METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME

Integrated voltage regulator with embedded passive device(s) for a stacked IC

Electronic device comprising a nanotube-based interface connection layer, and manufacturing method thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect

Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof

Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME

Semiconductor device with lead terminals having portions thereof extending obliquely

Semiconductor device attached to island having protrusion

Integrated circuit package system with package stand-off and method of manufacture thereof

SEMICONDUCTOR PACKAGE HAVING DE-COUPLING CAPACITOR

Boost converter with integrated high power discrete FET and low voltage controller

Wafer scale package for high power devices

Package for a light emitting element

SEMICONDUCTOR MEMORY CARD AND METHOD OF MANUFACTURING THE SAME

Subscriber identity module (SIM) card

Semiconductor device and snubber device having a SiC-MOSFET and a Zener diode

Power semiconductor device and power conversion device

Cut-edge positioning type soldering structure and method for preventing pin deviation

Integrated circuit packaging system with leadframe and method of manufacture thereof

Semiconductor package having gap-filler injection-friendly structure

Pop precursor with interposer for top package bond pad pitch compensation

Semiconductor package and method for making the same

Packaged semiconductor device having improved locking properties

Electrode pad having a recessed portion

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Method of manufacturing an electronic device with a package locking system

Tungsten stiffener for flexible substrate assembly

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Power semiconductor device

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Light emitting device and lighting system having the same

Method for testing a contact structure

Method of manufacturing cooling fin and package substrate with cooling fin

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

Device for removing electromagnetic interference and semiconductor package including the same

Chip package structure

STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS

Semiconductor integrated circuit device and method of manufacturing the same

STACKED CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD

Package on package having improved thermal characteristics

NO LEAD PACKAGE WITH HEAT SPREADER

Semiconductor package

Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate

Semiconductor arrangement with a solder resist layer

Light emitting device and lighting system

Method of manufacturing a substrate strip with wiring

Component having a through-contact

Semiconductor Package

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Multi-chip package with pillar connection

CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD

Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof

Apparatus for thermally enhanced semiconductor package

Integrated circuit package system with package stacking and method of manufacture thereof

Semiconductor component and method of manufacture

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Shielded stacked integrated circuit packaging system and method of manufacture thereof

Integrated circuit packaging system with magnetic film and method of manufacture thereof

Semiconductor package with a conductive shielding member

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Light-emitting device, light emitting system including the same, and fabricating method thereof

Manufacturing method of semiconductor device

Semiconductor package and method of forming the same

Method of using white resin in an electronic device

Light-emitting device, light-emitting system including the same, and fabricating method thereof

Integrated battery and IC

Electronic device and method for connecting a die to a connection terminal

Integrated circuit package system with embedded die superstructure and method of manufacture thereof

Integrated circuit packaging system with multiple row leads and method of manufacture thereof

Semiconductor device with substrate-side exposed device-side electrode and method of fabrication

Semiconductor module with electrical switching elements

Detector module

LIGHT EMITTING DIODE PACKAGE

METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE

Method of fabricating wiring board and method of fabricating semiconductor device

Integrated circuit packaging system with dual side connection and method of manufacture thereof

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

Leadless integrated circuit packaging system and method of manufacture thereof

Semiconductor apparatus and power supply circuit

Electronic device incorporating the white resin

Integrated circuit package system with laminate base

Near chip scale semiconductor packages

THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Semiconductor Package

Stacking integrated circuits containing serializer and deserializer blocks using through silicon via

Chip packaging

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

Chip package and method for forming the same

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material

Leadless package for high current devices

Direct contact leadless package

LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Three-dimensional package structure

Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device

Light emitting device package and method for manufacturing the same

LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Ventilating apparatus

Ventilating apparatus

Semiconductor package having an antenna with reduced area and method for fabricating the same

Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via

Semiconductor package having ink-jet type dam and method of manufacturing the same

IC Chip Coating Material and Vacuum Fluorescent Display Device Using Same

Stacked semiconductor package and method for manufacturing the same

Semiconductor device and method for fabricating semiconductor device

Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint

Integrated circuit packaging system having a cavity

Semiconductor package, semiconductor device, and semiconductor module

Chip unit and stack package having the same

Nano-structured gasket for cold weld hermetic MEMS package and method of manufacture

Lead frame, semiconductor apparatus using this lead frame, intermediate product thereof and manufacturing method thereof

Die backside standoff structures for semiconductor devices

Lead Frame and Method of Producing Lead Frame

SUBSTRATE FOR AN ELECTRICAL DEVICE

Microelectronic packages and methods therefor

Stackable layer containing ball grid array package

Electronic component device and method for producing the same

NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device packages including a semiconductor device and a redistribution element

Stackable power MOSFET, power MOSFET stack, and process of manufacture

Laser etch via formation

INTEGRATED CIRCUIT PACKAGE STRUCTURE AND METHOD

SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Lead frame based semiconductor package and a method of manufacturing the same

LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device

Light Emitting Diode Package Structure and Manufacturing Method Therefor

INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER

LIGHT EMITTING DEVICES

Die package

CIRCUIT BOARD STRUCTURE, PACKAGING STRUCTURE AND METHOD FOR MAKING THE SAME

Electronic device package and method of manufacture

Semiconductor on semiconductor substrate multi-chip-scale package

Method of making a connection component with posts and pads

Integrated circuit package system with contoured encapsulation and method for manufacturing thereof

Quad flat non-leaded semiconductor package and fabrication method thereof

Circuit board structure and package structure

Lead frame package structure for side-by-side disposed chips

Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height

Semiconductor device packages with electromagnetic interference shielding

Semiconductor package structure and package process

LIGHT-EMITTING DIODE PACKAGE USING A LIQUID CRYSTAL POLYMER

Device for protecting an electronic integrated circuit housing against physical or chemical ingression

Method for manufacturing integrated circuit package system with under paddle leadfingers

Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof

Chip embedded substrate and method of producing the same

Rigid power module suited for high-voltage applications

Package-on-package system with through vias and method of manufacture thereof

Stack package having flexible conductors

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor device and method of wafer level package integration

Wafer level die integration and method therefor

Semiconductor device having multiple semiconductor elements

Ultra high speed signal transmission/reception

STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS

Light source unit and backlight assembly having the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate

Method for manufacture of inline integrated circuit system

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

Light emitting device, light emitting system having the same, and fabricating method of the light emitting device and the light emitting system

OPTO-ELECTRONIC TRANSCEIVER MODULE SYSTEM

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Semiconductor device

Embedded semiconductive chips in reconstituted wafers, and systems containing same

System in package with heat sink

Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep and Manufacturing Methods Thereof

Semiconductor package

Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device

LEAD FRAME WITH RECESSED DIE BOND AREA

Integrated circuit devices having selectively strengthened composite interlayer insulation layers and methods of fabricating the same

Semiconductor device and communication method

Semiconductor device and method of forming high-attenuation balanced band-pass filter

Heat dissipation by through silicon plugs

Semiconductor package with through silicon vias

LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE THEREOF

Semiconductor device, method for manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and method for evaluating semiconductor device

Method for manufacturing wafer scale heat slug system

Chipstack package and manufacturing method thereof

SEMICONDUCTOR CHIP USED FOR EVALUATION, EVALUATION SYSTEM, AND REPAIRING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor packages having warpage compensation

Semiconductor device

Dual-leadframe multi-chip package and method of manufacture

Integrated circuit protruding pad package system and method for manufacturing thereof

Integrated circuit packaging system with leadframe and method of manufacture thereof

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors

Method for fabrication of a semiconductor device and structure

Method for fabrication of a semiconductor device and structure

Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same

Molded power-supply module with bridge inductor over other components

System-in-package using embedded-die coreless substrates, and processes of forming same

Enhanced WLP for superior temp cycling, drop test and high current applications

Integrated circuit package system with package stacking and method of manufacture thereof

Stacked dual chip package and method of fabrication

Integrated circuit packaging system with lead frame and method of manufacture thereof

Light emitting diode and method of fabricating the same

Semiconductor chip assembly with post/base heat spreader with thermal via

Distributed semiconductor device methods, apparatus, and systems

Board on chip package

Layered chip package with wiring on the side surfaces

Process for fabricating electronic components using liquid injection molding

Lead frame for semiconductor device and method of manufacturing of the same

Package having spaced apart heat sink

Multilayered board semiconductor device with BGA package

Semiconductor packaging and fabrication method using connecting plate for internal connection

Light emitting device and light emitting device package

Enhanced integrated circuit package

METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS

Semiconductor package and semiconductor device

Stacked semiconductor package having discrete components

Semiconductor device and optical pickup device

Semiconductor device with copper wirebond sites and methods of making same

CURRENT SENSOR FOR A SEMICONDUCTOR DEVICE AND SYSTEM

Semiconductor die having a redistribution layer

Thermal vias in an integrated circuit package with an embedded die

Integrated circuit packaging system with encapsulation connector and method of manufacture thereof

Semiconductor device and method of manufacturing a semiconductor device

Microwave circuit package

Semiconductor device having IPD structure with smooth conductive layer and bottom-side conductive layer

Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip

Semiconductor memory device with plural memory die and controller die

Current sensors and methods

PACKAGE DEVICE AND FABRICATION METHOD THEREOF

Wirebondless wafer level package with plated bumps and interconnects

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

Power device packages having thermal electric modules using peltier effect and methods of fabricating the same

Semiconductor device assemblies

LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH

Integrated circuit packaging system with shield and method of manufacture thereof

Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame

Micro-optical device packaging system

LED ARRAY GRID, METHOD AND DEVICE FOR MANUFACTURING SAID GRID AND LED COMPONENT FOR USE IN THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Integrated circuit packaging system and method of manufacture thereof

LED package and a backlight unit unit comprising said LED package

Method for manufacturing optical device, optical device, and biological information detector

Semiconductor device

METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE

Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method

Land grid array package capable of decreasing a height difference between a land and a solder resist

Integrated circuit package with enlarged die paddle

Method for manufacturing semiconductor device

Light-emitting element with improved light extraction efficiency, light-emitting device including the same, and methods of fabricating light-emitting element and light-emitting device

Light emitting device and method of manufacturing the same

Rule-based semiconductor die stacking and bonding within a multi-die package

Embedded component substrate and manufacturing methods thereof

Unique Package Structure

Method for making semiconductor package

Systems and Methods Providing Arrangements of Vias

Semiconductor device packages having stacking functionality and including interposer

SEMICONDUCTOR DEVICE

Stacked-die electronics package with planar and three-dimensional inductor elements

Light emitting device and light emitting device package

Semiconductor device

Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device

Edge connect wafer level stacking

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

Integrated circuit packaging system having dual sided connection and method of manufacture thereof

Recessed semiconductor substrates and associated techniques

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

Semiconductor package structure

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device

Array-molded package-on-package having redistribution lines

PACKAGE FOR SYNCHRONOUS RECTIFIER MODULE

High frequency semiconductor device

Interconnection structure

Stacked package of semiconductor device

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

Multi-chip package having frame interposer

Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof

Method of stacking flip-chip on wire-bonded chip

SEMICONDUCTOR DEVICE

NON-DIRECT BOND COPPER ISOLATED LATERAL WIDE BAND GAP SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT PACKAGE, METHOD FOR PRODUCING THE SAME AND INTERPOSER

Fabrication method of package structure having MEMS element

Signal transmission arrangement

Stacked semiconductor package

Chip module

Bonded structure and manufacturing method for bonded structure

SEMICONDUCTOR PACKAGE

PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE

Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material

Package structure having MEMS element

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Arrangement for energy conditioning