Integrated radio frequency module

Wafer stacking package method

Semiconductor device and a method of assembling a semiconductor device

Copper interconnect

Copper interconnect

Copper interconnect

Copper interconnect for semiconductor device

Method of fabricating a semiconductor die package having improved inductance characteristics

Integrated heatspreader for use in wire bonded ball grid array semiconductor packages

Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor

Apparatus for and method of packaging semiconductor devices

Chip carrier with oxidation protection layer

Multi-chip package structure

Integrated circuit package with open substrate

Methods for forming conductive bumps and wire loops

Module assembly and method for stacked BGA packages

Method of clearing electrical contact pads in thin film sealed OLED devices

Method of forming precision leads on a chip-supporting leadframe

Package having dummy package substrate and method of fabricating the same

Module assembly for stacked BGA packages

Substrate-based housing component with a semiconductor chip

Package having dummy package substrate and method of fabricating the same

Method of manufacturing a semiconductor device

Semiconductor device

Method of making circuitized substrate

Semiconductor chip packages and methods for fabricating the same

Method of manufacturing semiconductor device

Magnetic shielding for magnetic random access memory card

Surface-mounting semiconductor device and method of making the same

Semiconductor device having laminated structure

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Method for heat dissipation on semiconductor device

Structure and process of semiconductor package with an exposed heatsink

Electronic component package

Air pocket resistant semiconductor package

Stacked die packaging and fabrication method

Method of making a semiconductor device adapted to remove noise from a signal

Method of manufacturing printed wiring board

Method of making circuitized substrate

Etched interposer for integrated circuit devices

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Substrate for producing semiconductor packages

Methods and systems for attaching die in stacked-die packages

Stacked wafer scale package

QFN package and method therefor

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

High frequency module and manufacturing method thereof

Invertible microfeature device packages

Semiconductor element

Process and lead frame for making leadless semiconductor packages

Methods and apparatuses for providing stacked-die devices

Integrated circuit package including miniature antenna

Low profile, chip-scale package and method of fabrication

Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Ceramic package, assembled substrate, and manufacturing method therefor

Methods and apparatuses for providing stacked-die devices

Methods and systems for attaching die in stacked-die packages

Memory card with an adaptor

Process and lead frame for making leadless semiconductor packages

Wire bond with improved shear strength

Semiconductor device

Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components

Radio frequency power amplifier module

Semiconductor device with semiconductor components connected to one another

Film carrier tape for mounting of electronic part

Stacked chip package with exposed lead-frame bottom surface

Semiconductor device

Structure with spherical contact pins

Optical or electronic module and method for its production

Surface treatment for oxidation removal in integrated circuit package assemblies

Method of manufacturing circuit device

Stacked chip electronic package having laminate carrier and method of making same

Control unit and method for producing the same

Power amplifier arrangement and method for processing a radiofrequency signal

Interconnects with interlocks

Power semiconductor package having integral fluid cooling

Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance

Semiconductor chip-embedded substrate and method of manufacturing same

Interposer with flexible solder pad elements and methods of manufacturing the same

Chip-under-tape package structure and manufacture thereof

Semiconductor package with stacked chips and method for fabricating the same

LOC semiconductor assembled with room temperature adhesive

Solderable metal finish for integrated circuit package leads and method for forming

Chip structure with redistribution traces

Semiconductor package having a grid array of pin-attached balls

Method for manufacturing plastic ball grid array package with integral heatsink

Magnetic shield for integrated circuit packaging

High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus

Heterogeneous organic laminate stack ups for high frequency applications

Semiconductor package and method for its manufacture

Electronic module with layer of adhesive and process for producing it

Methods for processing integrated circuit packages formed using electroplating and apparatus made therefrom

Resin encapsulation molding method for semiconductor device

Method for fabricating a semiconductor component with contacts situated at the underside

Semiconductor chip resin encapsulation method

Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same

Method of packaging integrated circuits, and integrated circuit packages produced by the method

Electronic device with semiconductor chip including a radiofrequency power module

Heat dissipation device for integrated circuits

Semiconductor package and method for its manufacture

Semiconductor package

Semiconductor device

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

BGA package with concave shaped bonding pads

Molded package for micromechanical devices and method of fabrication

Semiconductor component having stacked, encapsulated dice and method of fabrication

Stacked semiconductor device and semiconductor memory module

Semiconductor device in which semiconductor chip is mounted on lead frame

Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices

Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

Stacked package electronic device

Method for fabricating semiconductor components using conductive layer and grooves

Housing for a semiconductor device and semiconductor device testing system for testing the contacting for semiconductor devices positioned one above the other

In-line wire bonding on a package, and method of assembling same

Circuit device and manufacturing method thereof

Package stress management

Chip-to-chip trench circuit structure

Direct connection multi-chip semiconductor element structure

Semiconductor chip package with thermoelectric cooler

Integrated circuit package including embedded thin-film battery

Package Structure

Taped lead frames and methods of making and using the same in semiconductor packaging

Component interconnect with substrate shielding

Modular board device, high frequency module, and method of manufacturing same

Heat sink formed of multiple metal layers on backside of integrated circuit die

Microelectronic devices and methods for forming interconnects in microelectronic devices

Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe

Method for fabricating semiconductor packages

Carrier for substrate film

Methods for designing carrier substrates with raised terminals

Leadframe for a multi-chip package and method for manufacturing the same

Leadframe with a chip pad for two-sided stacking and method for manufacturing the same

Arrangement for increasing the reliability of substrate-based BGA packages

Bottom heat spreader

Semiconductor package with exposed heat sink and the heat sink thereof

Method and system for expanding flash storage device capacity

Substrate-based die package with BGA or BGA-like components

Microelectronic packages and methods therefor

Method of embedding semiconductor element in carrier and embedded structure thereof

Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same

Ultra thin dual chip image sensor package structure and method for fabrication

Components with posts and pads

Method for encapsulating multiple integrated circuits

Heat spreader in integrated circuit package

Prefabricated semiconductor chip carrier

Apparatus for molding a semiconductor die package with enhanced thermal conductivity

Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

Ground plane for integrated circuit package

Memory card with a cap having indented portions

Semiconductor device and manufacturing method therefor

Semiconductor package having integrated metal parts for thermal enhancement

Semiconductor device

Compliant spring contact structures

Field weldable connections

Optoelectronic apparatus with a shielding cage, and methods for production of an optoelectronic apparatus with a shielding cage.

Chip scale package with open substrate

Encapsulation for particle entrapment

Semiconductor device and semiconductor apparatus

Internal package heat dissipator

Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly

Vertical conduction power electronic device package and corresponding assembling method

Embedded chip semiconductor having dual electronic connection faces

Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Microelectronic imagers and methods of packaging microelectronic imagers

Nitride semiconductor device

Methods of making microelectronic packages

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

Method of making photolithographically-patterned out-of-plane coil structures

Electrical contact

Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same

Ball grid array housing having a cooling foil

Conductor device and method of manufacturing thereof

System-in-package (SIP) structure and fabrication thereof

Package for sealing an integrated circuit die

Internal package heat dissipator

Semiconductor device

Corrosion resistance enhancement of tin surfaces

Manufacturing method of semiconductor device

Module with multiple power amplifiers and power sensors

Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units

Wiring substrate and method of fabricating the same

Semiconductor integrated circuit device and method for fabricating the same

Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier

Integrated circuit package with optimized mold shape

Cold weld hermetic MEMS package and method of manufacture

Interposer substrate, semiconductor package and semiconductor device, and their producing methods

Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment

Layout structure for providing stable power source to a main bridge chip substrate and a motherboard

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection

Package with barrier wall and method for manufacturing the same

Method and system for applying an adhesive substance on an electronic device

Semiconductor device and interposer

Semiconductor molding method and structure

Circuit board and semiconductor device using the same

Semiconductor device

Semiconductor device, method for mounting the same, and method for repairing the same

Packaged integrated circuit with MLP leadframe and method of making same

Semiconductor device and manufacturing method therefor

Packaging of a microchip device

Chemical-enhanced package singulation process

Method of attaching a leadframe to singulated semiconductor dice

Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device

Integrated passive devices

Mold gates and tape substrates including the mold gates

Semiconductor device and manufacturing method therefor

Semiconductor device structure with adhesion-enhanced semiconductor die

Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assembly

Systems for degating packaged semiconductor devices with tape substrates

Resin-molded package with cavity structure

Semiconductor micro device

Microelectronic assembly having a perimeter around a MEMS device

Semiconductor (LED) chip attachment

Low-profile capillary for wire bonding

Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape

Wiring board and semiconductor package using the same

Method and apparatus for decoupling conductive portions of a microelectronic device package

Electronic device with high lead density

CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE

High data rate chip mounting

Optical surface mount technology package

Surface mount multichip devices

Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents

Methods of forming conductive through-wafer vias

Sealing and protecting integrated circuit bonding pads

Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same

Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging

High voltage power device with low diffusion pipe resistance

Method for producing a BGA chip module and BGA chip module

Method for manufacturing an adhesive substrate with a die-cavity sidewall

Semiconductor package for a large die

Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same

Semiconductor device, semiconductor circuit and method for producing semiconductor device

Laminate ceramic circuit board and process therefor

Method of manufacturing multi-stack package

Semiconductor package having multiple row of leads

Semiconductor device

CARRIER, CHIP PACKAGE STRUCTURE, AND CIRCUIT BOARD PACKAGE STRUCTURE

Semiconductor device and printed circuit board

Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module

Manufacturing method for semiconductor device, semiconductor device and semiconductor chip

Leadframe packaging structure and the method of manufacturing the same

Semiconductor device with stacked semiconductor chips of the same type

CHIP PACKAGING STRUCTURE

Semiconductor integrated circuit

Heat curable adhesive composition, article, semiconductor apparatus and method

Wafer level mounting frame for ball grid array packaging, and method of making and using the same

Semiconductor package with heat dissipating structure and method of manufacturing the same

Chip package structure and chip packaging process

Thermal dissipation in integrated circuit systems

CHIP PACKAGE STRUCTURE

Thermally enhanced component interposer: finger and net structures

System for reducing or eliminating semiconductor device wire sweep

Chip fixed structure

Circuit support for a semiconductor chip and component

Semiconductor device assemblies and packages including multiple semiconductor device components

Split-gate power module for suppressing oscillation therein

Method for manufacturing leadless semiconductor packages

Through electrode, spacer provided with the through electrode, and method of manufacturing the same

Microelectronic assembly having encapsulated wire bonding leads

Semiconductor device of a charge storage type

Method and semiconductor device having copper interconnect for bonding

Device mounting board and semiconductor apparatus using device mounting board

Circuit board for connecting an integrated circuit to a support and IC BGA package using same

Low fabrication cost, high performance, high reliability chip scale package

Circuit device and manufacturing method thereof

Land grid array packaged device and method of forming same

Lower profile flexible substrate package for electronic components

Semiconductor device

Semiconductor device package having a semiconductor element with resin

Multichip semiconductor package

Copper interconnect

Circuit device

Semiconductor chip package

Multilayer integrated circuit for RF communication and method for assembly thereof

Surface-mountable semiconductor component and method for producing it

Charge device model (CDM) electrostatic discharge (ESD) failure rate via capacitive coating

Integrated circuit module package and assembly method thereof

Solid state imaging device having electromagnetic wave absorber attached to a mounting board

Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module

Method for fabricating window ball grid array semiconductor package

Electronic component housing package and electronic apparatus

Module with integrated active substrate and passive substrate

Board-on-chip packages

Package with stacked substrates

Method of fabricating a wire bond with multiple stitch bonds

Thin-film semiconductor device and method of manufacturing the same

Semiconductor package having heat spreader and package stack using the same

Leadframe with die pad

Wire bonding apparatus having actuated flame-off wand

Transmitting optical subassembly capable of monitoring the front beam of the semiconductor laser diode

High frequency module board device

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Semiconductor device having a multi-chip stacked structure and reduced thickness

Bonding pad structure, display panel and bonding pad array structure using the same and manufacturing method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof