Electronic device

Semiconductor device with self-aligning contactless interface

Production method of a multilayer ceramic substrate

Coolant cooled type semiconductor device

BGA semiconductor chip package and mounting structure thereof

Semiconductor package accomplishing fan-out structure through wire bonding

Thermally enhanced semiconductor package and fabrication method thereof

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Chip-embedded support-frame board wrapped by folded flexible circuit for multiplying packing density

Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating

Chip package

Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package

Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement

Method of manufacturing flexible circuit substrate

Molding method for foldover package

Multi-chip package and method for manufacturing the same

Method of mounting an integrated circuit package in an encapsulant cavity

ELECTRONIC DEVICE PACKAGE

Circuit device and manufacturing method thereof

Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides

Stacked-type semiconductor device and method of manufacturing the same

Memory card with connecting portions for connection to an adapter

Memory card with connecting portions for connection to an adapter

Semiconductor device and method of manufacturing the same, metal component and method of manufacturing the same

Electronic package with a stepped-pitch leadframe

CURRENT SENSOR

Package structure and fabrication thereof

Stacked die-in-die BGA package with die having a recess

Microelectronics devices, having vias, and packaged microelectronic devices having vias

Integrated circuit carrier

Semiconductor device having a functional surface

Semiconductor device including an arrangement for detection of tampering

Semiconductor device and manufacturing method thereof

Device and applications for passive RF components in leadframes

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Semiconductor device

Electronic assembly with integral thermal transient suppression

Three-dimensional package

Semiconductor device package

Semiconductor chip and semiconductor device including the same

Miniature optical element for wireless bonding in an electronic instrument

Method for manufacturing a semiconductor package with a laminated chip cavity

Solder masks used in encapsulation, assemblies including the solar mask, and methods

Current regulator having a transistor and a measuring resistor

Chip package and fabricating method thereof

Impedance matching external component connections with uncompensated leads

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures

High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package

Semiconductor device

Low profile small outline leadless semiconductor device package

Electrical device allowing for increased device densities

Microelectronic devices and methods for forming interconnects in microelectronic devices

Semiconductor integrated circuit and semiconductor device

Ultra thin dual chip image sensor package structure and method for fabrication

Carrier for substrate film

Semiconductor device having a plastic housing and external connections and method for producing the same

HEAT SINK AND PACKAGE STRUCTURE

HIP PACKAGE STRUCTURE

Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded

Integrated circuit package system with die and package combination

Semiconductor package with passive device integration

Methods for assembling semiconductor devices and interposers

Carrier for substrate film

MULTI-CHIP BALL GRID ARRAY PACKAGE

Package for high frequency usages and its manufacturing method

Ultra thin dual chip image sensor package structure and method for fabrication

Chip stack employing a flex circuit

Integrated circuit and wireless IC tag

Semiconductor package having double layer leadframe

Integrated circuit package and method of manufacture thereof

Method of making reinforced semiconductor package

Low cost method to produce high volume lead frames

Microfeature systems including adhered microfeature workpieces and support members

Integrated circuit package-in-package system

Semiconductor device

Semiconductor device with semiconductor chip mounted in package

Semiconductor device and manufacturing process therefor

Component arrangement for series terminal for high-voltage applications

Method for producing an FBGA component and substrate for carrying out the method

Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices

Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures

Semiconductor device and process for fabrication thereof

Semiconductor storage device, semiconductor device, and manufacturing method therefor

IC chip coating material and vacuum fluorescent display device using same

Perimeter matrix ball grid array circuit package with a populated center

Methods of adhering microfeature workpieces, including a chip, to a support member

Minimized wire bonds in transient blocking unit packaging

Semiconductor apparatus

Molded package and semiconductor device using molded package

Ball grid array package

Interposers with flexible solder pad elements

Nested integrated circuit package on package system

Integrated circuit package system using interposer

Semiconductor device with gold coatings, and process for producing it

Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods

Multi-leadframe semiconductor package and method of manufacture

Smart card, smart card module, and a method for production of a smart card module

Fabrication of stacked microelectronic devices

Semiconductor device and a method of manufacturing the same

Method of embedding semiconductor element in carrier and embedded structure thereof

Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages

Semiconductor module

Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages

Method and apparatus for packaging an electronic chip

Semiconductor device

Printed wiring board having a solder pad and a method for manufacturing the same

Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the same

Thermal enhanced package for block mold assembly

Electronic component for radio frequency applications and method for producing the same

Light emitting device

Integrated circuit package encapsulating a hermetically sealed device

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor package with crossing conductor assembly and method of manufacture

Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

Method and apparatus for forming a low profile wire loop

Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces

Method for designing integrated circuit package and method for manufacturing same

VSAT block up converter (BUC) chip

Method in the fabrication of a memory device

Fabrication of stacked microelectronic devices

Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor

Semiconductor device including multiple rows of peripheral circuit units

Structure for joining a semiconductor package to a substrate using a solder column

Multimedia card and transfer molding method

Semiconductor device and method of fabricating same

Low profile ball-grid array package for high power

Semiconductor package using flexible film and method of manufacturing the same

Cooling structure of solid state and formation thereof with integrated package

Integrated packaged having magnetic components

Semiconductor device

Electronic component and leadframe for producing the component

Semiconductor device having a particular electrode structure

Method for making a semiconductor multipackage module including a processor and memory package assemblies

Lead frame routed chip pads for semiconductor packages

Support device for monolithically integrated circuits

Method of manufacturing a cavity package

Semiconductor device having signal line and reference potential planes separated by a vertical gap

Semiconductor device package and manufacturing method thereof

BGA package substrate and method of fabricating same

Semiconductor package having passive component disposed between semiconductor device and substrate

Multi-chip package mounted memory card

Leadframe designs for plastic cavity transistor packages

Semiconductor package having enhanced heat dissipation and method of fabricating the same

On-chip circuit pad structure

Semiconductor device

Arrangement for energy conditioning

Semiconductor device and fabrication method thereof

Copper interconnect

Semiconductor device for high frequency power amplification

Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module

High power light emitting diode device

Multi-chip package structure

Stack chip package

Microelectronic packages using a ceramic substrate having a window and a conductive surface region

Accessible electronic storage apparatus

Semiconductor package and lead frame therefor

Wafer structure, chip structure, and fabricating process thereof

Packaged semiconductor die and manufacturing method thereof

Leadframe and packaged light emitting diode

Carrier with metal bumps for semiconductor die packages

Semiconductor chip having coolant path, semiconductor package and package cooling system using the same

Multi lead frame power package

Ball grid array substrate having window and method of fabricating same

Semiconductor device with a substrate having a spiral shaped coil

Multi-chip package structure

Multi-chip package structure

Packaged electronic devices, and method for making same

Semiconductor device package with reduced leakage

PCB, manufacturing method thereof and semiconductor package implementing the same

Memory package

Semiconductor device package

Compact system module with built-in thermoelectric cooling

Multi-chip module

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Thermally enhanced package for an integrated circuit

Heat dissipating semiconductor package and fabrication method thereof

Semiconductor package, manufacturing method thereof and IC chip

Methods for fabricating stiffeners for flexible substrates

Carrier-free semiconductor package and fabrication method thereof

Thermal management of surface-mount circuit devices

Liquid metal thermal interface material system

Coolant cooled type semiconductor device

Method and system for wavelength specific thermal irradiation and treatment

Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging

Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method

Semiconductor package, memory card including the same, and mold for fabricating the memory card

Sharp corner lead frame

Memory cards and method of fabricating the memory cards

Methods for assembling a stack package for high density integrated circuits

Semiconductor component having plate and stacked dice

Multi-chip module

Semiconductor device and manufacturing method of semiconductor device

Heat stud for stacked chip package

Chip package mechanism

Semiconductor device with improved heat dissipation

connection arrangement for micro lead frame plastic packages

Microelectronic assemblies incorporating inductors

Simplified multichip packaging and package design

Integrated circuit including silicon wafer with annealed glass paste

Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same

Semiconductor device, and method for manufacturing the same

Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same

Method for two-stage transfer molding device to encapsulate MMC module

Multilayered circuit substrate, semiconductor device and method of producing same

Thermal management of surface-mount circuit devices on laminate ceramic substrate

Semiconductor device, method and apparatus for fabricating the same

Semiconductor component package

Multi-chip package using an interposer

Package structure of memory card and packaging method for the structure

Encapsulated electronic device structure

Leadframe designs for integrated circuit plastic packages

ESD protection apparatus for an electrical device

Electronic device and method of manufacturing the same

Techniques for microchannel cooling

Electronic device with high lead density

System-in-package type semiconductor device

BGA package having substrate with exhaust hole

Semiconductor package system with substrate heat sink

Integrated circuit package system with heat slug

Carrier for substrate film

Integrated circuit package system with leadframe substrate

Micro lead frame packages and methods of manufacturing the same

Fabricating surface mountable semiconductor components with leadframe strips

Substrate for electrical device and methods for making the same

Multi-chip package

Methods for designing and tuning one or more packaged integrated circuits

Method for fabricating semiconductor components

Methods of manufacturing interposers with flexible solder pad elements

Semiconductor device and method for fabricating the same

Electronic component comprising external surface contacts and a method for producing the same

Circuitized substrate with trace embedded inside ground layer

Land grid array module

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Cavity-down thermally enhanced package

Plastic package and semiconductor component comprising such a plastic package, and method for its production

Multiple die stack apparatus employing t-shaped interposer elements

Multiple die stack apparatus employing T-shaped interposer elements

Stacked semiconductor multi-chip package

Flexible leaded stacked semiconductor package

Power distribution within a folded flex package method and apparatus

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

Low cost power MOSFET with current monitoring

Chip package, chip packaging, chip carrier and process thereof

Multilayer semiconductor device

Thermally enhanced molded package for semiconductors

Cavity-down multiple-chip package

Circuit carrier and production thereof

Plating method, semiconductor device fabrication method and circuit board fabrication method

Method for fabricating quad flat non-leaded package

Semiconductor device having aluminum electrode and metallic electrode

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Integrated circuit package employing a heat-spreader member

Heat dissipating package structure and method for fabricating the same

Memory card module with an inlay design

Semiconductor HBT MMIC device and semiconductor module

Flexible circuit board processing method

Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices

Folded substrate with interposer package for integrated circuit devices

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

Semiconductor component with plastic housing, and process for producing the same

Semiconductor package structure with microstrip antennan

Integrated circuit package employing a flexible substrate

Electronic device and method for fabricating the same

Semiconductor device

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Power semiconductor module

Mold compound interlocking feature to improve semiconductor package strength

Copper interconnect

Methods for manufacturing semiconductor device, semiconductor device and metal mold

Semiconducting device that includes wirebonds

Surface-mounted microwave package and corresponding mounting with a multilayer circuit

Lead frame and semiconductor package therefor

Active device bases, leadframes utilizing the same, and leadframe fabrication methods

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Semiconductor device having power semiconductor elements

Nano-sized metals and alloys, and methods of assembling packages containing same

Radio frequency module and manufacturing method thereof

Thermally conductive composite and uses for microelectronic packaging

Package stress management

Method for manufacturing wafer level chip scale package structure

Die down ball grid array package

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

Electronic device

Wire feed system for a wire bonding apparatus

Semiconductor device and method for manufacturing the same

Method for producing a packaged integrated circuit

Stacked die module and techniques for forming a stacked die module

Semiconductor device

Production methods for a leadframe and electronic devices

Electronic package having a folded package substrate

Semiconductor package, and fabrication method and carrier thereof

Assembly for stacked BGA packages

Semiconductor device package

Optical semiconductor device, optical communication device, and electronic equipment