SEMICONDUCTOR DEVICE

Packaging for high power integrated circuits

Cooled Integrated Circuit

Leadframe and mold compound interlock in packaged semiconductor device

Wire bonding and wire bonding method

Process for fabricating electronic components using liquid injection molding

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD

Microelectronic packages and methods therefor

Substrate and manufacturing method of package structure

Stacked semiconductor package having fan-out structure through wire bonding

SIP package with small dimension

Package on package and method thereof

Semiconductor package having a bridged plate interconnection

Thermally Enhanced BGA Packages and Methods

Edge connect wafer level stacking

Microelectronic component assemblies and microelectronic component lead frame structures

Electronic device and lead frame

METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMANCE OF SEMICONDUCTOR DEVICES BY SURFACE MODIFICATION

PACKAGE FOR MIXED SIGNAL MCU WITH MINIMAL PIN COUNT

Semiconductor device

Stack type semiconductor device package

Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires

Pin Array No Lead Package and Assembly Method Thereof

Arrangement for cooling a power semiconductor module

Method of manufacturing semiconductor device

Method of making a semiconductor package and method of making a semiconductor device

Lead frame routed chip pads for semiconductor packages

Wire Bump Material

Structure and method for optical connection between optical transmitter and optical receiver

Elimination of RDL using tape base flip chip on flex for die stacking

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

TWO-WAY HEAT EXTRACTION FROM PACKAGED SEMICONDUCTOR CHIPS

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package and semiconductor system in package using the same

Integrated circuit package system with stacked die

Semiconductor package and semiconductor device

Semiconductor device package

Semiconductor package and stacked semiconductor package

Semiconductor package with inner leads exposed from an encapsulant

Method and apparatus for directing molding compound flow and resulting semiconductor device packages

Module with a shielding and/or heat dissipating element

Memory card

Single Package Multiple Component Array With Ball Grid Array Mounting and Contact Interface

Structure of high performance combo chip and processing method

Structure of high performance combo chip and processing method

Set of resin compositions for preparing system-in-package type semiconductor device

Programmable system in package

Integrated circuit package system with encapsulation lock

Semiconductor device and method for fabricating the same

Modularized Die Stacking System and Method

Stacked die semiconductor device having circuit tape

Stacked multi-chip package with EMI shielding

Reduction in thickness of semiconductor component on substrate

Electronic component package with EMI shielding

SEMICONDUCTOR LEADFRAME FOR UNIFORM MOLD COMPOUND FLOW

Microelectronic component assemblies and microelectronic component lead frame structures

Packaged microelectronic components with terminals exposed through encapsulant

Package semiconductor and fabrication method thereof

Integrated circuit package system with encapsulation lock

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK

Electronic packages with fine particle wetting and non-wetting zones

Process for manufacturing semiconductor devices

Perimeter matrix ball grid array circuit package with a populated center

SYSTEM AND METHOD FOR THERMAL EXPANSION PRE-COMPENSATED PACKAGE SUBSTRATE

Methods for packaging and sealing an integrated circuit die

Semiconductor apparatus

Method for producing a circuit module comprising at least one integrated circuit

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Method of producing a semiconductor package

Semiconductor component having a semiconductor die and a leadframe

INTEGRATED CIRCUIT PACKAGE

Semiconductor device package and manufacturing method

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC SHIELDING PART

Electronic circuit package and fabricating method thereof

Method of manufacturing a combined multilayer circuit board having embedded chips

Map type semiconductor package

Microelectronic devices and methods for manufacturing microelectronic devices

High temperature operating package and circuit design

IC package with a protective encapsulant and a stiffening encapsulant

Distributed semiconductor device methods, apparatus, and systems

SEMICONDUCTOR COMPONENT WITH COOLING APPARATUS

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

POP package and method of fabricating the same

High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies

Spacers for separating components of semiconductor device assemblies, semiconductor device assemblies and systems including spacers and methods of making spacers

Stacked-die electronics package with planar and three-dimensional inductor elements

Semiconductor package and method therefor

Integrated circuit package system with interlock

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE

Semiconductor component with plastic housing, and process for producing the same

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Implantable microelectronic device and method of manufacture

Stacked structure of chips and water structure for making the same

Metal core foldover package structures

Module and mounted structure using the same

Semiconductive device having improved copper density for package-on-package applications

Light emitting apparatus with an opening part, manufacturing method thereof, and light unit

LED with phosphor tile and overmolded phosphor in lens

Circuit Board Assembly Having Passive Component and Stack Structure Thereof

Process of forming a laminate ceramic circuit board

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards

High frequency line-to-waveguide converter and high frequency package

Plastic overmolded packages with molded lid attachments

Semiconductor device package and manufacturing method

BGA package with leads on chip field of the invention

Components, methods and assemblies for stacked packages

Semiconductor device and manufacturing method of the same

Stackable semiconductor package

Microelectronic package

Integrated circuit including clip

Interconnect for improved die to substrate electrical coupling

Light emitting device

CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Functional device-mounted module and a method for mounting functional device-mounted module

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

High density electronic packages

Electronic device and method for producing a device

Semiconductor package having flexible lead connection plate for electrically connecting base and chip

Multi-chip structure

Semiconductor chip packages and assemblies with chip carrier units

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE

Quad flat package

Package with solder-filled via holes in molding layers

STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME

Process for precision placement of integrated circuit overcoat material

PACKAGE-BASE STRUCTURE OF POWER SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS OF THE SAME

Acceleration sensor

Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density

Integrated circuit package system with down-set die pad and method of manufacture thereof

Method of fabricating a stacked die having a recess in a die BGA package

COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD OF MAKING THE SAME

Optoelectronic module

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

Integrated circuit package system

Intergrated circuit utilizing down bond to define the function of the die and the implementing method thereof

Chip-stacked package structure

MULTICHIP DEVICE AND METHOD FOR PRODUCING A MULTICHIP DEVICE

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Stackable multi-chip package system

Integrated circuit package system for package stacking and manufacturing method thereof

Stackable multi-chip package system with support structure

Electronic Device and Method For Producing the Same

Integrated circuit package system including die stacking

Micro chip-scale-package system

LEADFRAME AND NON-LEAD PACKAGE THEREWITH

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

Electronic packages with roughened wetting and non-wetting zones

Semiconductor package

STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Semiconductor package having passive component and semiconductor memory module including the same

Semiconductor device having a semiconductor chip enclosed by a body structure and a base

Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture

Nonvolatile memory apparatus

Multi Lead Frame Power Package

Semiconductor device and method for manufacturing same

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Leaded stacked packages having elevated die paddle

Heat dissipating semiconductor package and heat dissipating structure thereof

Semiconductor device and manufacturing method therefor

Electronic circuit in a package-in-package configuration and production method

Brick type stackable semiconductor package

Stack type semiconductor package and method of fabricating the same

Pillar Bump Package Technology

Hybrid Microelectronic Package

Chip package structure and manufacturing method thereof

Integrated circuit package system with laminate base

Surface mount multichip devices

Leaded stacked packages having integrated upper lead

Semiconductor structure of a high side driver

Chip structure with redistribution traces

SEMICONDUCTOR PACKAGE HAVING ADVANTAGE FOR STACKING AND STACK-TYPE SEMICONDUCTOR PACKAGE

Semiconductor package and fabrication method thereof

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Integrated circuit package system with flashless leads

Integrated circuit package system employing an exposed thermally conductive coating

Methods and systems for laser assisted wirebonding

Quad flat no-lead (QFN) chip package assembly apparatus and method

Structure of high performance combo chip and processing method

Miniature optical element for wireless bonding in an electronic instrument

Package board integrated with power supply

Thermally conductive composite and uses for microelectronic packaging

Semiconductor device and method of manufacturing the same

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Bottom substrate of package on package and manufacturing method thereof

Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames

Superfine-circuit semiconductor package structure

Semiconductor device for pipe for passing refrigerant liquid

Integrated circuit package system with ground bonds

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Integrated circuit package system with stiffener

Integrated circuit package-in-package system

Integrated circuit packaging system with ultra-thin die

Semiconductor device

Semiconductor device

Transfer mold solution for molded multi-media card

CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE

System-in-package structure

Method of fabricating an integrated circuit with etched ring and die paddle

Optoelectronic device

Vent Closing Method And The Use Of An Ultrasonic Bonding Machine For Carrying Out The Method

Methods of operating electronic devices, and methods of providing electronic devices

Method of manufacturing a semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit package system with offset stack

Heat dissipating structure and method for fabricating the same

Semiconductor device having heat spreader with center opening

Package Using Selectively Anodized Metal and Manufacturing Method Thereof

Compliant integrated circuit package substrate

Semiconductor package having functional and auxiliary leads, and process for fabricating it

METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE

Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages

Manufacturing method of wiring substrate

Light -Emitting Body,Lighting Device And Display Device Using The Same

IC packages with internal heat dissipation structures

Integrated circuit and method for writing information

Integrated circuit (IC) package stacking and IC packages formed by same

Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device

Structure and method for producing multiple size interconnections

Printed circuit board for package of electronic components and manufacturing method thereof

High frequency semiconductor device

Stacking structure of chip package

Semiconductor device having an element mounted on a substrate and an electrical component connected to the element

Nested integrated circuit package on package system

MULTI-CHIP PACKAGE STRUCTURE

High power shunt switch with high isolation and ease of assembly

Package-on-package system

Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device

Coreless cavity substrates for chip packaging and their fabrication

Semiconductor package and method of assembling the same

Stacked Chips with Underpinning

Method of fixing curved circuit board and wire bonding apparatus

Magnetic shielding for magnetic random access memory

Computer systems having an interposer including a flexible material

Semiconductor Device

Method of making thermally enhanced substrate-base package

Power semiconductor device connected in distinct layers of plastic

System-in-package device

Semiconductor device with improved high current performance

Semiconductor device

Package structure and lead frame using the same

Methods and apparatus for a semiconductor device package with improved thermal performance

SAWN INTEGRATED CIRCUIT PACKAGE SYSTEM

Multiple row exposed leads for MLP high density packages

Chip stack package and manufacturing method thereof

Semiconductor device encapsulated with resin composition

Semiconductor package and method for fabricating the same

Encapsulated electronic device

Stackable semiconductor package

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of passive element device

Process to reform a plastic packaged integrated circuit die

Multilayer electronic component, electronic device, and method for producing multilayer electronic component

Semiconductor package structure having enhanced thermal dissipation characteristics

Integrated circuit package system with edge connection system

Chip stack, method of fabrication thereof, and semiconductor package having the same

Method of manufacturing an electronic component package

Multiple die stack apparatus employing T-shaped interposer elements

Stacked package electronic device

Stack structure of circuit board with semiconductor component embedded therein

Stackable multi-chip package system

Stackable semiconductor package

Microelectronic package having solder-filled through-vias

Leadframe IC packages having top and bottom integrated heat spreaders

Electric circuit device and related manufacturing method

Light-emitting device manufacturing method and light-emitting device

Method for producing a chip-substrate connection

SUBSTRATE AND LAYOUT METHOD

Separation method of semiconductor device

Semiconductor integrated circuit device with power lines improved

Interconnect structure and formation for package stacking of molded plastic area array package

Integrated circuit package having exposed thermally conducting body

Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier

Semiconductor device

SYSTEM IN PACKAGE MODULE

Image sensor package having mount holder attached to image sensor die

Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor Device

Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body

Electronic device substrate, electronic device and methods for fabricating the same

SEMICONDUCTOR PACKAGE

Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages

PACKAGED DEVICES AND METHODS FOR FORMING PACKAGED DEVICES

Circuit card module and method for fabricating the same

Electronic component having a semiconductor power device

Copper straps

Integrated circuit having stress tuning layer

Methods and apparatus having an integrated circuit attached to fused silica

Micro-package, multi-stack micro-package, and manufacturing method therefor

Semiconductor input control device

Integrated circuit package system with contoured encapsulation

High Withstand Voltage Semiconductor Device Covered with Resin and Manufacturing Method Therefor

Method for fabricating semiconductor package with multi-layer die contact and external contact

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having a chip stack on a rewiring plate

Semiconductor device and method of producing the same

Electronic device with integrated heat distributor