer module and method of manufacturing the same

SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same

Stacked chip package with redistribution lines

LED package structure and method making of the same

System-in-a-package based flash memory card

Semiconductor package and stack arrangement thereof

Leadframeless package structure and method

Solid element device and method for manufacturing the same

Base structure for light emitting device and light emitting device using the same

Semiconductor light source device

Light emitting device package and method for manufacturing the same

Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material

Wafer level pre-packaged flip chip

Method and system for solder die attach

Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device

Wafer-level electro-optical semiconductor manufacture fabrication method

Offset integrated circuit package-on-package stacking system

Integrated circuit package including miniature antenna

Illumination system comprising a radiation source and a fluorescent material

Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly

Wafer level pre-packaged flip chip system

Packaging structure and method

Flip chip package having protective cap and method of fabricating the same

Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection

Semiconductor module provided with contacts extending through the package

Lid used in package structure and the package structure having the same

Composite multi-layer substrate and module using the substrate

Lead frame and resin-encapsulated semiconductor device

Lead-free semiconductor device

Semiconductor device with sealed semiconductor chip

Method for encapsulating a semiconductor device and semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor component in a housing with mechanically inforcing flat conductor webs

Light emitting element mounting frame and light emitting device

Radiation emitting semiconductor component with luminescent conversion element

Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device

Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame

Au alloy bonding wire

Multiple chip package module including die stacked over encapsulated package

Semiconductor device and fabrication method thereof

Semiconductor device with substrate having penetrating hole having a protrusion

Large die package and method for the fabrication thereof

Stacked package semiconductor module having packages stacked in a cavity in the module substrate

SEMICONDUCTOR PACKAGE HAVING ULTRA-THIN THICKNESS AND METHOD OF MANUFACTURING THE SAME

Light emitting device

Multi-wavelength white light emitting diode

Manufacturing method of solid-state image sensing device

Method of mounting an electronic component

Multi-chip module and method of manufacture

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Semiconductor package with controlled solder bump wetting and fabrication method therefor

Method for fabricating a semiconductor device having a heat radiation layer

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Semiconductor device

Three dimensional packaging optimized for high frequency circuitry

Semiconductor power module package

Power switching control device for electric systems

Memory packages having stair step interconnection layers

Electronic component and electronic configuration

Microelectronic component and assembly having leads with offset portions

Method of manufacturing a semiconductor apparatus

Semiconductor device with a rewiring level and method for producing the same

Circuit board with built-in electronic component and method for manufacturing the same

Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides

Surface-mountable light-emitting diode light source and method of producing a light-emitting diode light source

Semiconductor light emitting device

WHITE LIGHT EMITTING DIODE DEVICE

Light emitting diode lamp and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Method of manufacturing a semiconductor device

Semiconductor device with terminals, and method of manufacturing the same

Method of making a multi-chip electronic package having laminate carrier

Integrated circuit package and method for producing it

Optical module and method for manufacturing same

Projector-type lamp unit for vehicle

Vehicle headlamp

Circuit device

Regulator

Piezoelectric oscillator, manufacturing method thereof, and electronic device

Semiconductor die edge reconditioning

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Standoffs for centralizing internals in packaging process

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

Device packages having a III-nitride based power semiconductor device

Lead frame for semiconductor package and method of manufacturing the same

Semiconductor substrate

Semiconductor device having surface mountable external contact areas and method for producing the same

Substrate for mounting electronic part and electronic part

Multilayer printed wiring board

Leadframe with encapsulant guide and method for the fabrication thereof

Method of forming a substrateless semiconductor package

Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Coolant cooled type semiconductor device

Semiconductor device and manufacturing method thereof

Non-cavity semiconductor packages

BGA semiconductor chip package and mounting structure thereof

Semiconductor package accomplishing fan-out structure through wire bonding

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Multilevel semiconductor module and method for fabricating the same