Method for manufacturing semiconductor device

Castellation wafer level packaging of integrated circuit chips

Durable radio frequency identification label and methods of manufacturing the same

Light emitting device having a backside electrode portion and same thickness protrusion and method of manufacturing the same

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Method of manufacturing a semiconductor device and a semiconductor device

Semiconductor component and method for fabricating

Inverted J-lead for power devices

Method for ball grid array chip packages having improved testing and stacking characteristics

Method of making semiconductor device

Ball grid array package substrates with a modified central opening and method for making the same

Local reduction of compliant thermally conductive material layer thickness on chips

Copper-based chip attach for chip-scale semiconductor packages

Semiconductor package

Semiconductor packages for enhanced number of terminals, speed and power performance

Semiconductor package with improved solder joint reliability

Thin, thermally enhanced molded package with leadframe having protruding region

Method for manufacturing thin GaAs die with copper-back metal structures

Microelectronic devices and methods for filling vias in microelectronic devices

LED package

Light-radiating semiconductor component with a luminescence conversion element

Optical semiconductor device

Adapter for connecting an optoelectronic transducer module to a printed circuit board, transmitting and/or receiving arrangement with such an adapter, optoelectronic transducer module and method for its production

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Method for embedding a component in a base and forming a contact

Method of forming land grid array packaged device

Fingerprint reading device and personal verification system

Light source apparatus and optical communication apparatus using the same

Method of manufacturing an optoelectronic package

Information storage apparatus and electronic device in which information storage apparatus is installed

Semiconductor device

Semiconductor device and a method of manufacturing the same

Offset-bonded, multi-chip semiconductor device

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Semiconductor device

Lead-free integrated circuit package structure

Stackable integrated circuit packaging

Semiconductor package with a chip on a support plate

Integrated circuit package overlay

Method for making dual gauge leadframe

Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same

Chip package and electrical connection structure between chip and substrate

Semiconductor device

Multi-part capillary

Electroplating method for a semiconductor device

Method of manufacturing semiconductor device and system of manufacturing semiconductor device

Techniques for joining an opto-electronic module to a semiconductor package

Packages for image sensitive electronic devices

Method of making multichip wafer level packages and computing systems incorporating same

Semiconductor package with heat spreader

Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body

Switching media for chip carrier device

Circuit module

Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)

Light emitting diode lamp

Method of manufacturing a solid state image sensing device

Micromechanical sensor

Chip assembling structure and socket

Medical device and method of manufacturing

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

Integrating passive components on spacer in stacked dies

Semiconductor device and method of fabricating the same

Light source apparatus with light-emitting chip which generates light and heat

Low coefficient of thermal expansion (CTE) semiconductor packaging materials

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor chip, semiconductor device, circuit board, and electronic instrument

Bump-on-lead flip chip interconnection

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus

Wafer level packages for chips with sawn edge protection

Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)

Plastic dual-in-line packaging (PDIP) having enhanced heat dissipation

Module assembly and method for stacked BGA packages

Highly reliable stack type semiconductor package

Semiconductor device

Chip adhesive

Diode housing

Lead frame, resin-encapsulated semiconductor device, and method of producing the same

Tri-color ZnSe white light emitting diode

White color light emitting device

Silicon nitride film and semiconductor device, and manufacturing method thereof

Method of manufacturing a semiconductor device

Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same

Techniques for packaging multiple device components

Frame for semiconductor package

Fretting and whisker resistant coating system and method

Structure and method for lead free solder electronic package interconnections

LED device and the manufacturing method thereof

LED-based white-emitting illumination unit

Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method

Substrate-based package for integrated circuits

Electric connection terminal and method of manufacturing the same, semiconductor device and method of mounting the same

Corrosion-resistant bond pad and integrated device

Encapsulated lead having step configuration

Heat spreader and semiconductor device package having the same

Circuit device and manufacturing method thereof

Semiconductor package

Heat spreader and semiconductor device package having the same

Chip package structure and manufacturing method thereof

Semiconductor device

Semiconductor chip package and method

Wafer level stack structure for system-in-package and method thereof

Semiconductor device

Integrated circuit carrier apparatus method and system

Semiconductor device and manufacturing method thereof

Molded leadless package having a partially exposed lead frame pad

Semiconductor device and manufacturing method thereof

Semiconductor element, semiconductor device, and method for manufacturing semiconductor element

EMI shielded integrated circuit packaging apparatus method and system

Semiconductor light emitting diode and method for manufacturing the same

Compliant interconnect assembly

Etching method and method of manufacturing circuit device using the same

Integrated circuit device and the manufacturing method thereof

Method of manufacturing a semiconductor device

Transfer mold semiconductor packaging processes

Method and system for hermetically sealing packages for optics

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Manufacturing method of semiconductor device and semiconductor device

Techniques for joining an opto-electronic module to a semiconductor package

Mounting method for a semiconductor component

Image pickup device and a manufacturing method thereof

Transparent small memory card

Semiconductor device and method of manufacturing the same

Method and semiconductor device having copper interconnect for bonding

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor package having ultra-thin thickness and method of manufacturing the same

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

FBGA arrangement

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Small memory card

Integrated circuit package having a resistant layer for stopping flowed glue

Lead frame and method for fabricating semiconductor package employing the same

Lead frame and semiconductor device having the same as well as method of resin-molding the same

Bumped chip carrier package using lead frame and method for manufacturing the same

Lead frame and semiconductor package with the same

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

Apparatus and method for storing an electronic component, method for packaging electronic components and method for mounting an electronic component

Semiconductor device

Fabrication method of semiconductor package with heat sink

Process for strengthening semiconductor substrates following thinning

Stacked semiconductor device including improved lead frame arrangement

Magnetic thin film, magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device

Red phosphor and method of preparing the same, and red light emitting diode, white light emitting diode, and active dynamic liquid crystal device using the red phosphor

Radar sensor

Garnet phosphor materials having enhanced spectral characteristics

Garnet phosphor materials having enhanced spectral characteristics

Heat sinkable package

Semiconductor device

Semiconductor package, method for manufacturing the same and lead frame for use in the same

Integrated interconnect package

Semiconductor chip and semiconductor device including lamination of semiconductor chips

Semiconductor device

BGA package with component protection on bottom

Multi-surface contact IC packaging structures and assemblies

Support body for semiconductor element, method for manufacturing the same and semiconductor device

Multi-chip module

Semiconductor package for memory chips

Thermal dissipating element of a chip

Semiconductor device having metal plates and semiconductor chip

Antenna-incorporated semiconductor device

Multi-surface IC packaging structures and methods for their manufacture

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device, electronic card and pad rearrangement substrate

Power semiconductor device and power semiconductor module

Chip package and substrate

Semiconductor device

Plastic package and method of fabricating the same

IC package with stacked sheet metal substrate

Light emitting element and light emitting device

Thin film light emitting diode

Technique for attaching die to leads

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Circuit device

Method of manufacturing a lead frame

Manufacturing method of ball grid array package

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Circuit device

Solid-state imaging device

Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor

Resin molded type semiconductor device and a method of manufacturing the same

Electronic component and panel and method for producing the same

Ball grid array package and method thereof

Cavity-down semiconductor package with heat spreader

Circuit device

Microelectronic component and assembly having leads with offset portions

Chip package structure and process for fabricating the same

Chip scale package and method of fabricating the same

Method for fabricating a semiconductor package with multi layered leadframe

Method for forming metal contacts on a substrate

System and method for reducing or eliminating semiconductor device wire sweep

Thermally enhanced packaging structure and fabrication method thereof

Method of manufacturing a semiconductor device

Thinned, strengthened semiconductor substrates and packages including same

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

[IMPROVED STRUCTURE OF LED]

Method for producing semiconductor device and semiconductor device

Resin-sealed semiconductor device

Prevention of contamination on bonding pads of wafer during SMT

Semiconductor device and method of enveloping an integrated circuit

Semiconductor component and production method suitable therefor

Integrated circuit with copper interconnect and top level bonding/interconnect layer

Integrated circuit package with integral leadframe convector and method therefor

Semiconductor device

Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same

Integrated circuit packaging system

Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area

Chip package and electrical connection structure between chip and substrate

Light source with a light-emitting element

Printed circuit board assembly and method

Gold bonding wires for semiconductor devices and method of producing the wires

Optical device and production method thereof

Optimization of routing layers and board space requirements for a ball grid array package

Method for producing a multichip module and multichip module

Optimization of routing layers and board space requirements for a ball grid array land pattern

Semiconductor radiation emitter package

Vertically stacked pre-packaged integrated circuit chips

Semiconductor device having heat radiation plate and bonding member

High power light emitting diode device

Integrated circuit package

Integrated circuit package with laminated power cell having coplanar electrode

Package type semiconductor device

Leadframe for use in a semiconductor package

Semiconductor component with electromagnetic shielding device

Ball grid array package with patterned stiffener surface and method of assembling the same

LED and its manufacturing process

Light-emitting diode and method of manufacturing the light-emitting diode

Semiconductor package

Light emitting device having a divalent-europium-activated alkaline earth metal orthosilicate phosphor

Method of making circuitized substrate

Metallic dam and method of forming therefor

Process for producing resin-sealed type electronic device

Method for manufacturing solid-state imaging devices

Quad flat no-lead package structure and manufacturing method thereof

Semiconductor device having heat conducting plate

Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Semiconductor device and method of fabricating the same

Conductive trace structure and semiconductor package having the conductive trace structure

Semiconductor device and a method for securing the device in a carrier tape

Overmolded optical package

Semiconductor component and system having stiffener and circuit decal

Leadless semiconductor package

Lead frame, semiconductor device, and method for manufacturing semiconductor device

Multichip wafer level packages and computing systems incorporating same

Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties

Light-emitting device and process for producing thereof

Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Method of manufacturing a semiconductor device

Method of manufacturing electronic device and method of manufacturing electro-optical device

LED and LED lamp

Thin film circuit board device and method for manufacturing the same

Method of producing an electronic component and a panel with a plurality of electronic components

Semiconductor device and method for producing the same

Method and apparatus for a dual substrate package

Semiconductor apparatus and method of fabricating the same

Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Method of forming a semiconductor package and structure thereof

Hybrid integrated circuit device and method of manufacturing the same

Method of manufacturing a module

Circuit carrier and production thereof

System having semiconductor component with encapsulated, bonded, interconnect contacts

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Optical device package with turning mirror and alignment post

Microelectronic devices and methods for packaging microelectronic devices

Green light emitting phosphor and light emitting device

Method and device for encapsulating electronic components while exerting fluid pressure

Semiconductor package

Bridge connection type of chip package and fabricating method thereof

Package assembly for electronic device

Integral heatsink ball grid array

Semiconductor package

Electronic package having a folded flexible substrate and method of manufacturing the same

Molded chip fabrication method

Reinforced die pad support structure

Receptacle for a programmable, electronic processing device

Method of fabrication of semiconductor integrated circuit device

Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices

Method of manufacturing semiconductor device

Image sensor packages

Light emission device and manufacturing method thereof

Moisture-resistant electronic device package and methods of assembly

Semiconductor light-emitting device

Super-thin high speed flip chip package

Semiconductor device having a pair of heat sinks and method for manufacturing the same

High-frequency module and method for manufacturing the same

Semiconductor apparatus with decoupling capacitor

Lead frame with flag support structure

Method of encapsulating interconnecting units in packaged microelectronic devices

Power module package having improved heat dissipating capability

Method of manufacturing wafer level package type FBAR device

Circuit device and manufacturing method of circuit device

Lead frame

Optoelectronic component and optoelectronic arrangement with an optoelectronic component

Surface light emitting element, optical module, light transmission device

Electronic component and method of manufacturing the same

Method for forming ball pads of BGA substrate

Method for encapsulating a chip and/or other article

Semiconductor device and manufacturing method of semiconductor device