212716 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected Encapsulation
Semiconductor package including light emitter and IC
#15302Semiconductor device embedded with pressure sensor and manufacturing method thereof
#15303Wiring pattern formation method, wiring pattern, and electronic device
#15304Nano-sized metals and alloys, and methods of assembling packages containing same
#15305Radio frequency module and manufacturing method thereof
#15306Package stress management
#15307Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits
#15308Method for manufacturing wafer level chip scale package structure
#15309Die down ball grid array package
#15310Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
#15311Semiconductor package with crossing conductor assembly and method of manufacture
#15312Electronic device
#15313COF flexible printed wiring board and method of producing the wiring board
#15314Circuit device and manufacturing method thereof
#15315Semiconductor device and method for manufacturing the same
#15316Semiconductor package having a heat slug and manufacturing method thereof
#15317Method for producing a packaged integrated circuit
#15318Semiconductor laser module, spatial optical transmission system and electronic appliance
#15319Solder foil, semiconductor device and electronic device
#15320Phosphor and an incandescent lamp color light emitting diode lamp using the same
#15321Phosphor blends for wavelength conversion and white light emitting device using the same
#15322Production methods for a leadframe and electronic devices
#15323Semiconductor device having a switch circuit
#15324Semiconductor device
#15325Semiconductor package, and fabrication method and carrier thereof
#15326Assembly for stacked BGA packages
#15327Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
#15328Optical semiconductor device, optical communication device, and electronic equipment
#15329High output small area group III nitride LEDs
#15330Method of forming solder ball, and fabricating method and structure of semiconductor package using the same
#15331Semiconductor device, its manufacture method and electronic component unit
#15332Semiconductor device and manufacturing method of the same
#15333Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
#15334Fabricating method of wafer protection layers
#15335Wafer stacking package method
#15336Method of forming a wafer backside interconnecting wire
#15337Power module package having excellent heat sink emission capability and method for manufacturing the same
#15338Semiconductor module
#15339Semiconductor package having flash-free contacts and techniques for manufacturing the same
#15340Copper interconnect
#15341Copper interconnect
#15342Copper interconnect
#15343Copper interconnect for semiconductor device
#15344Semiconductor equipment having a pair of heat radiation plates
#15345Semiconductor packages
#15346Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
#15347Methods of forming semiconductor packages
#15348Integrated heatspreader for use in wire bonded ball grid array semiconductor packages
#15349Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor
#15350Apparatus for and method of packaging semiconductor devices
#15351Chip carrier with oxidation protection layer
#15352Multi-chip package structure
#15353Robust power semiconductor package
#15354Semiconductor packages
#15355Integrated circuit package with open substrate
#15356Semiconductor device having multiple substrates
#15357Led package
#15358Light emitting device and method of producing same
#15359Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
#15360Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment
#15361IC card and method of manufacturing the same
#15362Method and apparatus for de-soldering integrated circuit devices
#15363Sensor device
#15364Testing integrated circuits using high bandwidth wireless technology
#15365Module assembly and method for stacked BGA packages
#15366Method of forming precision leads on a chip-supporting leadframe
#15367Technique for attaching die to leads
#15368Methods for packaging image sensitive electronic devices
#15369Methods for packaging image sensitive electronic devices
#15370Methods for packaging image sensitive electronic devices
#15371Integrated antenna type circuit apparatus
#15372Transparent resin composition for optical sensor filter, optical sensor, and process of producing method therefor
#15373Semiconductor package having a partial slot cover for encapsulation process
#15374Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby
#15375Semiconductor device and method for manufacturing semiconductor device
#15376Flat chip semiconductor device and manufacturing method thereof
#15377Semiconductor device and method of manufacturing semiconductor device
#15378Semiconductor device, lead frame, and methods for manufacturing the same
#15379Module assembly for stacked BGA packages
#15380Substrate-based housing component with a semiconductor chip
#15381Method of manufacturing a semiconductor device
#15382Semiconductor package and laminated semiconductor package
#15383Lead frame and semiconductor device having the lead frame
#15384Light-emitting device and glass seal member therefor
#15385Solid-state optical device
#15386Novel oxynitride phosphors
#15387Solid state device and light-emitting element
#15388Method of making circuitized substrate
#15389Methods for packaging image sensitive electronic devices
#15390Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby
#15391Semiconductor chip packages and methods for fabricating the same
#15392Method of manufacturing semiconductor device
#15393Microelectronic imaging units and methods of manufacturing microelectronic imaging units
#15394Magnetic shielding for magnetic random access memory card
#15395Dial module, manufacturing method thereof, led display element, display module, movement module, connector module and meter using them
#15396Methods for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer
#15397Semiconductor chip, electrically connections therefor
#15398Surface-mounting semiconductor device and method of making the same
#15399Wire sweep resistant semiconductor package and manufacturing method thereof
#15400Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#15401Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device
#15402Semiconductor device having laminated structure
#15403Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages
#15404Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
#15405Semiconductor device having a heat-dissipation member
#15406Structure and process of semiconductor package with an exposed heatsink
#15407Electronic component package
#15408Semiconductor apparatus having stacked semiconductor components
#15409Multichip module package and fabrication method
#15410Stacked die packaging and fabrication method
#15411Apparatus for improved power distribution in wirebond semiconductor packages
#15412Method of making a semiconductor device adapted to remove noise from a signal
#15413SMT three phase inverter package and lead frame
#15414Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same
#15415Electronic component with multilayered rewiring plate and method for producing the same
#15416Method of manufacturing printed wiring board
#15417Method of making circuitized substrate
#15418Method for manufacturing a light emitting device
#15419Nitride phosphor and production process thereof, and light emitting device
#15420Methods for forming molds
#15421Conductive adhesive agent with ultrafine particles
#15422Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#15423Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages
#15424Submember mounted on a chip of electrical device for electrical connection
#15425Stacked wafer scale package
#15426QFN package and method therefor
#15427Semiconductor device and resin structure therefor
#15428Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages
#15429Humidity sensor and composite sensor having humidity detecting function
#15430High frequency module and manufacturing method thereof
#15431Semiconductor element
#15432Process and lead frame for making leadless semiconductor packages
#15433Thermal protection for electronic components during processing
#15434Methods and apparatuses for providing stacked-die devices
#15435Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components
#15436Integrated circuit package including miniature antenna
#15437Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same
#15438Hybrid integrated circuit device
#15439Package structure
#15440Methods and apparatuses for providing stacked-die devices
#15441Memory card with an adaptor
#15442Process and lead frame for making leadless semiconductor packages
#15443Half-bridge package
#15444Methods of forming a contact array in situ on a substrate
#15445Circuit device manufacturing method
#15446Packaged microelectronic devices and methods for packaging microelectronic devices
#15447Method for fabricating semiconductor package with circuit side polymer layer
#15448Manufacturing method of semiconductor device
#15449Semiconductor device with semiconductor components connected to one another
#15450Component arrangement having an evaluation circuit for detecting wear on connections
#15451Micro device having micro system structure and method for method for manufacturing the same
#15452Method and apparatus for stacked die packaging
#15453Stacked chip package with exposed lead-frame bottom surface
#15454Semiconductor device
#15455Snap lid camera module
#15456Method for forming metal contacts on a substrate
#15457Optical or electronic module and method for its production
#15458Methods to provide and expose a diagnostic connector on overmolded electronic packages
#15459Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
#15460Surface treatment for oxidation removal in integrated circuit package assemblies
#15461Method of manufacturing circuit device
#15462Microelectronic imaging units and methods of manufacturing microelectronic imaging units
#15463Stacked chip electronic package having laminate carrier and method of making same
#15464Control unit and method for producing the same
#15465Power amplifier arrangement and method for processing a radiofrequency signal
#15466Resin for optical-semiconductor element encapsulation
#15467Power semiconductor package having integral fluid cooling
#15468Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance
#15469Semiconductor device and method of manufacturing same
#15470Interposer with flexible solder pad elements and methods of manufacturing the same
#15471Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
#15472Chip-under-tape package structure and manufacture thereof
#15473Semiconductor package with stacked chips and method for fabricating the same
#15474Solderable metal finish for integrated circuit package leads and method for forming
#15475Chip structure with redistribution traces
#15476Semiconductor device and a manufacturing method of the same
#15477Semiconductor package having a grid array of pin-attached balls
#15478Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method
#15479Method for manufacturing plastic ball grid array package with integral heatsink
#15480Magnetic shield for integrated circuit packaging
#15481Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
#15482Method for forming microelectronic spring structures on a substrate
#15483Optical semiconductor device, optical connector and electronic equipment
#15484Active plate-connector device with built-in semiconductor dies
#15485Microelectronic component assemblies with recessed wire bonds and methods of making same
#15486Semiconductor device
#15487Semiconductor device and method of manufacturing a semiconductor device
#15488Method for mounting a chip on a base and arrangement produced by this method
#15489Heterogeneous organic laminate stack ups for high frequency applications
#15490Substrate-based BGA package, in particular FBGA package
#15491Semiconductor package and method for its manufacture
#15492IC with stably mounted chip
#15493Semiconductor device and its manufacturing method
#15494Bonding configurations for lead-frame-based and substrate-based semiconductor packages
#15495Power semiconductor package
#15496Optical package for a semiconductor sensor
#15497Electronic module with layer of adhesive and process for producing it
#15498Strap bonding machine and method of manufacturing a semiconductor device
#15499Manufacturing method of a semiconductor device, and paste applicator
#15500Encapsulating epoxy resin composition, and electronic parts device using the same
#15501Resin encapsulation molding method for semiconductor device
#15502Method for fabricating a semiconductor component with contacts situated at the underside
#15503Manufacturing method of semiconductor device and manufacturing method of lead frame
#15504Method of manufacturing semiconductor device
#15505Castellation wafer level packaging of integrated circuit chips
#15506Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts
#15507Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal
#15508High illumination light emitting diode
#15509Light emitting device provided with a submount assembly for improved thermal dissipation
#15510LED chip capping construction
#15511LED chip capping construction
#15512Semiconductor chip resin encapsulation method
#15513Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
#15514Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same
#15515Semiconductor package
#15516Methods of bonding two semiconductor devices
#15517Circuit device with at least partial packaging and method for forming
#15518Method of packaging integrated circuits, and integrated circuit packages produced by the method
#15519Electronic device with semiconductor chip including a radiofrequency power module
#15520Heat dissipation device for integrated circuits
#15521Device mounting board
#15522Semiconductor device and manufacturing method therefor
#15523Semiconductor chip assembly with metal containment wall and solder terminal
#15524Integrated circuit die with pedestal
#15525Wafer-level assembly method for semiconductor devices
#15526Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
#15527Radiofrequency power semiconductor module with cavity housing, and method for producing it
#15528Fluorescent substance containing nitrogen, method for manufacturing the same, and light-emitting device
#15529Multi-layered circuit board assembly with improved thermal dissipation
#15530Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
#15531Electronic package having a folded flexible substrate and method of manufacturing the same
#15532Semiconductor device
#15533Castellation wafer level packaging of integrated circuit chips
#15534LED assemblies and light strings containing same
#15535Manufacturing method for magnetic sensor and lead frame therefor
#15536Deep ultraviolet used to produce white light
#15537Light emitting diode display that does not require epoxy encapsulation of the light emitting diode
#15538Method for manufacturing surface acoustic wave device
#15539Electronic device package
#15540Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration
#15541Substrate based unmolded package
#15542BGA package with concave shaped bonding pads
#15543Microelectronic devices
#15544Flip-chip without bumps and polymer for board assembly
#15545Semiconductor chip having pollished and ground bottom surface portions
#15546Molded package for micromechanical devices and method of fabrication
#15547Castellation wafer level packaging of integrated circuit chips
#15548Semiconductor component having stacked, encapsulated dice and method of fabrication
#15549Multi-chip package having heat dissipating path
#15550Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers
#15551Ultrathin module for semiconductor device and method of fabricating the same
#15552Plastic encapsulated semiconductor device with reliable down bonds
#15553Semiconductor device and method of manufacturing same
#15554Lead frame for improving molding reliability and semiconductor package with the lead frame
#15555Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
#15556Device and method for emitting output light using group IIA/IIB selenide sulfur-based phosphor material
#15557Phosphor mixture of organge/red ZnSe0.5S0.5:Cu,Cl and green BaSrGa4S7:Eu for white phosphor-converted led
#15558Under bump metallurgy process on passivation opening
#15559Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods
#15560Stacked package electronic device
#15561Substrate based unmolded package
#15562Optoelectronic packaging with embedded window
#15563Photopolymerizable composition and use thereof
#15564Housing for a semiconductor device and semiconductor device testing system for testing the contacting for semiconductor devices positioned one above the other
#15565Light emitting diode module for automobile headlights and automobile headlight having the same
#15566Technique for protecting photonic devices in optoelectronic packages with clear overmolding
#15567Method for manufacturing a semiconductor device
#15568Semiconductor device
#15569Circuit device and manufacturing method thereof
#15570Package stress management
#15571Direct connection multi-chip semiconductor element structure
#15572Castellation wafer level packaging of integrated circuit chips
#15573Castellation wafer level packaging of integrated circuit chips
#15574Semiconductor chip package with thermoelectric cooler
#15575Package Structure
#15576Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
#15577Taped lead frames and methods of making and using the same in semiconductor packaging
#15578Semiconductor module with a semiconductor sensor chip and a plastic package as well as method for its production
#15579Led and fabrication method of same
#15580Co-curable compositions
#15581Low coefficient of thermal expansion (CTE) thermosetting resins for integrated circuit applications
#15582Modular board device, high frequency module, and method of manufacturing same
#15583Heat sink formed of multiple metal layers on backside of integrated circuit die
#15584Method for fabricating semiconductor packages
#15585Leadless semiconductor package and method for manufacturing the same
#15586Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe
#15587Method for fabricating semiconductor packages
#15588Electronic device package
#15589Leadframe with a chip pad for two-sided stacking and method for manufacturing the same
#15590Oxynitride phosphor and a light emitting device
#15591Mold cleaning sheet and manufacturing method of a semiconductor device using the same
#15592Semiconductor device with wire bond inductor and method
#15593Bottom heat spreader
#15594Semiconductor package with exposed heat sink and the heat sink thereof
#15595Method of forming semiconductor constructions
#15596Stacked multi-chip semiconductor package improving connection reliability of stacked chips
#15597Multi-chip semiconductor connector assemblies
#15598Method and system for expanding flash storage device capacity
#15599Microelectronic packages and methods therefor
#15600Method of embedding semiconductor element in carrier and embedded structure thereof