Package substrate structure and chip package structure and manufacturing process thereof

Adhesive tape and semiconductor package using the same

Monolithic semiconductor switches and method for manufacturing

Electronic device

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method of the same

3D integration of vertical components in reconstituted substrates

SEMICONDUCTOR PACKAGE WITH WEDGE BONDED CHIP

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT CHIP PACKAGE MODULE

Stackable layer containing ball grid array package

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Thin quad flat package with no leads (QFN) fabrication methods

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME

Electronic device

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

SEMICONDUCTOR-BASED SUBMOUNT WITH ELECTRICALLY CONDUCTIVE FEED-THROUGHS

Semiconductor package system with thermal die bonding

Semiconductor device with lead terminals having portions thereof extending obliquely

Semiconductor device, method for manufacturing the same, and multilayer substrate having the same

Light emitting device with improved light extraction efficiency

IC PACKAGE HAVING COLORED PATTERN

Methods for making microelectronic die systems

Power module

SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

Methods for forming packaged products

Integrated circuit package system and method of manufacture thereof

Marking method for semiconductor device and semiconductor device provided with markings

Semiconductor package structure with protection bar

Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries

Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same

Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors

CHIP ON LEAD WITH SMALL POWER PAD DESIGN

Semiconductor device with output circuit arrangement

SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS

Light emitting diode module and back light assembly

CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES

Power semiconductor module system

Low profile discrete electronic components and applications of same

Integrated electronic device with transceiving antenna and magnetic interconnection

Motor driving inverter circuit module, motor driving apparatus having the motor driving inverter circuit module, and inverter integrated circuit package

Ball land structure having barrier pattern

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF AND IC CHIP

Manufacturing method for semiconductor devices and semiconductor device

Micro-optical device packaging system

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

CHIP PACKAGE WITH STACKED INDUCTORS

THERMOELECTRIC DEVICE AND FABRICATION METHOD THEREOF, CHIP STACK STRUCTURE, AND CHIP PACKAGE STRUCTURE

Adhesive Tape, Semiconductor Package and Electronics

Bonding pad structure and manufacturing method thereof

Semiconductor device and method of forming recessed conductive vias in saw streets

Stacked semiconductor package, semiconductor package module and method of manufacturing the stacked semiconductor package

High-density multifunctional PoP-type multi-chip package structure

Integrated circuit packaging system with package stacking and method of manufacture thereof

Apparatus for shielding integrated circuit devices

Passive component incorporating interposer

Wiring board

LIGHT EMITTING MODULE, FABRICATION METHOD THEREFOR, AND LAMP UNIT

INTEGRATED CIRCUIT PACKAGES HAVING SHARED DIE-TO-DIE CONTACTS AND METHODS TO MANUFACTURE THE SAME

Package module for a memory IC chip

Intermediate structure of semiconductor device and method of manufacturing the same

Step cavity for enhanced drop test performance in ball grid array package

Semiconductor device and method for fabricating the same

Package on Package Assembly using Electrically Conductive Adhesive Material

Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof

Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures

Method of packaging integrated circuit devices using preformed carrier

Integrated circuit package system with input/output expansion

Semiconductor device and method for manufacturing the same

Integrated circuit packaging system having through silicon vias with partial depth metal fill regions and method of manufacture thereof

Thermally enhanced electronic package

Contact-force sensor package and method of fabricating the same

WINDOW BALL GRID ARRAY SUBSTRATE AND ITS PACKAGE STRUCTURE

Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant

Method of forming quad flat package

Method for manufacturing passive device and semiconductor package using thin metal piece

Preferentially cooled electronic device

High-frequency circuit board, high-frequency circuit module, and radar apparatus

Integrated circuit packaging system and method of manufacture thereof

Manufacturing method of chip package with coplanarity controlling feature

CHIP HAVING THERMAL VIAS AND SPREADERS OF CVD DIAMOND

Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof

SEMICONDUCTOR POWER MODULE PACKAGE HAVING EXTERNAL BONDING AREA

Semiconductor device

Semiconductor package with semiconductor core structure and method of forming same

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereof

Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof

Leadless integrated circuit packaging system and method of manufacture thereof

Quad flat package

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

Semiconductor package having an antenna with reduced area and method for fabricating the same

Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief

Etched leadframe structure

POP PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor device and method of forming an interposer package with through silicon vias

Semiconductor device and method for manufacturing semiconductor device

Semiconductor Package Leads Having Grooved Contact Areas

Power semiconductor device

Compliant integrated circuit package substrate

Package-on-package device, semiconductor package and method for manufacturing the same

Compact semiconductor package with integrated bypass capacitor and method

Top-side cooled semiconductor package with stacked interconnection plates and method

Semiconductor device and manufacturing method thereof

Integrated circuit packaging system with lead frame and method of manufacture thereof

Module and mounted structure using the same

Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die

Integrated sensor including sensing and processing die mounted on opposite sides of package substrate

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND FLIP CHIP AND METHOD OF MANUFACTURE THEREOF

Semiconductor package, method of manufacturing semiconductor package, electronic component, and method of manufacturing electronic component

Part mounting method

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

Dicing die-bonding film and process for producing semiconductor device

Integrated circuit package and fabricating method thereof

Electronic package structure and method

Light emitting diode package

Semiconductor device including a DC-DC converter having a metal plate

Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers

Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same

Semiconductor die

Semiconductor device and connection checking method for semiconductor device

Very extremely thin semiconductor package

Semiconductor device and method of forming WLCSP using wafer sections containing multiple die

Light emitting diode package and manufacturing method thereof

ELECTRONIC PACKAGE STRUCTURE AND METHOD

Electronic package structure having conductive strip and method

Base package system for integrated circuit package stacking and method of manufacture thereof

FLIP-CHIP CHIP-SCALE PACKAGE STRUCTURE

Integrated circuit package system with support carrier and method of manufacture thereof

Semiconductor package having adhesive layer and method of manufacturing the same

Package on package substrate

Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING BUMPED LEAD AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with plated pad and method of manufacture thereof

Integrated circuit packaging system with increased connectivity and method of manufacture thereof

Capacitor Die Design for Small Form Factors

Passivation layer for a circuit device and method of manufacture

Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method

Integrated circuit package substrate having configurable bond pads

Semiconductor device and manufacturing method therefor

Semiconductor package including multiple chips and separate groups of leads

Planar multi semiconductor chip package

Image forming apparatus, chip, and chip package

Integrated circuit package system with encapsulation lock and method of manufacture thereof

Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them

Plating method, semiconductor device fabrication method and circuit board fabrication method

APPARATUS AND METHOD FOR MANUFACTURING LED DEVICE

COMPONENT HAVING A CERAMIC BASE THE SURFACE OF WHICH IS METALIZED

Method for manufacturing an electronic device

Semiconductor device in which a semiconductor chip is sealed

Stacked integrated circuit packages that include monolithic conductive vias

High bandwidth package

Semiconductor memory device and semiconductor memory card

Wafer-level chip-on-chip package, package on package, and methods of manufacturing the same

Semiconductor device and manufacturing method thereof

Fluorescer solution, light-emitting device, and method for manufacturing same

Light emitting device and fabricating method thereof

Electronic component package and manufacturing method thereof

Method for manufacturing a semiconductor device having a heat spreader

MICROELECRONIC ASSEMBLY AND METHOD FOR FORMING THE SAME

LOW-TEMPERATURE-COFIRED-CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package having electrostatic protection circuit for semiconductor package including multiple semiconductor chips

High frequency module for filling level measurements in the W-band

SEMICONDUCTOR DEVICE

Semiconductor device and method of forming double-sided through vias in saw streets

Semiconductor electronic component and semiconductor device using the same

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF

Semiconductor package including a plurality of stacked semiconductor devices

Integrated circuit packages incorporating an inductor and methods

Mitigation of plating stub resonance by controlling surface roughness

PACKAGE MODULE STRUCTURE OF COMPOUND SEMICONDUCTOR DEVICES AND FABRICATING METHOD THEREOF

Cut-out heat slug for integrated circuit device packaging

Stacked type chip package structure

Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device

Semiconductor light emitting device and light emitting apparatus having thereof

Flexible circuit assemblies without solder and methods for their manufacture

Semiconductor package having insulated metal substrate and method of fabricating the same

Multi-chip package system incorporating an internal stacking module with support protrusions

Semiconductor die package including multiple dies and a common node structure

Stack package

Semiconductor device

Semiconductor package having solder ball which has double connection structure

ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING THE SAME

Component having a ceramic base with a metalized surface

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Package and fabricating method thereof

Semiconductor package

Multi-chip package

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

QUANTUM DOT-METAL OXIDE COMPLEX, METHOD OF PREPARING THE SAME, AND LIGHT-EMITTING DEVICE COMPRISING THE SAME

Twin-chip-mounting type diode

MEMORY MODULE

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SINGULATION PROCESS

Adhesive tape and semiconductor device using the same

Integrated circuit package system with mounting structure

Method for forming three-dimensional structure, method for manufacturing semiconductor device, and semiconductor device

Window BGA semiconductor package

Power semiconductor module assembly with heat dissipating element

SEMICONDUCTOR FLAT PACKAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

Low cost flexible substrate

Semiconductor device

Stacked die semiconductor device having circuit tape

Semiconductor package having ink-jet type dam and method of manufacturing the same

Semiconductor package system with through silicon via interposer

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

Packaging technology

Semiconductor structure with an electric field stop layer for improved edge termination capability

Wiring board with built-in electronic component and method for manufacturing the same

Method of forming semiconductor package

Wafer level packaged MEMS integrated circuit

Process for precision placement of integrated circuit overcoat material

Stacked integrated circuit package using a window substrate

Semiconductor device and manufacturing method of a semiconductor device

FINE-PITCH OBLONG SOLDER CONNECTIONS FOR STACKING MULTI-CHIP PACKAGES

Integrated circuit package system for stackable devices

Semiconductor package and method for manufacturing the same

Integrated circuit package system with anti-peel contact pads

Semiconductor package system with die support pad

Quad flat pack in quad flat pack integrated circuit package system

Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die

Lead frame assembly, lead frame and insulating housing combination, and led module having the same

Electronic device and method of manufacturing same

Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias

Light-emitting element capable of increasing amount of light emitted, light-emitting device including the same, and method of manufacturing light-emitting element and light-emitting device

Multi layer low cost cavity substrate fabrication for PoP packages

Mainboard assembly including a package overlying a die directly attached to the mainboard

Carrier structure of SoC with custom interface

Ball grid array package stacking system

Chip package structure including heat dissipation device and an insulation sheet

Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component

VERTICAL CURRENT TRANSPORT IN A POWER CONVERTER CIRCUIT

Electronic component storing package and electronic apparatus

Stacking integrated circuits containing serializer and deserializer blocks using through silicon via

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Multi-chip module and methods

Inverter power module with distributed support for direct substrate cooling

SEMICONDUCTOR DEVICE

STACKED TYPE CHIP PACKAGE STRUCTURE

MICROFEATURE WORKPIECE SUBSTRATES HAVING THROUGH-SUBSTRATE VIAS, AND ASSOCIATED METHODS OF FORMATION

Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby

CHIP SCALE PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof

Semiconductor package fabrication method

Semiconductor package and method therefor

Semiconductor device and method for fabricating semiconductor device

QFN package

Semiconductor device and method for manufacturing the same, and semiconductor sealing resin

Semiconductor device and method of forming the device using sacrificial carrier

Stackable multi-chip package system with support structure

STACKED-CHIP DEVICE

Vias and method of making

Stacked-chip device

Light-emitting element with improved light extraction efficiency, light-emitting device including the same, and methods of fabricating light-emitting element and light-emitting device

Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same

Thin foil semiconductor package

Integrated circuit package system

Circuit for detecting bonding defect in multi-bonding wire

Integrated circuit package system having cavity

Semiconductor device and method of manufacturing the same

Semiconductor device bonding with stress relief connection pads

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Stacked integrated circuit package-in-package system and method of manufacture thereof

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Lead frame, resin package, semiconductor device and resin package manufacturing method

Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier

Light emitting diode module

Sensor device including two sensors embedded in a mold material

Heat dissipating package structure and method for fabricating the same

Anisotropically compliant horns for ultrasonic vibratory solid-state bonding

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device

Integrated circuit packaging system having a cavity

MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE

Integrated circuit package with open substrate

Integrated circuit package system for package stacking and manufacturing method thereof

Semiconductor package and method for manufacturing the same

Integrated circuit package system

Leadless package with internally extended package leads

Semiconductor module with two cooling surfaces and method

Exposed interconnect for a package on package system

Thin inductor, method of producing the thin inductor, and ultra small size power conversion apparatus using the thin inductor

Method for forming a package-on-package structure

Semiconductor device with an improved solder joint

CHIP PACKAGE STRUCTURE

Stacked Memory Module

Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same

Semiconductor device packages with electromagnetic interference shielding

Destructor integrated circuit chip, interposer electronic device and methods

Semiconductor device and method for making the same

Light emitting diode package and method of manufacturing the same

Light emitting device, light emitting system having the same, and fabricating method of the light emitting device and the light emitting system

DICING DIE-BONDING FILM

Dicing die-bonding film

DICING DIE-BONDING FILM