System and method for marking the surface of a semiconductor package

Illuminated electric toothbrushes emitting high luminous intensity toothbrush

Surface-emitting type semiconductor laser, optical module, and optical transmission device

Memory card

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

Diode exhibiting a high breakdown voltage

Bonding pad design for impedance matching improvement

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Die-up ball grid array package including a substrate capable of mounting an integrated circuit die and method for making the same

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods

Semiconductor package having high quantity of I/O connections and method for fabricating the same

Integrated circuit package with leadframe enhancement and method of manufacturing the same

Lead frame, manufacturing method of the same, and semiconductor device using the same

Semiconductor device having transferred integrated circuit

Semiconductor package and method of manufacturing the same

Semiconductor package

Nitride-based semiconductor light-emitting device and manufacturing method thereof

Toothbrush with severable electrical connections

Method for fabricating thermally enhanced semiconductor device

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Manufacturing method of solid-state image sensing device

Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuit

Substrate frame

Optical device and method for manufacturing the same, optical module, and optical transmission device

Memory module

Method for making a lamp string

Resin-encapsulated semiconductor apparatus and process for its fabrication

Semiconductor package structure and method for manufacturing the same

Resin-encapsulated package, lead member for the same and method of fabricating the lead member

Flip chip stacked package

Flip-chip package

Semiconductor device, semiconductor module and method of manufacturing semiconductor device

Bonding material and circuit device using the same

Semiconductor device

Adhesive sheet for producing a semiconductor device

Semiconductor device with pipe for passing refrigerant liquid

Electronic package with insert conductor array

Array-molded package heat spreader and fabrication method therefor

Leadframe-based mold array package heat spreader and fabrication method therefor

Leadless semiconductor package

Method of fabricating a two die semiconductor assembly

Stacked-chip semiconductor package and fabrication method thereof

Chip stack package and manufacturing method thereof

Semiconductor device

Surface-mounted light-emitting diode and method

Wirebonding insulated wire and capillary therefor

Stacked microfeature devices and associated methods

Circuit component built-in module and method for manufacturing the same

Current sensor

Solid-state imaging device and method for manufacturing the same

Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations

Method for forming plating film

Wire bonding for thin semiconductor package

Optoelectronics processing module and method for manufacturing thereof

Information media using information of defect in an article

Thermally enhanced component substrate: thermal bar

Boron nitride agglomerated powder

Capacitor module and semiconductor

Image display device and light emission device

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Near hermetic power chip on board device and manufacturing method therefor

Ball grid array package, stacked semiconductor package and method for manufacturing the same

High-frequency semiconductor device

Coolant cooled type semiconductor device

Semiconductor package with improved chip attachment and manufacturing method thereof

Circuit device

Semiconductor component having dummy segments with trapped corner air

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Interconnections

Wirebonded assemblage method and apparatus

Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

Singulation method used in leadless packaging process

Flip chip on lead frame

Process for producing a semiconductor device

Method for manufacturing solid-state imaging devices

Method for manufacturing semiconductor devices

Method for manufacturing high-frequency module device

Semiconductor package using flexible film and method of manufacturing the same

Multiple stacked-chip packaging structure

Die-up ball grid array package including a substrate having an opening and method for making the same

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

Heat releasing member, package for accommodating semiconductor element and semiconductor device

Stacked chip assembly with encapsulant layer

Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting

Wavelength-converting LED

Semiconductor light emitting diode and semiconductor light emitting device

Method of wafer bumping for enabling a stitch wire bond in the absence of discrete bump formation

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Lead frame, semiconductor device using the same and method of producing the semiconductor device

Electronic circuit device

Semiconductor memory module

Cooler for cooling electric part

Arrangement of luminescent materials, wavelength-converting casting compound and light source

Deep red phosphor for general illumination applications

Multi-chip module

Semiconductor device structural body and electronic device

Enhanced die-up ball grid array and method for making the same

Semiconductor apparatus and method of manufacturing the same

Semiconductor device and an electronic device

Stacked mass storage flash memory package

Semiconductor device and method of manufacturing thereof

Lead-frame-based semiconductor package and fabrication method thereof

Leadframe and semiconductor package made using the leadframe

Topless semiconductor package

Optical semiconductor device and method of manufacturing the same

Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus

Protection circuit device using MOSFETs and a method of manufacturing the same

Molded ball grid array

Molded stiffener for thin substrates

Wire bonders and methods of wire-bonding

Semiconductor processing methods

Ultrathin leadframe BGA circuit package

Semiconductor integrated circuit package having electrically disconnected solder balls for mounting

Packaged microelectronic components

Method of manufacturing a semiconductor device

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

Power supply device

Electronic component protected against electrostatic discharges

Image sensor package fabrication method

Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

High reliability chip scale package

Method for assembling a ball grid array package with multiple interposers

Multi-chip module having bonding wires and method of fabricating the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Multi-chips module package and manufacturing method thereof

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Curable encapsulant compositions

Techniques for packaging a multiple device component

Semiconductor device and its manufacturing method

Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Stacked chip-packaging structure

Packaged microelectronic devices and methods of forming same

Method for fabricating semiconductor component with chip on board leadframe

Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board

Semiconductor component having chip on board leadframe

Multi media card formed by transfer molding

Electronic device package

Standoffs for centralizing internals in packaging process

Printed circuit board with a heat dissipation element and package comprising the printed circuit board

Method of making a semiconductor device having an opening in a solder mask

Apparatus used to package multimedia card by transfer molding

Method and apparatus for attaching microelectronic substrates and support members

Fabrication method of semiconductor integrated circuit device

Methods of fabricating light emitting devices using mesa regions and passivation layers

Nucleation of diamond films using higher diamondoids

Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the same

Computer system including at least one stress balanced semiconductor package

Memory package

Module part

Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same

Semiconductor component having conductors with wire bondable metalization layers

Arrangement for reducing stress in substrate-based chip packages

Structure of multi-tier wire bonding for high frequency integrated circuit

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Ball grid array structures having tape-based circuitry

Semiconductor device and switching element

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Method for forming a chip package

Process for fabricating a semiconductor package and semiconductor package with leadframe

Methods for enclosing a thermoplastic package

Method for optimizing routing layers and board space requirements for a ball grid array land pattern

Forming tool for forming a contoured microelectronic spring mold

Adhesive film

Method of making a semiconductor device having an opening in a solder mask

Manufacturing process of memory module with direct die-attachment

Radiation emitting semiconductor component with luminescent conversion element

Piezoelectric oscillator, manufacturing method therefor, mobile phone apparatus using piezoelectric oscillator, and electronic apparatus using piezoelectric oscillator

Semiconductor assembly encapsulation mold and method for forming same

Wafer-level chip scale package and method for fabricating and using the same

Semiconductor arrangement

Semiconductor unit with cooling system

Enhanced die-down ball grid array and method for making the same

Power semiconductor device with a control circuit board that includes filled through holes

BGA package with stacked semiconductor chips and method of manufacturing the same

Cutting method and method of manufacturing semiconductor device

Integrated circuit package with a balanced-part structure

Semiconductor device including inclined cut surface and manufacturing method thereof

Lead for integrated circuit package

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Semiconductor packaging structure

Dual gauge leadframe

Semiconductor device including a potential drawing portion formed at a corner

Flange for integrated circuit package

Thermoplastic material

Sialon-based phosphor and its production method

Camera module for compact electronic equipments

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Method for sealing semiconductor component

Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument

Packaging method for thin integrated circuits

Optoelectronic packaging with embedded window

Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it

Method of fabrication of stacked semiconductor devices

IC module and IC card

Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board

Substrate-less microelectronic package

Semiconductor device and method of fabricating the same

Manufacturing method for multichip module

Semiconductor device having aluminum and metal electrodes and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device with improved design freedom of external terminal

Method for packaging electronic modules and multiple chip packaging

Fabrication method for stacked multi-chip package

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Semiconductor packages for enhanced number of terminals, speed and power performance

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Die package

Lead frame and semiconductor device using the same

Semiconductor package containing an integrated-circuit chip supported by electrical connection leads

Surface mount multichip devices

Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other

Circuit board with built-in electronic component and method for manufacturing the same

Method of manufacturing semiconductor device and method of manufacturing electronics device

Manufacturing method of a semiconductor device

Method of manufacturing an enhanced thermal dissipation integrated circuit package

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Micro lead frame package

Semiconductor device and method of manufacturing the device

Thin stacked package and manufacturing method thereof

Stacked chip semiconductor device and method for manufacturing the same

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

Method and apparatus for non-conductively interconnecting integrated circuits

Microelectronic package

Green phosphor for general illumination applications

System and method for controlling integrated circuit die height and planarity

Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same

Dual chips stacked packaging structure

Corrosion-resistant copper bond pad and integrated device

Corrosion-resistant bond pad and integrated device

Semiconductor device

Chip scale package and method of fabricating the same

Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device

Adhesion enhanced semiconductor die for mold compound packaging

Leadless leadframe package substitute and stack package

Method for forming semiconductor device including stacked dies

Semiconductor device and lead frame

Solid-state imaging device and method for manufacturing the same

Resin encapsulated electronic component unit and method of manufacturing the same

Multi-chip module (MCM) with interface adapter circuitry

Methods for producing a 3D semiconductor memory device and structure

Fault tolerant power converter

Multi-layer potting for electronic modules

Driver and output circuit for powering semiconductor loads

Fan-out semiconductor package

Integrated circuit package with thermally conductive pillar

Integrated circuits with thermal isolation and temperature regulation

Semiconductor package with isolation wall

Package structure and method for forming the same

Semiconductor device with leadframe configured to facilitate reduced burr formation

Integrated circuit package with stand-off legs

Flip chip cavity package

Molded leadframe substrate semiconductor package