212748 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected; Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
Post passivation interconnection process and structures
#602High performance system-on-chip using post passivation process
#603SEMICONDUCTOR DEVICE HAVING INTERPOSER FORMED ON CHIP
#604Integrated matching network and method for manufacturing integrated matching networks
#605High performance system-on-chip using post passivation process
#606Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof
#607Process of forming an electronic device including an inductor
#608Laminating magnetic materials in a semiconductor device
#609Semiconductor assembly with component attached on die back side
#610Stacked die semiconductor device having circuit tape
#611Retinal prosthesis and method of manufacturing a retinal prosthesis
#612Stacked-die electronics package with planar and three-dimensional inductor elements
#613Semiconductor device and manufacturing method thereof
#614Module and mounted structure using the same
#615SEMICONDUCTOR DEVICE
#616Package for an implantable neural stimulation device
#617High performance system-on-chip using post passivation process
#618High performance system-on-chip using post passivation process
#619High performance system-on-chip using post passivation process
#620Semiconductor chip structure
#621High performance system-on-chip using post passivation process
#622High performance system-on-chip using post passivation process
#623High performance system-on-chip using post passivation process
#624High performance system-on-chip using post passivation process
#625Impedance matching circuit with simultaneous shielding of parasitic effects for transceiver modules
#626Method for manufacturing a passive integrated matching network for power amplifiers
#627High performance system-on-chip using post passivation process
#628High performance system-on-chip using post passivation process
#629Power semiconductor devices having integrated inductor
#630On-chip magnetic components
#631Double-sided die
#632Method for making a semiconductor multi-package module having inverted wire bond carrier second package
#633Semiconductor module with a power semiconductor chip and a passive component and method for producing the same
#634Chip module for complete power train
#635System and apparatus for power distribution for a semiconductor device
#636Integrated Circuits Having Controlled Inductances
#637Interposer containing bypass capacitors for reducing voltage noise in an IC device
#638INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING
#639Wiring Board and Semiconductor Device
#640Chip structure with half-tunneling electrical contact to have one electrical contact formed on inactive side thereof and method for producing the same
#641IC chip package with minimized packaged-volume
#642Semiconductor module having discrete components and method for producing the same
#643Integrated circuit die with pedestal
#644Semiconductor device
#645Integrated circuit package on package system
#646Stacked integrated circuits package system with passive components
#647Signal transmission device
#648Semiconductor device having capacitors for reducing power source noise
#649Multilayer integrated circuit for RF communication and method for assembly thereof
#650Semiconductor device and manufacturing method of the same
#651Protection for an integrated circuit chip containing confidential data
#652Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
#653Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate
#654Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides
#655Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate
#656Semiconductor device, fabrication method therefor, and film fabrication method
#657High frequency chip packages with connecting elements
#658Semiconductor device and communication system using the semiconductor device
#659Decoupling capacitor closely coupled with integrated circuit
#660Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure
#661Semiconductor module having a coupling substrate, and methods for its production
#662Decoupling capacitor closely coupled with integrated circuit
#663Package for an implantable neural stimulation device
#664Circuit with a capacitive element with method for testing the same
#665Semiconductor Apparatus and Semiconductor Module
#666Capacitive element, method of manufacture of the same, and semiconductor device
#667Embedded actives and discrete passives in a cavity within build-up layers
#668Semiconductor device having capacitors for reducing power source noise
#669Fabrication of inductors in transformer based tank circuitry
#670Method of manufacturing a passive integrated matching network for power amplifiers
#671Adhesive layer forming a capacitor dielectric between semiconductor chips
#672Semiconductor integrated circuit including a power supply, and semiconductor system including a semiconductor integrated circuit
#673Non-uniform decoupling capacitor distribution for uniform noise reduction across chip
#674Semiconductor device having capacitive insulation means and communication terminal using the device
#675Graded liquid crystal polymer package
#676Retinal prosthesis and method of manufacturing a retinal prosthesis
#677Circuit device
#678System and method for enhancing wafer chip scale packages
#679Vertically integrated system-in-a-package
#680MULTI-CHIP BALL GRID ARRAY PACKAGE
#681Nanotube ESD protective devices and corresponding nonvolatile and volatile nanotube switches
#682Current sensor
#683Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
#684Method of fabricating a semiconductor stacked multi-package module having inverted second package
#685Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)
#686Semiconductor module
#687Interconnection structure through passive component
#688Method for making a semiconductor multi-package module having inverted bump chip carrier second package
#689Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package
#690Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
#691Manufacturing method of semiconductor device
#692Thin film capacitor for reducing power supply noise
#693Microelectronic assemblies incorporating inductors
#694Electronic device and method of manufacturing same
#695Semiconductor package
#696Post passivation interconnection structures
#697Post passivation interconnection process and structures
#698Post passivation interconnection process and structures
#699Integrated inductors and compliant interconnects for semiconductor packaging
#700Semiconductor device and manufacturing method thereof
#701Multi-chip module and single-chip module for chips and proximity connectors
#702Integrated circuit die with pedestal
#703Semiconductor device with wire bond inductor and method
#704Interposer containing bypass capacitors for reducing voltage noise in an IC device
#705Semiconductor die package with internal bypass capacitors
#706Apparatus for providing capacitive decoupling between on-die power and ground conductors
#707Semiconductor device having inductor
#708Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same
#709Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor
#710Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof
#711Array capacitors in interposers, and methods of using same
#712Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#713Electronic circuit device having silicon substrate
#714High performance system-on-chip discrete components using post passivation process
#715Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#716Circuit device
#717Semiconductor package structure with reduced parasite capacitance and method of fabricating the same
#718Circuit device and manufacturing method thereof
#719Multilayer integrated circuit for RF communication and method for assembly thereof
#720Integrated circuit module package and assembly method thereof
#721Semiconductor package
#722Multi-chip package
#723Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same
#724Electronic device configured as a multichip module, leadframe and panel with leadframe positions
#725High performance system-on-chip using post passivation process
#726Semiconductor device with capacitor
#727High performance system-on-chip discrete components using post passivation process
#728High performance RF inductors and transformers using bonding technique
#729Integrated circuit packages with sandwiched capacitors
#730Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate
#731Semiconductor device having capacitors for reducing power source noise
#732Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
#733Method of backside grinding a bumped wafer
#734Integrating passive components on spacer in stacked dies
#735Microconverter and laminated magnetic-core inductor
#736Impedance matching circuit with simultaneous shielding of parasitic effects for transceiver modules
#737Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation
#738Semiconductor device having semiconductor chips mounted on package substrate
#739Magnetic thin film, magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device
#740Wiring substrate for mounting semiconductor components
#741Prevention of contamination on bonding pads of wafer during SMT
#742High-frequency chip packages
#743Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other
#744Microelectronic package
#745Leadless leadframe package substitute and stack package
#746Chip embedded integrated voltage regulator
#747Multi-terminal inductor for integrated circuit
#748Signal isolator integrated circuit package
#749Chip packaging structure and manufacturing method thereof