212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same
#15602Semiconductor device and method of manufacturing the same
#15603Semiconductor constructions
#15604Semiconductor package including a semiconductor device, and method of manufacturing the same
#15605Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#15606Circuit apparatus provided with asperities on substrate surface
#15607Sensor equipment having sensing portion and method for manufacturing the same
#15608Circuit board
#15609Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives
#15610Method for encapsulating multiple integrated circuits
#15611Light emitting device with blue light led and phosphor components
#15612Light emitting diode
#15613Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#15614Unmolded package for a semiconductor device
#15615Prefabricated semiconductor chip carrier
#15616Device mounting board and semiconductor apparatus using the same
#15617Apparatus for molding a semiconductor die package with enhanced thermal conductivity
#15618Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
#15619Ground plane for integrated circuit package
#15620Memory card with a cap having indented portions
#15621Semiconductor device and manufacturing method therefor
#15622Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
#15623Semiconductor package having integrated metal parts for thermal enhancement
#15624Light-emitting diode
#15625Semiconductor light emitting device and semiconductor light emitting unit
#15626Sensor device having molded signal-outputting portion
#15627Optoelectronic apparatus with a shielding cage, and methods for production of an optoelectronic apparatus with a shielding cage.
#15628Compound semiconductor device and manufacturing method thereof
#15629Chip scale package with open substrate
#15630Encapsulation for particle entrapment
#15631Light emitting diode with fluorescent material
#15632Manufacturing method of semiconductor device
#15633Image pickup device and production method thereof
#15634Package and method for packaging an integrated circuit die
#15635High density multilayer circuit module
#15636Vertical conduction power electronic device package and corresponding assembling method
#15637Embedded chip semiconductor having dual electronic connection faces
#15638High density chip scale leadframe package and method of manufacturing the package
#15639Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus
#15640Compound semiconductor device and manufacturing method thereof
#15641Led lamp including a plurality of led chips
#15642Circuit device
#15643Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same
#15644Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
#15645Method of making photolithographically-patterned out-of-plane coil structures
#15646Apparatus, device and method for emitting output light using group IIB element selenide-based phosphor material and/or thiogallate-based phosphor material
#15647Optimized driver layout for integrated circuits with staggered bond pads
#15648Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same
#15649Apparatus and method for wire bonding and die attaching
#15650Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell
#15651Semiconductor device
#15652Ribbon bonding in an electronic package
#15653Stacked semiconductor package having adhesive/spacer structure and insulation
#15654Ball grid array housing having a cooling foil
#15655Conductor device and method of manufacturing thereof
#15656High-voltage module and method for producing same
#15657Package for sealing an integrated circuit die
#15658Adhesive/spacer island structure for stacking over wire bonded die
#15659Semiconductor equipment having multiple semiconductor devices and multiple lead frames
#15660Low thermal resistance light emitting diode
#15661Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
#15662Corrosion resistance enhancement of tin surfaces
#15663Manufacturing method of semiconductor device
#15664Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units
#15665Encapsulated chip and method of fabrication thereof
#15666Method of fabricating an encapsulated chip and chip produced thereby
#15667Wiring substrate and method of fabricating the same
#15668Mold compound with fluorescent material and a light-emitting device made therefrom
#15669Circuit device and manufacturing method thereof
#15670Method of manufacturing semiconductor device and support structure for semiconductor substrate
#15671Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier
#15672Method for manufacturing circuit device
#15673Circuit device and manufacturing method thereof
#15674Integrated circuit package with optimized mold shape
#15675Circuit device and manufacturing method thereof
#15676Interposer substrate, semiconductor package and semiconductor device, and their producing methods
#15677Method of fabricating a semiconductor device used in a stacked-type semiconductor device
#15678Semiconductor device and manufacturing process therefor
#15679Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment
#15680Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#15681Semiconductor device and a method of manufacturing the same
#15682System and method for forming one or more integrated circuit packages using a flexible leadframe structure
#15683Integrated circuit leadframe and fabrication method therefor
#15684Layout structure for providing stable power source to a main bridge chip substrate and a motherboard
#15685Circuit device with dummy elements
#15686Fingerprint sensor package
#15687LED lamp
#15688Semiconductor device with a floating gate electrode that includes a plurality of particles
#15689Selective packaging of tested semiconductor devices
#15690Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip
#15691Method of manufacturing circuit device
#15692Circuit device and manufacturing method thereof
#15693Moisture-resistant electronic device package and methods of assembly
#15694Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection
#15695Circuit device, manufacturing method thereof, and sheet-like board member
#15696Method for fabricating leadless packages with mold locking characteristics
#15697Integrated ball and via package and formation process
#15698Dual row leadframe and fabrication method
#15699Semiconductor device and interposer
#15700Semiconductor molding method and structure
#15701Circuit board and semiconductor device using the same
#15702Multiple die package with adhesive/spacer structure and insulated die surface
#15703Semiconductor device mounting structure
#15704Semiconductor device
#15705Semiconductor device and manufacturing process thereof
#15706Adhesive/spacer island structure for multiple die package
#15707Semiconductor device, method for mounting the same, and method for repairing the same
#15708Semiconductor device and method of manufacturing the same
#15709Leadless leadframe with an improved die pad for mold locking
#15710Packaged integrated circuit with MLP leadframe and method of making same
#15711Semiconductor device and manufacturing method therefor
#15712Optoelectronic semiconductor device and method of manufacturing such a device
#15713Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#15714Packaging of a microchip device
#15715Method and system for deflashing mold compound
#15716Chemical-enhanced package singulation process
#15717Methods for producing an electronic device having microscopically small contact areas
#15718Method of fabricating stacked semiconductor device
#15719Microelectronic devices and methods for packaging microelectronic devices
#15720Adhesive film, lead frame with adhesive film, and semiconductor device using same
#15721Optoelectronic module and optoelectronic system
#15722Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
#15723Semiconductor package and method for fabricating the same
#15724High heat release semiconductor and method for manufacturing the same
#15725Semiconductor chip package and method for fabricating the same
#15726Semiconductor device and method of manufacturing the semiconductor device
#15727High electrical performance semiconductor package
#15728Mold gates and tape substrates including the mold gates
#15729Semiconductor device and manufacturing method therefor
#15730Package design and method for electrically connecting die to package
#15731Semiconductor device structure with adhesion-enhanced semiconductor die
#15732Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assembly
#15733Systems for degating packaged semiconductor devices with tape substrates
#15734Method of forming an array of semiconductor packages
#15735Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
#15736Large die package structures and fabrication method therefor
#15737Die package
#15738Semiconductor micro device
#15739Microelectronic assembly having a perimeter around a MEMS device
#15740Microstructure comprising a surface which is functionalized through the localized deposit of a thin layer and production method thereof
#15741IC card module
#15742Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
#15743Wiring board and semiconductor package using the same
#15744Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating
#15745Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#15746Method for internal electrical insulation of a substrate for a power semiconductor module
#15747Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
#15748Whisker inhibition in tin surfaces of electronic components
#15749Optoelectronic module and method for producing an optoelectronic module
#15750Current sensor
#15751Multi-chip package with high-speed serial communications between semiconductor die
#15752Embedded chip semiconductor without wire bondings
#15753Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface
#15754Overhang support for a stacked semiconductor device, and method of forming thereof
#15755Resin-encapsulated semiconductor apparatus and process for its fabrication
#15756Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads
#15757Optical surface mount technology package
#15758Surface mount multichip devices
#15759Leads under chip IC package
#15760Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents
#15761Single row bond pad arrangement
#15762Method of manufacturing a semiconductor device
#15763Method and apparatus for synthesizing high-frequency signals for wireless communications
#15764Method for manufacturing optical electronic component
#15765Display device and manufacturing method of the same
#15766Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#15767Semiconductor device with a protected active die region and method therefor
#15768Semiconductor device using semiconductor chip
#15769Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
#15770Semiconductor chip package and method for manufacturing the same
#15771Card-type LED illumination source
#15772Phosphors containing borate of terbium, alkaline-earth, and Group-3 metals, and light sources incorporating the same
#15773Camera module having a threaded lens barrel and a ball grid array connecting device
#15774Method for producing a BGA chip module and BGA chip module
#15775Method for manufacturing an adhesive substrate with a die-cavity sidewall
#15776Device mounting board
#15777Card-type LED illumination source
#15778Semiconductor device and its manufacturing process, electro-optical equipment, and electronic equipment
#15779Power module comprising at least two substrates and method for producing the same
#15780Semiconductor device and hybrid integrated circuit device
#15781Semiconductor package for a large die
#15782Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same
#15783Semiconductor device in which semiconductor chip is mounted on lead frame
#15784Semiconductor light emitting device and fabrication method thereof
#15785Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
#15786Compliant interconnect assembly
#15787Method of manufacturing multi-stack package
#15788Lead frame and method of manufacturing the same
#15789Semiconductor device and a method of manufacturing the same
#15790Semiconductor package having multiple row of leads
#15791Semiconductor device and manufacturing method of the same
#15792Semiconductor device
#15793Light-radiating semiconductor component with a luminescene conversion element
#15794Semiconductor device
#15795Light emitting diode and process for producing the same
#15796Semiconductor chip package
#15797Microelectronic assembly having a redistribution conductor over a microelectronic die
#15798Semiconductor device
#15799CARRIER, CHIP PACKAGE STRUCTURE, AND CIRCUIT BOARD PACKAGE STRUCTURE
#15800Semiconductor device, magnetic sensor, and magnetic sensor unit
#15801Semiconductor device and multilayer substrate therefor
#15802Semiconductor packages, and methods of forming semiconductor packages
#15803Display device
#15804Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
#15805In-process semiconductor packages with leadframe grid arrays
#15806Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
#15807Leadframe packaging structure and the method of manufacturing the same
#15808Semiconductor device with stacked semiconductor chips of the same type
#15809Semiconductor integrated circuit
#15810Semiconductor device with improved design freedom of external terminal
#15811Semiconductor device
#15812Single-chip LED with three luminescent spectrums of red, blue and green wavelengths
#15813Integrated getter for vacuum or inert gas packaged LEDs
#15814Ce and Eu doped phosphors for light generation
#15815Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
#15816Electronic device and method of manufacture the same
#15817Packaging method for integrated circuits
#15818Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same
#15819Method for manufacturing semiconductor device
#15820Adhesive of folded package
#15821Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits
#15822Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits
#15823Heat curable adhesive composition, article, semiconductor apparatus and method
#15824Electronic component mounting method and apparatus
#15825Wafer level mounting frame for ball grid array packaging, and method of making and using the same
#15826Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#15827Die with discrete spacers and die spacing method
#15828Semiconductor package with heat dissipating structure and method of manufacturing the same
#15829Chip package structure and chip packaging process
#15830Semiconductor device and method of fabricating the same
#15831Power semiconductor device package
#15832Stacked semiconductor device
#15833Method for maintaining solder thickness in flipchip attach packaging processes
#15834Exposed pad module integrating a passive device therein
#15835CHIP PACKAGE STRUCTURE
#15836Circuit device
#15837System for reducing or eliminating semiconductor device wire sweep
#15838Multi-part lead frame
#15839Lead frame having a tilt flap for locking molding compound and semiconductor device having the same
#15840Leadless semiconductor package and manufacturing method thereof
#15841Spacer die structure and method for attaching
#15842Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#15843Power semiconductor switching-device and semiconductor power module using the device
#15844Light emitting nitride semiconductor device and method of fabricating the same
#15845Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
#15846Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
#15847Semiconductor light emitting device and method of manufacturing the same
#15848Current sensor
#15849Encapsulating epoxy resin composition, and electronic parts device using the same
#15850Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
#15851Semiconductor device and manufacturing method thereof
#15852Resin encapsulated semiconductor device and the production method
#15853Semiconductor light emitting devices including a luminescent conversion element
#15854Light-emitting diode
#15855Replaceable light emitting diode package assembly
#15856Semiconductor device assemblies and packages including multiple semiconductor device components
#15857Die down semiconductor package
#15858Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
#15859Method for manufacturing leadless semiconductor packages
#15860Semiconductor device
#15861Microelectronic assembly having encapsulated wire bonding leads
#15862Semiconductor device, a method of manufacturing the same and an electronic device
#15863Interposer including adhesive tape
#15864Semiconductor device of a charge storage type
#15865Semiconductor device with non-overlapping chip mounting sections
#15866Semiconductor BGA package having a segmented voltage plane and method of making
#15867Method and semiconductor device having copper interconnect for bonding
#15868Top finger having a groove and semiconductor device having the same
#15869Device mounting board and semiconductor apparatus using device mounting board
#15870Spacer die structure and method for attaching
#15871Power semiconductor module
#15872Method for packaging a light emitting device by one dispense then cure step followed by another
#15873Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#15874Low fabrication cost, high performance, high reliability chip scale package
#15875Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
#15876Circuit device and manufacturing method thereof
#15877Land grid array packaged device and method of forming same
#15878Lower profile flexible substrate package for electronic components
#15879Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
#15880Semiconductor laser device, semiconductor laser device manufacturing method, optical disk apparatus and optical transmission system
#15881Hybrid integrated circuit device
#15882Trench capacitor power supply system and method
#15883Switched-capacitor power supply system and method
#15884Sim, sim holder, ic module, ic card and ic card holder
#15885Fluorescent material and light-emitting device
#15886Adhesion by plasma conditioning of semiconductor chip surfaces
#15887Semiconductor device
#15888Resin-sealed semiconductor device and method of manufacturing the same
#15889Semiconductor device package having a semiconductor element with resin
#15890Semiconductor device and manufacturing metthod thereof
#15891Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment
#15892Semiconductor package with build-up structure and method for fabricating the same
#15893Copper interconnect
#15894Semiconductor device
#15895Semiconductor device with plate-shaped component
#15896Circuit device
#15897Vertically stacked semiconductor device
#15898Semiconductor chip package
#15899Circuit device and manufacturing method thereof
#15900Semiconductor device and method of manufacturing the same