Controlling substrate surface properties via colloidal coatings

Composite semiconductor device

Image sensing devices including image sensor chips, image sensor package modules employing the image sensing devices, electronic products employing the image sensor package modules, and methods of fabricating the same

Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement

LIGHT RECEIVING APPARATUS

CONVERSION SUBSTRATE FOR A LEADFRAME AND THE METHOD FOR MAKING THE SAME

Semiconductor package land grid array substrate and plurality of first and second electrodes

Semiconductor device and method for manufacturing the same

Semiconductor integrated circuit device and fabrication process thereof

SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY

Stackable semiconductor device and fabrication method thereof

Integrated circuit and method for producing the same

Semiconductor device and method for manufacturing thereof

Structure and electronics device using the structure

Semiconductor package and the method of making the same

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

CHIP PACKAGE STRUCTURE

Integrated circuit package system with lead support

SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

Leadframe design for QFN package with top terminal leads

Semiconductor light emitting device

Integrated circuit package system employing multi-package module techniques

Semiconductor device and method of manufacturing the same

Power delivery package having through wafer vias

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD, APPARATUS, AND SYSTEM FOR PHASE CHANGE MEMORY PACKAGING

Lead structure for a semiconductor component and method for producing the same

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Multi-chip package with a single die pad

Method and apparatus for fabricating a plurality of semiconductor devices

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

CHIP PACKAGE STRUCTURE

Vertical electrical interconnect formed on support prior to die mount

Circuit component and method of manufacture

Semiconductor device package

Semiconductor device and manufacturing method of the same

BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME

Semiconductor component and production method

Method of fabricating module having stacked chip scale semiconductor packages

Thin film deposition as an active conductor and method therefor

Electronic device, package having the same, and electronic apparatus

Semiconductor device and method of manufacturing the same

Substrate with feedthrough and method for producing the same

Semiconductor device

Stacked-Chip Semiconductor Device

Semiconductor component and method of manufacture

Chip package substrate and structure thereof

Package substrate strip, metal surface treatment method thereof and chip package structure

Light emitting diode and method of fabricating the same

SEMICONDUCTOR PACKAGE HAVING ENHANCED HEAT DISSIPATION AND METHOD OF FABRICATING THE SAME

Resin encapsulation molding method for semiconductor device

Electronic package and manufacturing method thereof

Planar multi semiconductor chip package and method of manufacturing the same

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME

Memory IC package assembly having stair step metal layer and apertures

Semiconductor package configuration with improved lead portion arrangement

Low-profile capillary for wire bonding

Soldering method and method of manufacturing semiconductor device including soldering method

Component assembly

SENSITIVE SILICON MICROPHONE WITH WIDE DYNAMIC RANGE

Package having a plurality of mounting orientations

THREE-DIMENSIONAL INTERCONNECT INTERPOSER ADAPTED FOR USE IN SYSTEM IN PACKAGE AND METHOD OF MAKING THE SAME

CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE

Semiconductor package and fabrication method thereof

INTEGRATED CIRCUIT

High frequency device module and manufacturing method thereof

Power device package and semiconductor package mold for fabricating the same

Universal substrate for a semiconductor device having selectively activated fuses

Stackable bare-die package

Stackable integrated circuit package system with multiple interconnect interface

High Frequency Switch With Low Loss, Low Harmonics, And Improved Linearity Performance

Package board and method for manufacturing thereof

DIE COAT PERIMETER TO ENHANCE SEMICONDUCTOR RELIABILITY

Semiconductor device and wire bonding method

Electronic package structure and method

Single-sided, flat, no lead, integrated circuit package

Module comprising a semiconductor chip comprising a movable element

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME

Semiconductor device and semiconductor module using the same

Integrated Circuit Device Package with an Additional Contact Pad, a Lead Frame and an Electronic Device

Electronic component and method for manufacturing an electronic component

Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same

Transfer mask in micro ball mounter

Method for manufacturing passive device and semiconductor package using thin metal piece

Electronic component module and method for manufacturing the same

High-frequency module

SEMICONDUCTOR PACKAGE WIRE BONDING

Integrated circuit including gas phase deposited packaging material

Module with silicon-based layer

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND METHOD OF THE SAME

Image sensor package with die receiving opening and method of the same

Stacked semiconductor package

SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE THEREFOR

Semiconductor package and its manufacturing method

SEMICONDUCTOR CHIP SUPPRESSING A VOID DURING A DIE ATTACHING PROCESS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Method of fabricating chip package structure

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

Semiconductor device

Integrated circuit packaging system with interposer

Heat dissipating device with preselected designed interface for thermal interface materials

Stackable semiconductor package having metal pin within through hole of package

Microelectronic packages and methods therefor

SEMICONDUCTOR PACKAGE STRUCTURE AND CARRIER STRUCTURE

Chip package structure

PACKAGE-ON-PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME BY USING A LEADFRAME

Integrated circuit package system with integral inner lead and paddle

Package-level electromagnetic interference shielding

High performance sub-system design and assembly

Passivation layer for a circuit device and method of manufacture

Method for manufacturing integrated circuit device having antenna conductors

Low Cost Stacked Package

Die package with asymmetric leadframe connection

Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

Method for precision assembly of integrated circuit chip packages

Fabrication method of semiconductor package

Circuit module and circuit device including circuit module

ELECTRONIC PACKAGE STRUCTURE

Semiconductor module, module substrate structure, and method of fabricating the same

PACKAGE STRUCTURE WITH EMBEDDED CAPACITOR, FABRICATING PROCESS THEREOF AND APPLICATIONS OF THE SAME

SEMICONDUCTOR PACKAGE HAVING EVAPORATED SYMBOLIZATION

Wiring board and semiconductor device

Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package

Integrated circuit package system with an encapsulant cavity and method of fabrication thereof

ELECTRONIC PACKAGE STRUCTURE

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

Lead frame for chip packages with wire-bonding at single-side pads

Modular board device, high frequency module, and method of manufacturing the same

Stress free package and laminate-based isolator package

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of manufacturing the same

Semiconductor device having a high frequency electrode positioned with a via hole

Chip arrangement and method for producing a chip arrangement

Method of manufacturing a printed wiring board lead frame package

MULTICHIP PACKAGE HAVING A PLURALITY OF SEMICONDUCTOR CHIPS SHARING TEMPERATURE INFORMATION

Plastic semiconductor packages having improved metal land-locking features

IC chip package with near substrate scale chip attachment

Semiconductor device and method of fabricating the same

Enhanced durability multimedia card

Electric Device Comprising a Housing and a Cooling Body

Semiconductor device

MULTI-CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Substrate improving immobilization of ball pads for BGA packages

Chip package structure

Ball grid array structures having tape-based circuitry

Semiconductor package, manufacturing method thereof and IC chip

Semiconductor power device

Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package

Thin semiconductor package having stackable lead frame and method of manufacturing the same

CHIP PACKAGE CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE

MEMS microphone package and method thereof

Integrated circuit/printed circuit board substrate structure and communications

Pin with shape memory alloy

Method of forming component package

Method of making a semiconductor device having multiple die redistribution layer

B-stageable die attach adhesives

Local wireless communications within a device

Chip mount, methods of making same and methods for mounting chips thereon

Stacked type chip package structure

Sub-assembly

Dual molded multi-chip package system

Integrated circuit package with top pad

Semiconductor device having multiple die redistribution layer

Control of Standoff Height Between Packages with a Solder-Embedded Tape

Method for fabricating heat-dissipating package and heat-dissipating structure applicable thereto

Heat dissipation semiconductor pakage

Memory module for improving impact resistance

Semiconductor device and method of manufacturing the same

Semiconductor device with chip mounted on a substrate

Method of making a multi-layered semiconductor device

Integrated circuit package with molded cavity

Stackable integrated circuit package system with recess

Mountable integrated circuit package-in-package system with adhesive spacing structures

Bridge stack integrated circuit package-on-package system

Semiconductor package having leadframe with exposed anchor pads

Lead Frame

CHIP PACKAGE STRUCTURE

Stacked-package quad flat null lead package

Microelectronic Assembly Using Chip-On-Lead (COL) and Cantilever Leads

Stress mitigation in packaged microchips

Alignment and cutting of microelectronic substrates

Chip mounting with flowable layer

SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS

Light emitting diode package with direct leadframe heat dissipation

Accessible electronic storage apparatus

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape

Integrated circuit package system employing mold flash prevention technology

Semiconductor package on package having plug-socket type wire connection between packages

Semiconductor package structure and method for manufacturing the same

Inverted lead frame in substrate

SEMICONDUCTOR DEVICE PACKAGE

Method of fabricating a shielded stacked integrated circuit package system

Plastic electronic component package

Light emitting device package and method for manufacturing the same

Integrated circuit device mounting with folded substrate and interposer

Semiconductor package, manufacturing method thereof and IC chip

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Manufacturing method for micro-SD flash memory card

Circuit board and manufacturing method thereof

Flip chip semiconductor packaging device and testing method using first and second reflectors for determining gap between chip and circuit board or first and second chips

MICROBALL MOUNTING METHOD AND MOUNTING DEVICE

Semiconductor package having non-ceramic based window frame

Stress management in BGA packaging

Chip package and method of manufacturing the same

3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA

Integrated circuit package system employing a support structure with a recess

Integrated circuit package with elevated edge leadframe

Semiconductor chip and production process therefor

Microelectronic devices and methods for forming interconnects in microelectronic devices

METHOD OF MANUFACTURING MULTI-STACK PACKAGE

Integrated circuit package system employing thin profile techniques

Method for manufacturing an antenna

Memory chip and insert card having the same thereon

Lighting device and lighting method

Stacked die in die BGA package

Method for manufacturing semiconductor device and semiconductor device

Semiconductor package and method for manufacturing the same

Stack package and stack packaging method

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Stackable integrated circuit package system

Multi-layer semiconductor package

Carrierless chip package for integrated circuit devices, and methods of making same

LDO regulator with ground connection through package bottom

Integrated circuit package system employing structural support

COMPLEX MEMORY CHIP, MEMORY CARD HAVING THE SAME, AND METHOD OF MANUFACTURING THE MEMORY CARD

Microcircuit package having ductile layer

Semiconductor package having semiconductor device featuring externally-accessible endless ring-shaped resistance circuit

System-in-package (SiP) and method of manufacturing the same

Substrate for a flexible microelectronic assembly and a method of fabricating thereof

SEMICONDUCTOR DEVICE

Chip on leads

Semiconductor device and printed circuit board

Leadframe, semiconductor package and support lead for bonding with groundwires

PARTIALLY INSULATION COATED METAL WIRE FOR WIRE BONDING AND WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE USING THE SAME

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps

Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device

Rotation joint and semiconductor device having the same

Thermally enhanced semiconductor package

HEAT SPREADER FOR AN ELECTRICAL DEVICE

Semiconductor device package

Collective and synergistic MRAM shields

Wire and solder bond forming methods

Card adapter for use with a storage apparatus

Accessible electronic storage apparatus for use with support frame

Semiconductor device

Semiconductor package and fabrication method thereof

BGA package with encapsulation on bottom of substrate

Package structure having through hole in spacer thereof

Package structure of memory card and manufacturing method thereof

IC package keeping attachment level of leads on chip during molding process

Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same

Method of manufacturing a memory card

ELECTRONIC DEVICE

Film and chip packaging process using the same

PATTERN FILM, METHOD OF MANUFACTURING THE PATTERN FILM, AND PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE PATTERN FILM

Semiconductor package with embedded die

Integration using package stacking with multi-layer organic substrates

Multi stack package and method of fabricating the same

Bridge stack integrated circuit package system

Component arrangement comprising a carrier

Integrated circuit package system

Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner

Method for fabricating semiconductor package free of substrate

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR CHIP STACK PACKAGE WITH REINFORCING MEMBER FOR PREVENTING PACKAGE WARPAGE CONNECTED TO SUBSTRATE

Package structure and package substrate thereof

Semiconductor assembly with one metal layer after base metal removal

Semiconductor module including components in plastic casing

Stacked integrated circuit package-in-package system

Semiconductor device and manufacturing method of the same

Semiconductor chip, semiconductor device and methods for producing the same

Laminated bond of multilayer circuit board having embedded chips

Light source device and liquid crystal display device having the same

Resilient carrier assembly for an integrated circuit

Low fabrication cost, high performance, high reliability chip scale package

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR APPARATUS

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Method and apparatus of power ring positioning to minimize crosstalk

Structure of package on package and method for fabricating the same

Insertion-type semiconductor device and fabrication method thereof

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Die-up integrated circuit package with grounded stiffener

Semiconductor package and method of forming wire loop of semiconductor package

Semiconductor storage device, semiconductor device, and manufacturing method therefor

Chip package, method of making same and digital camera module using the package

Array quad flat no-lead package and method of forming same

Integrated circuit leadless package system

Chip packaging process

Sawn power package and method of fabricating same

Stacked die with a recess in a die BGA package

Ball grid array package and method thereof

Low profile ball grid array (BGA) package with exposed die and method of making same

Partial Solder Mask Defined Pad Design

Semiconductor package and fabrication process thereof

Three dimensional device integration method and integrated device