Switch circuit package module

Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package

Microelectronic packages having mold-embedded traces and methods for the production thereof

EDRAM/DRAM fabricated capacitors for use in on-chip PMUS and as decoupling capacitors in an integrated EDRAM/DRAM and PMU system

Semiconductor device

Flexibly-wrapped integrated circuit die

Semiconductor device

Opening in a multilayer polymeric dielectric layer without delamination

Signal monitoring of through-wafer vias using a multi-layer inductor

Embedded heat spreader with electrical properties

Semiconductor package for III-nitride transistor stacked with diode

Computer modules with small thicknesses and associated methods of manufacturing

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

Semiconductor device and semiconductor module

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Vertically integrated systems

Semiconductor structure

Electronic chip with means of protecting its back face

Pre-molded MEMS device package with conductive shell

Semiconductor substrate assembly with embedded resistance element

Multi-die fine grain integrated voltage regulation

Semiconductor device and method for manufacturing the same

Ground shield structure and semiconductor device

Patterned ground shield structures and semiconductor devices

Semiconductor package and fabrication method thereof

Semiconductor device and electronic device having the same

Chip embedded substrate and method of producing the same

Detection of defective electrical connections

Multi-layer power converter with devices having reduced lateral current

Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure

Integrated high voltage isolation using low value capacitors

Method and apparatus for constructing an isolation capacitor in an integrated circuit

DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor

Suspended inductor microelectronic structures

Guard ring design for maintaining signal integrity

Method to integrate different function devices fabricated by different process technologies

Vertically integrated systems

Vertically integrated systems

Devices and systems for power conversion circuits

Multi-component chip packaging structure

Method for assembling computer modules small in thickness

Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections

Logic die and other components embedded in build-up layers

Semiconductor package and method of manufacturing the same

Multi-chip package and manufacturing method

Discrete device mounted on substrate

IGBT die structure with auxiliary P well terminal

Glass carrier with embedded semiconductor device and metal layers on the top surface

Switch circuit package module

Substrate structure having electronic components and method of manufacturing substrate structure having electronic components

Semiconductor package and method for fabricating the same

Semiconductor package device having passive energy components

Passive devices in package-on-package structures and methods for forming the same

Packages with passive devices and methods of forming the same

MEMS device package with conductive shell

Pre-molded MEMS device package having conductive column coupled to leadframe and cover

Multiple surface integrated devices on low resistivity substrates

Vertically integrated systems

Vertically integrated systems

Vertically integrated systems

Configurable passive components

Chip packages having dual DMOS devices with power management integrated circuits

Interposer and semiconductor package with noise suppression features

Current sensing using a metal-on-passivation layer on an integrated circuit die

Capacitance structure

Structure and Method for Inductors Integrated into Semiconductor Device Packages

Semiconductor module with a semiconductor chip and a passive component and method for producing the same

Integrated circuit chip using top post-passivation technology and bottom structure technology

Package-in-package using through-hole via die on saw streets

Wafer-scale package structures with integrated antennas

Electromagnetic resonance coupler

Circuit module with multiple submodules

Packages with passive devices and methods of forming the same

Semiconductor package including stacked semiconductor chips and a redistribution layer

CAPACITIVE BONDING STRUCTURE FOR ELECTRONIC DEVICES

Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die

INTERPOSER AND SEMICONDUCTOR PACKAGE WITH NOISE SUPPRESSION FEATURES

Defected ground plane inductor

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Power converters with integrated capacitors

Semiconductor package and method of manufacturing the same

FLASH MEMORY CARD WITHOUT A SUBSTRATE AND ITS FABRICATION METHOD

Method for manufacturing a chip packaging structure

Chip packaging structure and manufacturing method for the same

Package systems including passive electrical components

Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures

Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die

WAFER LEVEL EMBEDDED AND STACKED DIE POWER SYSTEM-IN-PACKAGE PACKAGES

Semiconductor device

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFACTURE THEREOF

Power Semiconductor Module with Embedded Chip Package

Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer

INTEGRATED PASSIVE COMPONENT

Integrated Power Stage

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil

III-nitride transistor stacked with diode in a package

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

RFID integrated circuit with integrated antenna structure

Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors

Using backside passive elements for multilevel 3D wafers alignment applications

Semiconductor device and method of manufacture thereof

Semiconductor device and method of forming integrated passive device

Semiconductor electronic device with an integrated device with an integrated galvanic isolator element and related assembly process

Vertically integrated systems

Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint

Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint

Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps

Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die

Semiconductor device with stacked power converter

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Integrated circuit system with distributed power supply comprising interposer and voltage regulator module

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE

HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS

Semiconductor device for semiconductor package having through silicon vias of different heights

MILLIMETER DEVICES ON AN INTEGRATED CIRCUIT

Multimode transceiver for use with multiple antennas and method for use therewith

Method of manufacture of integrated circuit packaging system with stacked integrated circuit

Optical communication in a ramp-stack chip package

Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die

Integrated circuit package with voltage distributor

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure

Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system

Three-dimensional semiconductor integrated circuit

Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires

Manufacturing method of semiconductor device

Method for manufacturing a semiconductor component and structure therefor

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

Semiconductor Package

IC package with capacitors disposed on an interposal layer

Chip embedded substrate and method of producing the same

Mount board and electronic device

Monolithic semiconductor switches and method for manufacturing

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Stacked semiconductor package having discrete components

RFID integrated circuit with integrated antenna structure

Stacked-die electronics package with planar and three-dimensional inductor elements

STACK PACKAGE

Method of forming thin profile WLCSP with vertical interconnect over package footprint

SEMICONDUCTOR DEVICE

Attaching passive components to a semiconductor package

Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars

Retinal prosthesis and method of manufacturing a retinal prosthesis

Hybrid package construction with wire bond and through silicon vias

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Semiconductor device with a balun

Semiconductor Device

Apparatus and method for vertically-structured passive components

DEVICE AND INTERCONNECT IN FLIP CHIP ARCHITECTURE

Methods of making nanotube switches

Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Forming radio frequency integrated circuits

Semiconductor device and method of forming integrated passive device

Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die

Semiconductor device having an interposer

Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors

High-bandwidth ramp-stack chip package

Providing in package power supplies for integrated circuits

Semiconductor package having discrete components and system containing the package

Electronic circuit device

Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces

Integrated circuit packaging system with interposer and method of manufacture thereof

SEMICONDUCTOR DEVICE

NANO-ENCAPSULATED MAGNETIC PARTICLE COMPOSITE LAYERS FOR INTEGRATED SILICON VOLTAGE REGULATORS

Integrated circuit package system with offset stacking and anti-flash structure

Semiconductor device and method of providing electrostatic discharge protection for integrated passive devices

Semiconductor device

Electronic device comprising an integrated circuit and a capacitance element

Integrated circuit chip using top post-passivation technology and bottom structure technology

Oscillator circuit

Integrated circuit packaging system with stacked configuration and method of manufacture thereof

Integrated circuit packaging system with an interposer and method of manufacture thereof

Stacked device assembly with integrated coil and method of forming same

RF-IC PACKAGING METHOD AND CIRCUITS OBTAINED THEREBY

Method for fabricating semiconductor packages with discrete components

Power semiconductor devices having integrated inductor

Integrated Circuit Package for Magnetic Capacitor

3-D ICs equipped with double sided power, coolant, and data features

Monolithic semiconductor switches and method for manufacturing

IC package with capacitors disposed on an interposal layer

Computer modules with small thicknesses and associated methods of manufacturing

CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES

Semiconductor device and semiconductor package including the same

Semiconductor device

Semiconductor device having a mounting substrate with a capacitor interposed therebetween

NANOTUBE ESD PROTECTIVE DEVICES AND CORRESPONDING NONVOLATILE AND VOLATILE NANOTUBE SWITCHES

Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices

Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures

Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillars

Module and mounted structure using the same

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING BUMPED LEAD AND METHOD OF MANUFACTURE THEREOF

Semiconductor device

Semiconductor integrated circuit including a power supply, semiconductor system including a semiconductor integrated circuit, and method of forming a semiconductor integrated circuit

Capacitor Die Design for Small Form Factors

Semiconductor integrated circuit chip, multilayer chip capacitor and semiconductor integrated circuit chip package

FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT

SEMICONDUCTOR MULTI-CHIP PACKAGE

Chip module for complete power train

Stacked die semiconductor device having circuit tape

Packaging technology

Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits

Multi-chip package and manufacturing method

Semiconductor device having a suspended isolating interconnect

Packaged voltage regulator and inductor array

Semiconductor assembly with component pads attached on die back side

Assembling of Electronic Members on IC Chip

Capacitance structures for defeating microchip tampering

METHOD OF FORMING ON-CHIP PASSIVE ELEMENT

Semiconductor device including a transformer on chip

Under bump metallization for on-die capacitor

IC HAVING FLIP CHIP PASSIVE ELEMENT AND DESIGN STRUCTURE

Semiconductor device and method of providing electrostatic discharge protection for integrated passive devices

Method of manufacturing a through-silicon-via on-chip passive MMW bandpass filter

Nanotube ESD protective devices and corresponding nonvolatile and volatile nanotube switches

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Packaged electronic devices with face-up die having TSV connection to leads and die pad

3-D stacking of active devices over passive devices

Wafer level integration package

Flat magnetic element and power IC package using the same

Radio frequency noise and interference suppression in an integrated circuit

Semiconductor assembly having reduced thermal spreading resistance and methods of making same

Integrated doherty type amplifier arrangement with high power efficiency

Power semiconductor devices having integrated inductor

MCM packages

High performance system-on-chip inductor using post passivation process

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits

Semiconductor chip having conductive member for reducing localized voltage drop

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

System and apparatus for wafer level integration of components

Integrated circuit package system with offset stacking and anti-flash structure

Integrated matching networks and RF devices that include an integrated matching network

Integrated circuit package system with offset stacking

Electronic device including an inductor

Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire

Wire bonding personalization and discrete component attachment on wirebond pads

Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures

Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same

System including an inter-chip communication system

Chip capacitor

Multimode transceiver for use with multiple antennas and method for use therewith

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND LEAD FRAME, AND METHOD FOR MANUFACTURING THE SAME

Radiation detector array

TRANSCEIVER FOR USE WITH MULTIPLE ANTENNAS AND METHOD FOR USE THEREWITH

Semiconductor device having a plurality of elements on one semiconductor substrate and method of manufacturing the same

Semiconductor device

Method for forming BGA package with increased standoff height

Integrated circuit packaging system with passive components

Semiconductor device including electronic component coupled to a backside of a chip

Semiconductor device with conductive interconnect

Electronic circuit device having silicon substrate

Semiconductor device and manufacturing method of the same

Semiconductor device having wafer level chip scale packaging substrate decoupling

Integrated Circuit Package with Passive Component

Temperature sensing arrangements for power electronic devices

Sensor-type package and method for fabricating the same

Impedance matching circuit with simultaneous shielding of parasitic effects for transceiver modules

Semiconductor die package with internal bypass capacitors

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Electronic device comprising an integrated circuit and a capacitance element

Reconfigurable MIMO transceiver and method for use therewith

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

Chip embedded substrate and method of producing the same

Mount Board and Electronic Device

Method of making a wafer level integration package

Capacitive element, method of manufacture of the same, and semiconductor device

Image sensor module with a three-dimensional die-stacking structure

CHIP PACKAGE

CHIP PACKAGE

Semiconductor device and method of manufacturing the same

Post passivation interconnection process and structures

Chip Assembly and Method of Manufacturing Thereof

Wafer level system in package and fabrication method thereof

Semiconductor package having die with recess and discrete component embedded within the recess

Package integrated soft magnetic film for improvement in on-chip inductor performance

Semiconductor package having through-hole via on saw streets formed with partial saw

Manufacturing method of semiconductor device

Package-in-package using through-hole via die on saw streets

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Semiconductor device with power noise suppression

Electronic component structure and method of making

Multi-chip module and single-chip module for chips and proximity connectors

Electronics Package And Manufacturing Method Thereof

Capacitance for decoupling intermediate level power rails

Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip

Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package

Semiconductor device and electronic device having the same

Stacked Printed Devices on a Carrier Substrate

Voltage regulator integrated with semiconductor chip

Fabricating method of a semiconductor device

COMPLEX MEMORY CHIP, MEMORY CARD HAVING THE SAME, AND METHOD OF MANUFACTURING THE MEMORY CARD

Assembly comprising a support element and a chip, support element, method for shielding, and method for protecting