Semiconductor device for optical communication and manufacturing method therefor

Surface-mountable semiconductor component and method for producing it

Semiconductor apparatus and method of fabricating the apparatus

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Semiconductor light emitting device capable of suppressing silver migration of reflection film made of silver

Thin flip-chip method

Method for fabricating window ball grid array semiconductor package

Semiconductor chip packaging method with individually placed film adhesive pieces

Die to substrate attach using printed adhesive

Manufacturing method of semiconductor device

LED illumination apparatus and card-type LED illumination source

System and method for attenuating electromagnetic interference

Semiconductor device and method of manufacturing the same

Chip module

Multi-flip chip on lead frame on over molded IC package and method of assembly

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Semiconductor apparatus

Die package with higher useable die contact pad area

Stacked electronic part

Method of sensor packaging

Thin semiconductor package including stacked dies

Circuit device and manufacturing method thereof

Semiconductor package having step type die and method for manufacturing the same

Board-on-chip packages

Package with stacked substrates

Process for producing optical semiconductor device

Thin-film semiconductor device and method of manufacturing the same

Flip chip packaging process

Wafer level semiconductor package with build-up layer and method for fabricating the same

Lighting apparatus

Flexible substrate and electronic equipment

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Method and apparatus for bonding a wire

Semiconductor device, semiconductor package, and method for testing semiconductor device

Multi-chip package

Semiconductor element and wafer level chip size package therefor

Semiconductor device and manufacturing method thereof

Semiconductor device and electronic device

Leadframe with die pad

Semiconductor device with interlocking clip

Phosphor and blends thereof for use in LEDs

Universal non-volatile memory card used with various different standard cards containing a memory controller

System and method for forming mold caps over integrated circuit devices

Semiconductor device and method of manufacturing the same

Method and apparatus for joining semiconductor

Element arrangement method

Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same

Integrated circuit package with keep-out zone overlapping undercut zone

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Circuit component with bump formed over chip

Semiconductor device having a multi-chip stacked structure and reduced thickness

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

Resin-molded semiconductor device having posts with bumps and method for fabricating the same

Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same

Multi-chip package including at least one semiconductor device enclosed therein

High frequency semiconductor device

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor device

Semiconductor light emitting device and method for manufacturing same

Light emitting device

Semiconductor light emitting element and method of making the same

Semiconductor packaging techniques for use with non-ceramic packages

Methods of fabrication of package assemblies for optically interactive electronic devices

Semiconductor device

LED device and method for directing LED light

Semiconductor package free of substrate and fabrication method thereof

Semiconductor device assembly process

Low fabrication cost, high performance, high reliability chip scale package

Packaged die on PCB with heat sink encapsulant and methods

Semiconductor package with crossing conductor assembly and method of manufacture

Apparatus for encapsulating a multi-chip substrate array

Semiconductor package

Interconnect system without through-holes

Semiconductor device

Chip package structure

Method of manufacturing a semiconductor device

Method of surface mounting a semiconductor device

Semiconductor device support structures

Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus

Semiconductor light emitting device and method for manufacturing same

Process for producing semiconductor chips having a protective film on the back surface

Method of manufacturing semiconductor device

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Intrinsic thermal enhancement for FBGA package

Method for packaging semiconductor chips and corresponding semiconductor chip system

Semiconductor package for lowering electromagnetic interference and method for fabricating the same

Photosensitive semiconductor package with support member and method for fabricating the same

Sheet to form a protective film for chips

Daisy chaining of serial I/O interface on stacking devices

Electrode package for semiconductor device

Optimized power delivery to high speed, high pin-count devices

Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection

Semiconductor device and a memory system including a plurality of IC chips in a common package

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device package of stacked semiconductor chips with spacers provided therein

Electronic device configured as a multichip module, leadframe and panel with leadframe positions

Semiconductor device and fabrication method for the same

Semiconductor package free of substrate and fabrication method thereof

Two die semiconductor assembly and system including same

Lead frame and method for manufacturing semiconductor package with the same

Lead frame for semiconductor package and method of fabricating semiconductor package

White light emitting element and white light source

Microelectronic packages and methods therefor

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of manufacturing same

Method of producing a digital fingerprint sensor and the corresponding sensor

Semiconductor component having stiffener, stacked dice and circuit decals

Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth

Semiconductor device with capacitor

Stack MCP

Thermally enhanced metal capped BGA package

Method for fabricating semiconductor component with stiffener and circuit decal

Method of forming a leadframe for a semiconductor package

Semiconductor memory device and defect remedying method thereof

Light emitting diode

Semiconductor device and manufacturing method thereof, liquid crystal television system, and EL television system

Method for manufacturing semiconductor device

Method of manufacturing hybrid integrated circuit device

Chip-on-board module, and method of manufacturing the same

Manufacturing method of a semiconductor device utilizing a flexible adhesive tape

PACKAGE STRUCTURE OF OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device, semiconductor laser device, manufacturing method for semiconductor device, manufacturing method for semiconductor laser device, optical disk device and optical transmission system

Optically interactive device package array

Quad flat non-leaded package comprising a semiconductor device

Wire-bonding method and semiconductor package using the same

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

Method for assembling a ball grid array package with two substrates

Semiconductor package and method for manufacturing the same

Semiconductor package with passive device integration

Light emitting device and sealing material

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Fabrication method of semiconductor package with photosensitive chip

Bulk-shaped lens, light-emitting unit, and lighting equipment

Stereoscopic electronic circuit device, and relay board and relay frame used therein

Module with a built-in component, and electronic device with the same

Resin-encapsulation semiconductor device and method for fabricating the same

Semiconductor part for component mounting, mounting structure and mounting method

Semiconductor device including semiconductor element mounted on another semiconductor element

Solder alloy and semiconductor device

Bumpless wafer scale device and board assembly

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device having radiation structure

Microelectronic adaptors, assemblies and methods

Circuit carrier and package structure thereof

Method of making microelectronic packages including electrically and/or thermally conductive element

Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device

Stacked semiconductor device

Adaptable electronic storage apparatus

Enhanced adhesion strength between mold resin and polyimide

Semiconductor device

Semiconductor device and method of manufacturing same

Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part

Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package

Integrated circuit package with transparent encapsulant and method for making thereof

Semiconductor element for solid state image sensing device and solid state image sensing device using the same

Device and method for emitting output light using Group IIB element Selenide-based phosphor material

Device and method for emitting output light using group IIB element selenide-based phosphor material

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Semiconductor device and manufacturing method of them

Light emitting device

Adhesion by plasma conditioning of semiconductor chip

Radiation-emitting semiconductor component and method for fixing a semiconductor chip on a leadframe

WAFER-LEVEL PACKAGE STRUCTURE

Area array packages with overmolded pin-fin heat sinks

Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Semiconductor device

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device

Junction member comprising junction pads arranged in matrix and multichip package using same

Multiple die-spacer for an integrated circuit

Semiconductor device

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

Power module and power module assembly

Method of making wireless semiconductor device, and leadframe used therefor

Light emitting apparatus

Interconnect structure for power transistors

Light-radiating semiconductor component with a luminescence conversion element

Apparatus and methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Hybrid integrated circuit device and method of manufacturing the same

Manufacturing method for resin sealed semiconductor device

Device and method for emitting output light using group IIB element selenide-based phosphor material and/or thiogallate-based phosphor material

Device and method for emitting output light using group IIB element selenide-based and group IIA element gallium sulfide-based phosphor materials

Light emitting device

Semiconductor apparatus

Process for producing a semiconductor device

Method of packaging an optical sensor

Microelectronic component assemblies and microelectronic component lead frame structures

Partially populated ball grid design to accommodate landing pads close to the die

Semiconductor device including semiconductor elements mounted on base plate

Microelectronic component assemblies and microelectronic component lead frame structures

Reduced size semiconductor package with stacked dies

Flipchip QFN package

Semiconductor device

Semiconductor light emitting element

Semiconductor device using LED chip

Electronic component mounting method and apparatus

Pressure sensor contained in casing

Methods of making microelectronic assemblies

Methods and apparatus to reduce growth formations on plated conductive leads

Carrier, method of manufacturing a carrier and an electronic device

Method for manufacturing semiconductor device with plural semiconductor chips

Cooling devices and methods of using them

Wafer-level assembly method for chip-size devices having flipped chips

Semiconductor device having capacitors for reducing power source noise

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

Semiconductor device

Low profile package having multiple die

Semiconductor device and manufacturing method for the same

Electronic device having wiring substrate and lead frame

Semiconductor chip and manufacturing method for the same, and semiconductor device

LED substrate

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate

Semiconductor device and manufacturing method thereof

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

LED lamp and method for manufacturing the same

High frequency module

Insulating substrate for IC packages having integral ESD protection

High-frequency module, and method of producing same

Surface acoustic wave device and electronic circuit device

Method of manufacturing semiconductor device

Micro lead frame package having transparent encapsulant

Semiconductor chip with external connecting terminal

Semiconductor chip with external connecting terminal

Semiconductor device and semiconductor module

Semiconductor chip with external connecting terminal

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Multi-chip module and methods

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor sensor device and method of producing the same

Multi-part lead frame with dissimilar materials

Method of packaging an optical sensor

Surface mount package and method for forming multi-chip microsensor device

Semiconductor device

Surface mount package

Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area

Optical semiconductor device and method of manufacturing optical semiconductor device

Strobe light control circuit and IGBT device

Light emitting device and illuminator using the same

Method for fabricating a warpage-preventive circuit board

Method of manufacturing a semiconductor device by using a matrix frame

Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges

Semiconductor device with intermediate connector

Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device

Method for forming at least one protective cap

Moulding assembly for forming at least one protective cap

Electromagnetic wave absorber, method of manufacturing the same and appliance using the same

Method of manufacturing a semiconductor device

Multi-chip package structure

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Chip assembly package

Semiconductor package

Semiconductor chip package and multichip package

Method of manufacturing a semiconductor device

Multi-chip package structure

Chip package structure

Leadless semiconductor package

Semiconductor package with increased number of input and output pins

Package structure for semiconductor

Method for manufacturing metal structure having different heights

Process for producing optical semiconductor device

Warpage control of array packaging

Stacked semiconductor device assembly and method for forming

Semiconductor module with vertically mounted semiconductor chip packages

Chip packaging compositions, packages and systems made therewith, and methods of making same

Adhesive film for manufacturing semiconductor device

Embedded redistribution interposer for footprint compatible chip package conversion

Semiconductor module with a semiconductor stack, and methods for its production

Flexible package with rigid substrate segments for high density integrated circuit systems

Wire loop grid array package

Multiple chip package module having inverted package stacked over die

Stress distribution package

Wire bonding package

Metal article intended for at least partially coating with a substance and a method for producing the same

Thermally enhanced semiconductor package

Method of assembling a ball grid array package with patterned stiffener layer

Dual semiconductor die package with reverse lead form

Semiconductor package with a flip chip on a solder-resist leadframe

Manufacturing method of a semiconductor device

Lead frame structure with aperture or groove for flip chip in a leaded molded package

Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions

Substrate structure capable of reducing package singular stress

Semiconductor component arrangement with an insulating layer having nanoparticles

Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device

Nitride semiconductor light emitting device and method for manufacturing the same

Opto-electronic assembly having an encapsulant with at least two different functional zones

Optical apparatus and image production apparatus

Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process

Flip-chip solder bump formation using a wirebonder apparatus

Chip orientation and attachment method

Photocurable adhesive compositions, reaction products of which have low halide ion content

Combinations of resin compositions and methods of use thereof

Method for making a package substrate without etching metal layer on side walls of die-cavity