212738 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Structure Component type
Sub-classes:PACKAGE COMPRISING DISCRETE ANTENNA DEVICE
#2INSULATED CHIP AND SIGNAL TRANSMITTING DEVICE
#3Electrical component with a dielectric passivation stack
#4Electrical component with a dielectric passivation stack
#5Structure with controlled capillary coverage
#6Package comprising discrete antenna device
#7Chip package structure including connecting posts and chip package method
#8Circuit board and circuit module
#9Integrated antenna array packaging structures and methods
#10Microelectronic assemblies having front end under embedded radio frequency die
#11HIGH DENSITY FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MAKING THE SAME
#12Semiconductor package
#13Semiconductor package
#14Electronic component, manufacturing method for electronic component, electronic apparatus, and moving object
#15Semiconductor chip package having via hole and semiconductor module thereof
#16Power conversion module