Integrated circuit package system with concave terminal

DICING DIE-BONDING FILM

Microelectronic packages with small footprints and associated methods of manufacturing

Integrated circuit package stacking system

Fan-in interposer on lead frame for an integrated circuit package on package system

RDL patterning with package on package system

Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame

METHOD OF FORMING ON-CHIP PASSIVE ELEMENT

RF shielding arrangement for semiconductor packages

Semiconductor device and method for manufacturing the same

Semiconductor module and a method for producing an electronic circuit

BALL GRID ARRAY PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

Integrated circuit package system with leadframe substrate

Semiconductor chip package, stacked package comprising semiconductor chips and methods of fabricating chip and stacked packages

Method of forming a molded array package device having an exposed tab and structure

DICING/DIE BONDING FILM

Semiconductor system-in-package and method for making the same

Multi lead frame power package

Integrated circuit package with etched leadframe for package-on-package interconnects

Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device

IC HAVING FLIP CHIP PASSIVE ELEMENT AND DESIGN STRUCTURE

Semiconductor device and semiconductor package including the same

Holding jig for electronic parts

Pop semiconductor device manufacturing method

METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH THIN METAL CONTACTS

Light emitting device and backlight unit including the same

Semiconductor module and method

Printed circuit board for accomplishing narrow scribe lane and semiconductor package including the printed circuit board

Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via

High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies

Stress Mitigation in Packaged Microchips

Stackable molded packages and methods of making the same

Semiconductor device packages with electromagnetic interference shielding

Semiconductor device

Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device

INTEGRATED CIRCUIT DEVICE WITH IMPROVED UNDERFILL COVERAGE

Multi-layer semiconductor package with vertical connectors and method of manufacture thereof

Semiconductor package structure and method for manufacturing the same

Embedded semiconductor die package and method of making the same using metal frame carrier

Integrated circuit package system with chip on lead

Packaging integrated circuits for high stress environments

INTEGRATED CIRCUIT PACKAGE WITH EMI SHIELD

Sensor for examining a value document, and method for the production of said sensor

Optical signaling for a package-on-package stack

Package substrate structure

Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production

Semiconductor device

SOLDER CONTACT

SYSTEM IN PACKAGE MODULE

PACKAGE STRUCTURE FOR RADIO FREQUENCY MODULE AND MANUFACTURING METHOD THEREOF

Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation

Manufacturing method for integrating a shunt resistor into a semiconductor package

Integrated circuit package, notably for image sensor, and method of positioning

Circuit substrate and method of fabricating the same and chip package structure

Lead-embedded metallized ceramics substrate and package

Printed circuit board assembly

Laser optical path detection in integrated circuit packaging

Non-destructive laser optical integrated circuit package marking

Transistor and routing layout for a radio frequency integrated CMOS power amplifier device

Semiconductor device and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Stacked integrated circuit package system

Integrated circuit package system stackable devices

Integrated circuit package system with conformal shielding and method of manufacture thereof

Method and apparatus of power ring positioning to minimize crosstalk

SYSTEM WITH RADIO FREQUENCY INTEGRATED CIRCUITS

Optical semiconductor device and method for manufacturing the same

Fabrication of compact opto-electronic component packages

Arrangement for energy conditioning

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Semiconductor package with heat sink, stack package using the same and manufacturing method thereof

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Semiconductor device

Wiring board, semiconductor device using wiring board and their manufacturing methods

Pin substrate and package

Semiconductor device

Stacked semiconductor devices and a method for fabricating the same

Semiconductor Die Packages with Stacked Flexible Modules Having Passive Components, Systems Using the Same, and Methods of Making the Same

Die attach method and leadframe structure

PACKAGED INTEGRATED CIRCUIT HAVING CONFORMAL ELECTROMAGNETIC SHIELDS AND METHODS TO FORM THE SAME

Light emitting elements, light emitting devices including light emitting elements and methods of manufacturing such light emitting elements and/or devices

ELECTRONIC COMPONENT

Circuit apparatus and method of manufacturing the same

Systems and methods for power amplifier with integrated passive device

Light emitting elements, light emitting devices including light emitting elements and methods for manufacturing such light emitting elements and/or devices

Semiconductor device and method of manufacturing the same

Semiconductor device having copper interconnect for bonding

Semiconductor module and method for fabricating semiconductor module

Method of forming stress relief layer between die and interconnect structure

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit package system with die and package combination

Semiconductor chip package and multichip package

Ball grid array package stacking system

Package substrate having embedded semiconductor chip and fabrication method thereof

LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit package system with internal stacking module

Method of manufacturing semiconductor package with etch removal of carrier frame and base plating layer

Laminate substrate and semiconductor package utilizing the substrate

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor device and method of forming recessed conductive vias in saw streets

Mountable integrated circuit package-in-package system

Semiconductor device having function circuits selectively connected to bonding wire

Method and apparatus for thermally enhanced semiconductor package

Resin sealed semiconductor device and manufacturing method therefor

Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package

Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference

Semiconductor device and method of connecting a shielding layer to ground through conductive vias

Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor

Semiconductor device and method of shielding semiconductor die from inter-device interference

Electrically conducting connection with insulating connection medium

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Method and system for composite bond wires

Light emitting apparatus, optical scanning apparatus, and image forming apparatus

CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS

Package for a Die

Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof

CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF

Stacked structure of integrated circuits having space elements

Package-on-package system with heat spreader

TWO-WAY HEAT EXTRACTION FROM PACKAGED SEMICONDUCTOR CHIPS

Four mosfet full bridge module

Semiconductor package system with cut multiple lead pads

Leadframe having delamination resistant die pad

Methods of making an electronic component package and semiconductor chip packages

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device and method of forming double-sided through vias in saw streets

CARD TYPE MEMORY PACKAGE

Circuit board process

Method of manufacturing a semiconductor device and molding die

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor device and a semiconductor device manufacturing method

Wirebondless wafer level package with plated bumps and interconnects

HERMETIC SEALING OF MICRO DEVICES

Structure and manufacturing method of chip scale package

Semiconductor package having an antenna on the molding compound thereof

Semiconductor package and method for manufacturing the same

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Silver-coated ball and method for manufacturing same

Method for manufacturing printed wiring board

Integrated circuit package having integrated faraday shield

SEMICONDUCTOR PACKAGE, MOUNTING CIRCUIT BOARD, AND MOUNTING STRUCTURE

Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry

Semiconductor package featuring flip-chip die sandwiched between metal layers

Semiconductor chip package structure

Semiconductor device

Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device

Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package

INTEGRATED CIRCUIT PACKAGE SYSTEM

OPTICAL SEMICONDUCTOR DEVICE

Semiconductor Device and a Method of Manufacturing the Same

Semiconductor device and method

Lead-on-chip semiconductor package and leadframe for the package

Semiconductor device and method of conforming conductive vias between insulating layers in saw streets

Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material

Module

Multi-chip package including component supporting die overhang and system including same

Semiconductor package having stepwise depression in substrate

Semi-finished package and method for making a package

Semiconductor device and method of fabrication

Bonding pad sharing method applied to multi-chip module and apparatus thereof

IC device having low resistance TSV comprising ground connection

STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame

Light emitting device

Substrate for mounting electronic component and electronic apparatus including the substrate

Method for performing a shelf lifetime acceleration test

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Enhanced architectural interconnect options enabled with flipped die on a multi-chip package

Integrated circuit package on package system

CHIP PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same

Through-hole via on saw streets

Low voltage drop and high thermal performance ball grid array package

SEMICONDUCTOR DEVICE

3-D stacking of active devices over passive devices

ULTRA-THIN CHIP PACKAGING

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR PACKAGE

Circuit board and manufacturing method thereof

Hidden plating traces

Insulating liquid die-bonding agent and semiconductor device

Thinned image sensor with trench-insulated contact terminals

Semiconductor package with mechanical stress isolation of semiconductor die subassembly

Semiconductor device and method of forming vertical interconnect structure using stud bumps

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

Chip mounting device and chip package array

Wafer level integration package

MICRO-ELECTROMECHANICAL SYSTEM

Inline integrated circuit system

Semiconductor device fabrication method

Integrated circuit package-on-package system with central bond wires

Apparatus and method for a chip assembly including a frequency extending device

Semiconductor device packages with electromagnetic interference shielding

Semiconductor light-emitting device

Microwave Cure of Semiconductor Devices

METHOD FOR MANUFACTURING STACK CHIP PACKAGE STRUCTURE

Multi-chip stack package

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor package using an active type heat-spreading element

Multilayer wiring substrate, semiconductor package, and method of manufacturing semiconductor package

Semiconductor device

Semiconductor device and manufacturing method therefor

Leadframe for packaged electronic device with enhanced mold locking capability

METHOD OF PRODUCING SEMICONDUCTOR PACKAGES

Mounting structure of semiconductor device and electronic apparatus using thereof

Flat magnetic element and power IC package using the same

Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate

Enhanced thermal dissipation ball grid array package

Semiconductor device package

Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same

Integrated circuit package system with rigid locking lead

Mounting structure of semiconductor device and electronic apparatus using same

Stacked integrated circuit package system

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH NON-SYMMETRICAL SUPPORT STRUCTURES

Mountable integrated circuit package system with exposed external interconnects

Semiconductor device and method for manufacturing semiconductor device

Method and apparatus for a package having multiple stacked die

Lead frame and package of semiconductor device

Chip package having asymmetric molding

I/O connection scheme for QFN leadframe and package structures

Luminous body with LED dies and production thereof

IC PACKAGING PROCESS

METHOD OF STACKING DIES FOR DIE STACK PACKAGE

Method and jig structure for positioning bare dice

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Chip package structure

Integrated circuit package system with stacking module

Integrated circuit package system for stackable devices

Package-on-package system with via Z-interconnections

Semiconductor package having substrate ID code and its fabricating method

Semiconductor device packages and assemblies

Ball grid array package system

THERMALLY-ENHANCED MULTI-HOLE SEMICONDUCTOR PACKAGE

IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA

Integrated circuit packaging system with package-in-package and method of manufacture thereof

Integrated circuit package system with step mold recess

Semiconductor chip package

Semiconductor package having a bridged plate interconnection

Apparatus and method for series connection of two die or chips in single electronics package

Thin quad flat package with no leads (QFN) fabrication methods

Chip structure and stacked chip package as well as method for manufacturing chip structures

Semiconductor package and multi-chip package using the same

Semiconductor package structure with heat sink

Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate

System for solder ball inner stacking module connection

Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof

Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof

Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof

SEMICONDUCTOR CHIP PACKAGE HAVING GROUND AND POWER REGIONS AND MANUFACTURING METHODS THEREOF

Semiconductor package having a cavity structure

Method for producing a semiconductor device and the semiconductor device

Stress Mitigation in Packaged Microchips

Leadframe package with dual lead configurations

Semiconductor Device

Semiconductor die package including IC driver and bridge

Integrated circuit package system with integration port

Solid-state imaging device and method of fabricating solid-state imaging device

Housing body and method for production thereof

NON-PLANAR SUBSTRATE STRIP AND SEMICONDUCTOR PACKAGING METHOD UTILIZING THE SUBSTRATE STRIP

Semiconductor device

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Semiconductor module molded by resin with heat radiation plate opened outside from mold

Substrate and semiconductor package for lessening warpage

Solid-state image sensing apparatus and package of same

Semiconductor device and fabricating method thereof

Wafer level die integration and method therefor

Integrated circuit with step molded inner stacking module package in package system

Semiconductor package with mold lock vent

Semiconductor package with stacked semiconductor die each having IPD and method of reducing mutual inductive coupling by providing selectable vertical and lateral separation between IPD

Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface

Light emitting diode package structure and manufacturing method therefor

Lead frame isolation using laser technology

Method of a package on package packaging

Electrochemical cell and fabrication method of the same

Method for fabricating composite substances for thin film electro-optical devices

Miniature optical element for wireless bonding in an electronic instrument

Wafer-level integrated circuit package with top and bottom side electrical connections

SEMICONDUCTOR CHIP

Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Power device package and method of fabricating the same

Power device package and method of fabricating the same

Lead frame based semiconductor package and a method of manufacturing the same

Semiconductor device, electronic device, and manufacturing method of the same

Package having exposed integrated circuit device

Manufacturing method of resin-sealed semiconductor device

Board on chip package and method of manufacturing the same

Power module

Integrated circuit nanotube-based subsrate

Semiconductor device

Semiconductor devices having a resin with warpage compensated surfaces

Integrated circuit package substrate having configurable bond pads

Routing structure of re-distribution layer and method for re-distributing routing structure in integrated circuit

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Semiconductor device

Integrated circuit package system with external interconnects within a die platform