212741 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Structure; Component type being a resistor
Semiconductor Device and Method of Making an Interconnect Bridge with Integrated Passive Devices
#2NON-VOLATILE MEMORY DEVICE
#3SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED METHODS
#4ELECTRONIC PACKAGE
#5RESISTANCE TEMPERATURE DETECTOR AT HYBRID BONDING INTERFACE
#6PACKAGE WITH TILTED INTERFACE BETWEEN DEVICE DIE AND ENCAPSULATING MATERIAL
#72.5D/3D SYSTEM INTEGRATION
#8FABRICATION METHOD FOR FORMING HIGH VOLTAGE RESISTOR NETWORKS OVER SILICON SUBSTRATES FOR USE WITHIN MULTICHIP MODULE ASSEMBLIES
#9ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD THEREOF
#10INTEGRATED CIRCUIT STRUCTURE
#11HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
#12DIRECT PLUG-IN LED LAMP BEAD WITH INTERNAL RESISTOR
#13SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
#14PACKAGED ELECTRICAL DEVICES AND RELATED METHODS
#15SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#16SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER
#17ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#18SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCTURES
#19PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VIAS, AND METHODS OF MAKING SAME
#20Semiconductor Device and Method of Making an Interconnect Bridge with Integrated Passive Devices
#21SEMICONDUCTOR DEVICE
#22STRUCTURE INCLUDING PASSIVE COMPONENT TRAVERSING MULTIPLE SEMICONDUCTOR CHIPS, WITH RELATED METHODS AND SYSTEMS
#23SEMICONDUCTOR DEVICE
#24SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#25METHOD FOR FABRICATING ELECTRONIC PACKAGE
#26STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
#27POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONENT AND METHOD FOR FABRICATING THE SAME
#28SEMICONDUCTOR DEVICE
#29STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS
#30SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
#313DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
#32SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#33INTERPOSER WITH INTEGRATIVE PASSIVE COMPONENTS
#34MULTICHIP PACKAGES WITH 3D INTEGRATION
#35MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMBLIES, AND MEMORY DEVICE PACKAGES
#36Semiconductor device including resistor element
#37PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE
#38STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS
#393D SYSTEM INTEGRATION
#40ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#41Semiconductor Device with Discrete Blocks
#42SEMICONDUCTOR PACKAGE
#43SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED METHODS
#44DOHERTY AMPLIFIERS
#45Packaged electrical device
#46SEMICONDUCTOR DEVICE
#47NON-VOLATILE MEMORY DEVICE
#48SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
#49Electronic package and method for fabricating the same
#50Structures for low temperature bonding using nanoparticles
#51Power Semiconductor Module and Manufacturing Method
#52PACKAGE STRUCTURE WITH ANTENNA ELEMENT
#53METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
#54Semiconductor package with front side and back side redistribution structures and fabricating method thereof
#55SEMICONDUCTOR PACKAGE
#56High density interconnection using fanout interposer chiplet
#57Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#58Semiconductor device and a method of manufacturing the same
#59SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
#60Methods for low temperature bonding using nanoparticles
#61SEMICONDUCTOR MODULE
#62Semiconductor package
#63SEMICONDUCTOR DEVICE
#64Power Semiconductor Module with Accessible Metal Clips
#65Methods of forming stacked semiconductors die assemblies
#66Semicondutor package substrate with die cavity and redistribution layer
#67Monolithic surface mount passive component
#68Semiconductor device including resistor element
#69Activation of dynamic filter generation for message management systems through gesture-based input
#70Methods of forming microelectronic device assemblies and packages
#71Semiconductor package with layer structures, antenna layer and electronic component
#72Module
#73Apparatus and methods for bias switching of power amplifiers
#74Microelectronic device assemblies and packages including multiple device stacks and related methods
#75Semiconductor device having EMI shielding structure and related methods
#76Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#77MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICES AND INTEGRATED ON AN INTER DIE FABRIC
#78Integrated high voltage capacitor
#79Package with Tilted Interface Between Device Die and Encapsulating Material
#80Integrated circuit structure
#81Semiconductor device with discrete blocks
#82Semiconductor device assembly with pre-reflowed solder
#83FACE-UP FAN-OUT ELECTRONIC PACKAGE WITH PASSIVE COMPONENTS USING A SUPPORT
#84Semiconductor package and manufacturing method thereof
#85Integrated module with electromagnetic shielding
#86Stacked semiconductor die assemblies with support members and associated systems and methods
#87Stacked semiconductor die assemblies with die support members and associated systems and methods
#88Semiconductor package and method of forming the same
#89Semiconductor package and method of manufacturing the semiconductor package
#90Semiconductor device including resistor element
#91Circuit board with phase change material
#923D IC method and device
#93Semiconductor device and a method of manufacturing the same
#943DIC packaging with hot spot thermal management features
#953D IC method and device
#96Chip package with antenna element
#97Structures and methods for low temperature bonding using nanoparticles
#98Semiconductor package with front side and back side redistribution structures and fabricating method thereof
#99Transistor die with output bondpad at the input side of the die, and power amplifiers including such dies
#100Semiconductor device assembly with surface-mount die support structures
#101Apparatus and methods for bias switching of power amplifiers
#102High density interconnection using fanout interposer chiplet
#103Method for fabricating electronic package
#104Module
#105Semiconductor device and power amplifier module
#106Microelectronic device assemblies and packages and related methods and systems
#107Microelectronic device assemblies and packages including surface mount components
#108Microelectronic device assemblies and packages and related methods
#109Microelectronic device assemblies and packages including multiple device stacks and related methods
#110Semiconductor package and method of manufacturing the same
#111Semiconductor device package
#112Electronic device with top side pin array and manufacturing method thereof
#113Power inverter module with reduced inductance
#114Multi-stacked package-on-package structures
#115Semiconductor device and a method of manufacturing the same
#116System-in-package with double-sided molding
#117Semiconductor package with layer structures, antenna layer and electronic component
#118Split conductive pad for device terminal
#119Package with tilted interface between device die and encapsulating material
#120Electrically testable integrated circuit packaging
#121Semiconductor package with integrated passive electrical component
#122Apparatus and methods for bias switching of power amplifiers
#123METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES AND PACKAGES FORMED THEREBY
#124Semiconductor device and a method of manufacturing the same
#125Through-silicon via with low-K dielectric liner
#126Chip package structure including connecting posts and chip package method
#127METHODS AND SYSTEMS TO IMPROVE PRINTED ELECTRICAL COMPONENTS AND FOR INTEGRATION IN CIRCUITS
#128Semiconductor device assemblies with annular interposers
#129Semiconductor device and method of forming an integrated SiP module with embedded inductor or package
#130Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#131Stacked semiconductor die assemblies with die support members and associated systems and methods
#132Method of making a stacked inductor-electronic package
#133Method for manufacturing semiconductor package structure
#134Method for manufacturing electronic package
#135Data acquisition system-in-package
#136Semiconductor device having EMI shielding structure and related methods
#137Semiconductor device and a method of manufacturing the same
#138Semiconductor device and method for fabricating the same
#139Semiconductor package device and method of manufacturing the same
#140Semiconductor device and method of forming a 3D integrated system-in-package module
#141System-in-package with double-sided molding
#142Semiconductor device and a method of manufacturing the same
#143Data acquisition system-in-package
#144Packaged semiconductor system having unidirectional connections to discrete components
#145Semiconductor device and power amplifier module
#146Three-dimensional package structure
#147Stack frame for electrical connections and the method to fabricate thereof
#148Semiconductor package assembly having a conductive electromagnetic shield layer
#149METHOD OF FABRICATING ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE ELECTRONIC COMPONENTS
#150Semiconductor device
#151Structures and methods for low temperature bonding using nanoparticles
#152Integrated fan-out package with antenna components and manufacturing method thereof
#153Three-layer package-on-package structure and method forming same
#154Integrated passive device and fabrication method using a last through-substrate via
#155Semiconductor device with discrete blocks
#156Stacked semiconductor die assemblies with support members and associated systems and methods
#157Face-up fan-out electronic package with passive components using a support
#158Stacked semiconductor system having interposer of half-etched and molded sheet metal
#159Semiconductor device
#160Multi-stacked package-on-package structures
#161Electronics package with integrated interconnect structure and method of manufacturing thereof
#1623DIC packaging with hot spot thermal management features
#163Methods and systems to improve printed electrical components and for integration in circuits
#164SEMICONDUCTOR MODULE
#165Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
#166Fan-out wafer-level packaging method and the package produced thereof
#167Semiconductor device
#168Integrated module with electromagnetic shielding
#169Broadband power transistor devices and amplifiers with input-side harmonic termination circuits and methods of manufacture
#170BEOL embedded high density vertical resistor structure
#171Integrated circuit structure
#172Double-sided hermetic multichip module
#173Method of manufacturing semiconductor device
#174Integrated high voltage capacitor
#175Semiconductor device and power amplifier module
#176Chip package with antenna element
#177Electronic device with top side pin array and manufacturing method thereof
#178Wiring board, electronic device, and electronic module
#179Metal additive structures on printed circuit boards
#180SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANTENNA PATTERN ELECTRICALLY COUPLED TO A FIRST REDISTRIBUTION LAYER (RDL)
#181SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#182Semiconductor device
#183Power device package
#184Surface mount device stacking for reduced form factor
#185Semiconductor device
#186Semiconductor package
#187Electronic assembly with a direct bonded copper substrate
#188Package structure and method thereof
#189Semiconductor package
#190BEOL embedded high density vertical resistor structure
#191Semiconductor package and fabricating method thereof
#192Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages
#193Semiconductor device and a method of manufacturing the same
#194Integrated passive device for RF power amplifier package
#195Electronic package and method for fabricating the same
#196Shielded package with integrated antenna
#197Semiconductor package with integrated passive electrical component
#198Integrated circuit package mold assembly
#199Multiple plated via arrays of different wire heights on same substrate
#200Element place on laminates
#2013D IC method and device
#202Multi-chip package and method of formation
#203Wireless module with antenna package and cap package
#204Packaged semiconductor system having unidirectional connections to discrete components
#205Semiconductor package device and method of manufacturing the same
#206Package with tilted interface between device die and encapsulating material
#207Multi-stacked package-on-package structures
#208Package structures and methods of forming the same
#209Surface-mountable device
#210Semiconductor package and method of manufacturing the same
#211Semiconductor device and method for fabricating the same
#2123DIC packaging with hot spot thermal management features
#213Electrically testable integrated circuit packaging
#214Semiconductor device package and method of manufacturing the same
#215Semiconductor device and a method of manufacturing the same
#216High density multi-component packages
#217Semiconductor device and method of forming a 3D integrated system-in-package module
#218Integrated passive device and fabrication method using a last through-substrate via
#219MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#220Semiconductor package
#221Semiconductor device with first and second transistors and support part
#222Method for fabricating electronic package
#223Electronics package with integrated interconnect structure and method of manufacturing thereof
#224Semiconductor device
#225Antenna module and manufacturing method thereof
#226Semiconductor package and method of forming the same
#227Vertical interconnects for self shielded system in package (SiP) modules
#228Semiconductor package including EMI shielding structure and method for forming the same
#229Extended stiffener for platform miniaturization
#230Semiconductor package device and method of manufacturing the same
#231Semiconductor device
#232SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
#233Semiconductor device assemblies with annular interposers
#234High density interconnection using fanout interposer chiplet
#235Electronic module with EMI protection
#236Method of manufacturing a component embedded package carrier
#237Semiconductor package device and method of manufacturing the same
#238Semiconductor package and manufacturing method thereof
#239Semiconductor device assembly with surface-mount die support structures
#240Methods and apparatus for measuring analytes using large scale FET arrays
#241InFO coil structure and methods of manufacturing same
#242Apparatus and methods for bias switching of power amplifiers
#243Semiconductor device and power amplifier module
#244Semiconductor device with discrete blocks
#245Multiple bond via arrays of different wire heights on a same substrate
#246Semiconductor package structure
#247Integrated circuit packaging system with shielding and method of manufacture thereof
#248Integrated circuit packaging system with shielding and method of manufacture thereof
#249Method of manufacturing electronic component module
#250Microelectronic package having a passive microelectronic device disposed within a package body
#251Electronic package and method for fabricating the same
#252Semiconductor device and method of manufacturing thereof
#253Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader
#254Method of embedding WLCSP components in E-WLB and E-PLB
#255System-in-package with double-sided molding
#256Electronic device
#257Stackable power module
#258PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#259Semiconductor device and method of forming partition fence and shielding layer around semiconductor components
#260Surface mount device stacking for reduced form factor
#261Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages
#262Electronic package and method for manufacturing the same
#263Electronics package having a multi-thickness conductor layer and method of manufacturing thereof
#264Semiconductor device
#265Stackable electronic package and method of fabricating same
#266Stacked semiconductor die assemblies with die support members and associated systems and methods
#267Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
#268Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric
#269Integrated module with electromagnetic shielding
#270Method of fabricating packaging substrate
#271PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
#272Semiconductor package and fabricating method thereof
#273Electronic component package for electromagnetic interference shielding and method for manufacturing the same
#274Semiconductor processing method
#275Stack frame for electrical connections and the method to fabricate thereof
#276Electronic device having a first electronic component and a second electronic component connected by wiring, and manufacturing method therefor
#277Three-layer package-on-package structure and method forming same
#278Structures and methods for low temperature bonding using nanoparticles
#279Air-cavity package with enhanced package integration level and thermal performance
#280Electronic package and method for fabricating the same
#281Efficient heat removal from component carrier with embedded diode
#282Chip integration module, chip package structure, and chip integration method
#283Electronic module and semiconductor package device
#284High-frequency module
#285Package with tilted interface between device die and encapsulating material
#286Air-cavity package with dual signal-transition sides
#287Wafer level package with at least one integrated antenna element
#288Module and manufacturing method thereof
#289Integrated circuit package mold assembly
#290Semiconductor device
#291Semiconductor device and a method of manufacturing the same
#292Structure and formation method of chip package with antenna element
#293Method of manufacturing a semiconductor device
#294Fabrication method of electronic package having embedded package block
#295Semiconductor device package and method of manufacturing the same
#296Semiconductor device and method of forming an integrated SIP module with embedded inductor or package
#297Semiconductor device and method of forming a 3D interposer system-in-package module
#298Semiconductor package device and method of manufacturing the same
#299Chip package
#300Resin molding and sensor device