COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same

Method of fabricating microelectronic devices

THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE

INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS

Semiconductor Housings Having Coupling Coatings

Lead frame and semiconductor device using the same

CHIP PACKAGE

Test pads on flash memory cards

Wafer level stack structure for system-in-package and method thereof

DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION

System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Encapsulation for particle entrapment

Attaching heat sinks to integrated circuit packages

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Stackable semiconductor package

Bump structure, method of forming bump structure, and semiconductor apparatus using the same

Memory package structure

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME

Molded SiP package with reinforced solder columns

Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same

Packaging of integrated circuits to lead frames

Leadframe structures for semiconductor packages

Light emitting diode package with direct leadframe heat dissipation

Chip structure with half-tunneling electrical contact to have one electrical contact formed on inactive side thereof and method for producing the same

Method of manufacturing semiconductor apparatus

Method for fabricating semiconductor package free of substrate

Carrierless chip package for integrated circuit devices, and methods of making same

Semiconductor die package including multiple dies and a common node structure

Semiconductor element mounting board and optical transmission module

Surface mounting electronic component and manufacturing method thereof

Filter device substrate and filter device

IC chip package with minimized packaged-volume

Ball Grid array package structure

Embedded integrated circuit package-on-package system

Package for optical device and method of manufacturing the same

MULTI-DIE INDUCTOR

Semiconductor device using semiconductor chip

Method of manufacturing a through electrode

POP Semiconductor Device Manufacturing Method

Multilayer wiring board

ELECTRODE, MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR DEVICE HAVING THE SAME

Programmable system in package

Stacked integrated circuit package-in-package system

Electronic component device

Electronic component package

Overmolded semiconductor package with a wirebond cage for EMI shielding

Semiconductor device package with base features to reduce leakage

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

High frequency IC package and method for fabricating the same

Single package wireless communication device

Power semiconductor module with flush terminal elements

Substrate for a microelectronic package and method of fabricating thereof

Chip package structure

Methods of Packaging Using Fluid Resin

Methods of forming semiconductor assemblies

Semiconductor device manufacturing method

Tape wiring substrate and tape package using the same

UNIVERSAL CHIP PACKAGE STRUCTURE

Packaged microelectronic devices recessed in support member cavities, and associated methods

Ball grid array housing having a cooling foil

Semiconductor packaging unit with sliding cage

Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer

Semiconductor device with lead frames

Memory card

Semiconductor device including a DC-DC converter

Semiconductor module with current connection element

Semiconductor light-emitting device

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Connecting device for electronic components

Method of packaging integrated circuit devices using preformed carrier

PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

Separation method for cutting semiconductor package assemblage for separation into semiconductor packages

Manufacturing method of a package structure

Semiconductor device

Method for precision assembly of integrated circuit chip packages

Semiconductor device and a method of manufacturing the same

Chip package with a ring having a buffer groove that surrounds the active region of a chip

Electronic component and its manufacturing method

Power electronics equipments

Microelectronic devices and methods for manufacturing microelectronic devices

Optical semiconductor device

Memory card structure and method for manufacturing the same

Carrierless chip package for integrated circuit devices, and methods of making same

Integrated circuit package system

Multichip package system

Integrated circuit package-in-package system

Leadless leadframe implemented in a leadframe-based BGA package

Chip package and wafer treating method for making adhesive chips

Method for making QFN package with power and ground rings

Semiconductor Device Including a Plurality of Semiconductor Chips Packaged in a Common Housing

Method for fabricating a semiconductor package

Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods

Board on chip package and manufacturing method thereof

Integrated circuit package system having interconnect stack and external interconnect

Semiconductor device

GaAs power transistor

Semiconductor chip package having a slot type metal film carrying a wire-bonding chip

Ball grid array substrate having window and method of fabricating same

SiP module with a single sided lid

SEMICONDUCTOR DEVICE WITH BATTERY

Microelectromechanical microphone packaging system

Microelectonic packages and methods therefor

Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means

Sub-assembly

Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same

Stackable integrated circuit package system with multiple interconnect interface

Electronic assembly and method for forming the same

Stacked integrated circuit package system

No lead package with heat spreader

Integrated circuit package system including die stacking

Transmission line substrate and semiconductor package

Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface

Manufacturing method of semiconductor device

Manufacturing method of semiconductor device

Integrated circuit package system with L-shaped leadfingers

Cap layer for an aluminum copper bond pad

Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same

Ball grid array package

Electronic circuit, a semiconductor device and a mounting substrate

Substrate of chip package and chip package structure thereof

Chip package and stacked structure of chip packages

Semiconductor module and method of manufacturing the same

Semiconductor device

Printed board with a pin for mounting a component

Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor

Wafer level chip packaging

Integrated circuit package system with exposed interconnects

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Integrated circuit package system with heat sink

Method of fabricating a 3-D package stacking system

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Ceramic multilayer substrate

Method for producing a surface-mountable semiconductor component

Method and structure for coupling two microcircuits

Integrated circuit package system including zero fillet resin

Semiconductor device with an improved solder joint

Semiconductor device having through contact blocks with external contact areas

Semiconductor device package and methods for producing same

Stacked semiconductor structure and fabrication method thereof

Semiconductor device, electronic device, and manufacturing method of the same

Interconnect substrate, semiconductor device, and method of manufacturing the same

Wafer level chip scale package system

INTEGRATED CIRCUIT SYSTEM WITH WAFERSCALE SPACER SYSTEM

Method of packaging semiconductor die without lead frame or substrate

Hybrid multilayer substrate and method for manufacturing the same

Semiconductor device

Plastic ball grid array package with integral heatsink

Thin integrated circuit device packages for improved radio frequency performance

Integrated circuit underfill package system

Semiconductor package

Semiconductor module having a semiconductor chip stack and method

INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS

Methods for fabricating stiffeners for flexible substrates

Semiconductor apparatus manufacturing method

Optical bond-wire interconnections and a method for fabrication thereof

Flip-attached and underfilled stacked semiconductor devices

Multilayer integrated circuit for RF communication and method for assembly thereof

Semiconductor device with surface-mountable external contacts and method for manufacturing the same

Wafer level stack structure for system-in-package and method thereof

Stack chip and stack chip package having the same

Integrated circuit package system including wide flange leadframe

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

Padless die support integrated circuit package system

Integrated circuit package system with multiple molding

Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package

OVERMOLDED OPTICAL PACKAGE

Semiconductor device and electric apparatus

Semiconductor package, substrate with conductive post, stacked type semiconductor device, manufacturing method of semiconductor package and manufacturing method of stacked type semiconductor device

Power configuration method for structured ASICs

Semiconductor chip package with attached electronic devices, and integrated circuit module having the same

Integrated circuit having second substrate to facilitate core power and ground distribution

Interconnects with interlocks

Thermally enhanced semiconductor package and method of producing the same

Semiconductor package structure and fabrication method thereof

Semiconductor package with integrated heatsink and electromagnetic shield

Leadless lead-frame

Low cost method to produce high volume lead frames

Semiconductor package

Semiconductor package structure and fabrication method thereof

Semiconductor package and process for making the same

Strip for integrated circuit packages having a maximized usable area

Method of manufacturing wiring substrate

Method for fabricating a flip chip system in package

Printed circuit board and method of manufacturing semiconductor package using the same

Millimeter-wave radar apparatus and millimeter radar system using the same

Semiconductor device and electronic component module using the same

Through-hole contacts in a semiconductor device

Method for manufacturing mold type semiconductor device

SEMICONDUCTOR PACKAGE HAVING IMPROVED SOLDER JOINT RELIABILITY AND METHOD OF FABRICATING THE SAME

Structure of Ball Grid Array package

Semiconductor device

Circuit module

Package optical chip with conductive pillars

Managed memory component

Integrated circuit package-in-package system

Low profile managed memory component

Stacked integrated circuit package-in-package system

Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates

Interconnected IC packages with vertical SMT pads

Package structure of thin lead-frame

Overhang integrated circuit package system

Rounded contact fingers on substrate/PCB for crack prevention

Method for manufacturing high-frequency module device

Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages

Method of fabricating leadframe based flash memory cards including singulation by straight line cuts

Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package

ARRAY CIRCUIT SUBSTRATE AND WIRE BONDING PROCESS USING THE SAME

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Hidden plating traces

Multi-die package and method for fabricating same

Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same

Test pads on flash memory cards

Chip-spacer integrated radio frequency ID tags, methods of making same, and systems containing same

Microelectronic packages and methods therefor

Microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor device with semiconductor device components embedded in a plastic housing composition

Multi-chip package sharing temperature-compensated self-refresh signal and method thereof

Semiconductor chip and semiconductor device

Stacked packages with interconnecting pins

Packaged chip having features for improved signal transmission on the package

Techniques for packaging multiple device components

Semiconductor component including semiconductor chip and method for producing the same

Stack-type semiconductor package and manufacturing method thereof

Package having exposed integrated circuit device

Plating bar design for high speed package design

Circuit board, semiconductor device, and manufacturing method of circuit board

Semiconductor device and electronic control unit using the same

Light emission diode and method of fabricating thereof

High luminance light emitting diode and liquid crystal display device using the same

Method for fabricating semiconductor packages, and structure and method for positioning semiconductor components

Stackable molded packages and methods of making the same

Package for high power density devices

SEMICONDUCTOR PACKAGE WITH HEAT DISSIPATING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device, and inspection method thereof

Stack package of ball grid array type

Semiconductor device and manufacturing method of the same

Packaging method of a plurality of chips stacked on each other and package structure thereof

Semiconductor package

Semiconductor device module structure

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

Multi-strand substrate for ball-grid array assemblies and method

Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Negative thermal expansion material filler for low CTE composites

Semiconductor component having plate, stacked dice and conductive vias

System-in-package structure

Multichip stacking structure

Semiconductor package having increased resistance to electrostatic discharge

Semiconductor chip mounted interposer, semiconductor device, semiconductor chip interposer fabrication method, bare chip mounted interposer, and interposer sheet

Chip package structure

Surface processing agent for tin or tin alloy material

Carbon nanotube reinforced metallic layer

Microelectronic component assemblies having lead frames adapted to reduce package bow

Method of making exposed pad ball grid array package

Sensor system having a substrate and a housing, and method for manufacturing a sensor system

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device with a wiring substrate and method for producing the same

Metal core, package board, and fabricating method thereof

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes

MEMORY CARD

Chip package structure

Interconnection element for BGA housings and method for producing the same

Method of making semiconductor package having exposed heat spreader

Radio-frequency system in package including antenna

A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER

Semiconductor device

Circuit substrate and method of manufacture

Semiconductor/printed circuit board assembly, and computer system

Semiconductor integrated circuit

SEMICONDUCTOR DEVICE

Flip-chip semiconductor device manufacturing method

Method of manufacturing a wafer level package with a cap structure for hermetically sealing a micro device

Semiconductor package with heat sink, stack package using the same and manufacturing method thereof

Stackable semiconductor package and method for its fabrication

Integrated circuit package system with lead structures including a dummy tie bar

Ultra-thin quad flat no-lead (QFN) package

Semiconductor devices including voltage switchable materials for over-voltage protection

Method and device for connecting chips

Method of fabricating an exposed die package

Integrated circuit package system with heat sink

Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure

Micro chip-scale-package system

Enhancing shock resistance in semiconductor packages

Reversible leadless package and methods of making and using same

Method and apparatus for forming a DMD window frame with molded glass

Integrated circuit package system with channel

INTEGRATED CIRCUIT PACKAGE SYSTEM

Wafer scale heat slug system

INTEGRATED CIRCUIT PACKAGE SYSTEM

Microelectronic connection component

Bumped chip carrier package using lead frame and method for manufacturing the same

Stacked integrated circuit leadframe package system

Semiconductor chip package with a metal substrate and semiconductor module having the same

Low voltage drop and high thermal performance ball grid array package