212841 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical effects; Material effects; Metallurgical effects Formation of intermetallics
Sub-classes:BONDING WIRE FOR SEMICONDUCTOR DEVICES
#2BONDING WIRE FOR SEMICONDUCTOR DEVICES
#3PACKAGE STRUCTURE
#4SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
#5Semiconductor device
#6SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A LAYER STRUCTURE, AND METHOD OF FORMING A CHIP PACKAGE
#7Electromigration resistant and profile consistent contact arrays
#8DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
#9Semiconductor device
#10COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
#11Electromigration resistant and profile consistent contact arrays
#12EXPANDED HEAD PILLAR FOR BUMP BONDS
#13Mounting structure and nanoparticle mounting material
#14Electromigration resistant and profile consistent contact arrays
#15Designs and methods for conductive bumps
#16Method for 3D ink jet TCB interconnect control
#17Expanded head pillar for bump bonds
#18Semiconductor die bond pad with insulating separator
#19Semiconductor device
#20Method of embedding WLCSP components in E-WLB and E-PLB
#21Collars for under-bump metal structures and associated systems and methods
#22Barrier layer for interconnects in 3D integrated device
#23Method of manufacturing semiconductor device
#24Designs and methods for conductive bumps
#25Semiconductor structure with sacrificial anode and method for forming
#26Au-based solder die attachment semiconductor device and method for manufacturing the same
#27Method of embedding WLCSP components in e-WLB and e-PLB
#28Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure
#29Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers
#30Copper pillar sidewall protection
#31WIRE BONDING METHOD WITH TWO STEP FREE AIR BALL FORMATION
#32Stud bump and package structure thereof and method of manufacturing the same
#33Package on package devices and methods of packaging semiconductor dies
#34Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package
#35Bump electrode, board which has bump electrodes, and method for manufacturing the board
#36Semiconductor device and manufacturing method thereof
#37Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement
#38Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods
#39Package on package devices and methods of packaging semiconductor dies
#40Electric connecting structure comprising preferred oriented CuSngrains and method for fabricating the same
#41Semiconductor assemblies and structures
#42Method for inhibiting growth of intermetallic compounds
#43Method for manufacturing wafer-bonded semiconductor device
#44Semiconductor device
#453D IC packaging structures and methods with a metal pillar
#46Connector design for packaging integrated circuits
#47Contact Metal for Hybridization and Related Methods
#48Lead component and method for manufacturing the same, and semiconductor package
#49Solder ball for semiconductor packaging and electronic member using the same
#50SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
#51Thermally enhanced semiconductor package system
#52COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES
#53ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYS
#54Semiconductor device and method for manufacturing the same
#55Semiconductor device and semiconductor assembly with lead-free solder
#56Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures
#57Mechanisms for forming copper pillar bumps
#58PILLAR BUMP WITH BARRIER LAYER
#59Designs and methods for conductive bumps
#60Electronic system modules and method of fabrication
#61Semiconductor power module
#62Semiconductor structure
#63High temperature, stable SiC device interconnects and packages having low thermal resistance
#64Lead-Free Solder with Improved Properties at Temperatures >150°C
#65Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well
#66METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
#67ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
#68Designs and methods for conductive bumps
#69High temperature, stable SiC device interconnects and packages having low thermal resistance
#70Liquid metal thermal interface material system
#71Probe arrays and method for making
#72ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON
#73Semiconductor die package using leadframe and clip and method of manufacturing
#74Electronic system modules and method of fabrication
#75Semiconductor device with reduced contact resistance
#76ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESS AND OXIDATION OF METALS AND ALLOYS
#77Semiconductor power module including epoxy resin coating
#78Fabrication method for electronic system modules
#79Liquid metal thermal interface material system
#80Semiconductor die package using leadframe and clip and method of manufacturing
#81Contact structure on chip and package thereof
#82Semiconductor device
#83Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line
#84High temperature, stable SiC device interconnects and packages having low thermal resistance
#85Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip
#86Repairable three-dimensional semiconductor subsystem
#87Liquid metal thermal interface material system
#88Liquid metal thermal interface material system
#89Probe arrays and method for making
#90Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
#91Semiconductor device, method for mounting the same, and method for repairing the same
#92Designs and methods for conductive bumps
#93Under-bump metallization layers and electroplated solder bumping technology for flip-chip
#94Electromigration resistant and profile consistent contact arrays