208840 ⎘
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages; Heat extraction or cooling elements characterized by the materials
SIDE LIGHT-EMITTING DISPLAY DEVICE
#2BASE MEMBER FOR LIGHT EMITTING DEVICE
#3SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METHODS FOR MANUFACTURING SINTERED COMPACT SUBSTRATE AND LIGHT-EMITTING DEVICE
#4LIGHTING APPARATUS
#5LIGHT-EMITTING DEVICE, DISPLAY, AND PREPARATION METHOD FOR LIGHT-EMITTING DEVICE
#6LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED METHODS OF OPERATION
#7DISPLAY PANEL, DISPLAY PANEL SUBASSEMBLY AND DISPLAY APPARATUS
#8DISPLAY PANEL AND DISPLAY DEVICE
#9LED Light Source Device
#10LIGHT-EMITTING DEVICE AND IMAGE DISPLAY APPARATUS
#11HEAT CONDUCTION FILM AND HEAT-DISSIPATING STRUCTURE USING SAME
#12LIGHT EMITTING CHIP AND PRODUCING METHOD THEREOF, AND LIGHT EMITTING APPARATUS
#13ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE FOR IMPROVING AND OBTAINING LONG-TERM RELIABILITY
#14Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach
#15INSULATION SHEET FOR DISPLAY LIGHT SOURCE, AND INSULATION LIGHT SOURCE MODULE, INSULATION BACKLIGHT UNIT, AND DISPLAY DEVICE COMPRISING SAME
#16LUMIPHORIC MATERIAL STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES AND RELATED METHODS
#17Power tool, light unit, and floodlight
#18SEMICONDUCTOR PACKAGE AND DISPLAY DEVICE
#19Systems And Methods For Fluoride Ceramic Phosphors For LED Lighting
#20DISPLAY DEVICE
#21DISPLAY DEVICE
#22CARBON NANOTUBES DISPOSED ON METAL SUBSTRATES WITH ONE OR MORE CAVITIES
#23THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT
#24PHOTOTHERAPY LIGHT ENGINE
#25APPARATUS, SYSTEM, AND METHOD FOR ACHIEVING BRIGHTNESS UNIFORMITY ACROSS DISPLAY ELEMENTS
#26PHOSPHOR CERAMIC, LIGHT-EMITTING DEVICE AND MANUFACTURING METHODS THEREFOR
#27Wavelength conversion apparatus and method for manufacturing the same
#28Power tool, light unit, and floodlight
#29WHITE LIGHT LED CHIP PACKAGED IN INORGANIC MATERIAL, DEVICE, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF
#30OPTICAL MEMBER AND LIGHT-EMITTING DEVICE
#31DISPLAY DEVICE
#32COOLING SYSTEM FOR LED CURING APPARATUS
#33DISPLAY DEVICE
#34Light emitting diodes with enhanced thermal sinking and associated methods of operation
#35COMPOSITE AND PRODUCTION METHOD FOR COMPOSITE
#36Method of manufacturing light source device having a bonding layer with bumps and a bonding member
#37DISPLAY DEVICE
#38COMPOSITE BODY AND LAYERED BODY
#39HEAT DISSIPATION LAYER AND FLEXIBLE DISPLAY DEVICE INCLUDING THE SAME
#40Light emitting apparatus and production method thereof
#41Light emitting device
#42Light emitting device
#43DEEP-SCALING AND MODULAR INTERCONNECTION OF DEEP ULTRAVIOLET MICRO-SIZED EMITTERS
#44DISPLAY DEVICE
#45LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
#46Sheet disposed below panel, and display device including the same
#47Controlling off-state appearance of a light emitting device
#48DISPLAY MODULE, MANUFACTURE METHOD THEREOF AND DISPLAY APPARATUS
#49DISPLAY DEVICE
#50CHIP PACKAGE STRUCTURE AND APPLICATION THEREOF
#51Wavelength conversion member and light-emitting device for efficient wavelength conversion
#52DISPLAY APPARATUS
#53Display panel
#54OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT
#55Semiconductor Component and Method for Producing the Same
#56Managing thermal resistance and planarity of a display package
#57MICRO LED PANEL AND METHOD FOR MANUFACTURING THE SAME
#58SEMICONDUCTOR STRUCTURE AND SUBSTRATE THEREOF, AND MANUFACTURING METHODS FOR SEMICONDUCTOR STRUCTURES AND SUBSTRATES THEREOF
#59Display module and display apparatus having the same
#60Tiled display device
#61Element substrate, light-emitting element module, and light-emitting device
#62Optoelectronic device
#63Light emitting diodes with enhanced thermal sinking and associated methods of operation
#64OPTOELECTRONIC DEVICE
#65Semiconductor light-emitting device
#66Light emitting element and light emitting device
#67Wavelength conversion device and manufacturing method thereof
#68Display panel and display device with enhanced thermal conductivity
#69LIGHT-EMITTING DEVICE WITH ELECTRIC POWER GENERATION FUNCTION, LIGHTING DEVICE, AND DISPLAY DEVICE
#70PACKAGED OPTOELECTRIC MODULE AND METHOD FOR ITS PRODUCTION
#71Manufacturing process of light emitting device comprising quantum dot film and transparent adhesive layer
#72Display panel and method for manufacturing the same, display device
#73Light emitting device
#74Radiation-Emitting Component
#75Reflective and heat-insulating QLED package device and method for packaging the same as well as luminaire
#76Backlight module and manufacturing method of same
#77Light-emitting diode, method for manufacturing the same, backlight source and display device for improving heat dissipation
#78Light emitting device including flexible substrate
#79Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#80Header for semiconductor package and semiconductor package
#81Light emitting device package and light source module
#82Light emitting device
#83SEMICONDUCTOR DEVICE PACKAGE
#84Display device and fabricating method for display device
#85Method of producing heat dissipation substrate and method of producing composite substrate
#86Silicon heat-dissipation package for compact electronic devices
#87Thermally conductive sheet and method for producing the same
#88Phototherapy light engine
#89Optoelectronic component that dissipates heat
#90Managing thermal resistance and planarity of a display package
#91Thermally conductive molded resin article
#92Base member for light emitting device
#93High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same
#94Package
#95Upper substrate for miniature LED component, miniature LED component, and miniature LED display device
#96Stretchable display device having a plurality of connection lines
#97Graphite-laminated chip-on-film-type semiconductor package having improved heat dissipation and electromagnetic wave shielding functions
#98System for the electrically connecting at least one light source to an electrical power supply system
#99DISPLAY PANEL, DISPLAY DEVICE, INPUT/OUTPUT DEVICE, AND DATA PROCESSING DEVICE
#100Light-emitting apparatus
#101Light emitting device
#102Light-emitting device and method for manufacturing same
#103Adhesive layer with varied material properties
#104Light-emitting package
#105HEAT-RADIATING SUBSTRATE
#106Optoelectronic device and method of producing an optoelectronic device
#107Template for growing group III-nitride semiconductor layer, group III-nitride semiconductor light emitting device, and manufacturing method therefor
#108Graphite-laminated chip-on-film-type semiconductor package allowing improved visibility and workability
#109LED module having LED chips as light source
#110Copper/titanium/aluminum joint, insulating circuit substrate, insulating circuit substrate with heat sink, power module, LED module, and thermoelectric module
#111Light emitting apparatus and production method thereof
#112Circuit board
#113POLYMER COMPOSITIONS EXHIBITING REFLECTIVITY AND THERMAL CONDUCTIVITY
#114Optoelectronic semiconductor device and method for forming an optoelectronic semiconductor device
#115LED package
#116Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#117LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE
#118Paste composition, semiconductor device, and electrical/electronic component
#119Carrier, assembly comprising a substrate and a carrier, and method for producing a carrier
#120LED LIGHTING DEVICE, LED LAMP, AND LED DISPLAY SCREEN
#121Light emitting element and light emitting device
#122Flip-chip light-emitting module
#123Light-emitting device
#124Method of manufacturing light source device having a bonding layer with bumps and a bonding member
#125Method for manufacturing semiconductor element
#126Systems and methods for fluoride ceramic phosphors for LED lighting
#127LED PACKAGE
#128Light source cooling body, light source assembly, a luminaire and method to manufacture a light source cooling or a light source assembly
#129Mounting an LED element on a flat carrier
#130ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
#131LED package with integrated features for gas or liquid cooling
#132SURFACE LIGHT SOURCE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE USING THE SURFACE LIGHT SOURCE
#133ILLUMINATED TRANSFLECTIVE GEMSTONES, METHODS, AND APPARATUS THEREOF
#134Light-emitting package
#135OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD OF PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR CHIP
#136Light emitting device
#137System for the electrically connecting at least one light source to an electrical power supply system
#138Solid state light emitter die having a heat spreader between a plurality lead frame
#139LIGHT EMITTING DIODE ARRAY PACKAGE STRUCTURE WITH HIGH THERMAL CONDUCTIVITY
#140Light emitting device
#141THERMAL INTERFACE MATERIAL, METHOD FOR THERMALLY COUPLING WITH THERMAL INTERFACE MATERIAL, AND METHOD FOR PREPARING THERMAL INTERFACE MATERIAL
#142Method of manufacturing a hexagonal boron nitride based laminate on LED filament
#143Wavelength conversion module, method for forming wavelength conversion module, and projection device
#144Vertical topology light emitting device
#145Package, light emitting device, and method of manufacturing the package
#146Strain control in optoelectronic devices
#147FLIP-CHIP LIGHT-EMITTING MODULE
#148Light emitting device
#149Light-emitting ceramic and light-emitting device
#150FLEXIBLE LIGHTING DEVICE INCLUDING A NANO-PARTICLE HEAT SPREADING LAYER
#151Fabrication of phosphor film with heat dissipation film
#152Light emitting diodes with enhanced thermal sinking and associated methods of operation
#153Fluorescent glue for LED lighting bar and LED bulb lamp using the LED lighting bar
#154Light emitting device
#155Light emitting element and light emitting device
#156Vehicle luminaire and vehicle lamp
#157Light-emitting device
#158LED package
#159TEMPLATE FOR GROWING GROUP III-NITRIDE SEMICONDUCTOR LAYER, GROUP III-NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THEREFOR
#160Highly thermally conductive dielectric structure for heat spreading in component carrier
#161Negative electroluminescent cooling device
#162Silicon heat-dissipation package for compact electronic devices
#163Semiconductor light-emitting device having gap between thermally-conductive film and metal core and method for producing same
#164Boron nitride nanotube enhanced electrical components
#165Packaging method and package structure of QLED device
#166Vertical type light emitting diode die and method for fabricating the same
#167Vertical type light emitting diode die and method for fabricating the same
#168Component joining apparatus, component joining method and mounted structure
#169Method of fabricating light emitting device package
#170MANUFACTURING METHOD OF HIGH REFLECTION MIRROR WITH POLYCRYSTALLINE ALUMINUM NITRIDE
#171Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device
#172Optoelectronic device comprising pixels with improved contrast and brightness
#173Advanced solder alloys for electronic interconnects
#174LED package
#175Light emitting package having a guiding member guiding an optical member
#176Light-emitting device, infrared light source, and method for manufacturing light-emitting device
#177Multi-LED system
#178Thermally conductive resin sheet having light transmission and method for producing the same
#179PHOTOELECTRIC DEVICE AND SUBSTRATE THEREOF
#180Light emitting device and leadframe thereof
#181FLEXIBLE LIGHTING DEVICE INCLUDING A NANO-PARTICLE HEAT SPREADING LAYER
#182Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#183Quantum dot-based color-converted light emitting device and method for manufacturing the same
#184Light emitting device
#185Vertical topology light emitting device
#186Ultraviolet LED chip and manufacturing method thereof
#187Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#188Electronic component and method for producing an electronic component
#189Composite compositions and modification of inorganic particles for use in composite compositions
#190Light source device and display device
#191Light-emitting device, package including the same, and method of manufacturing the same
#192Heat transmissive optoelectronic component and module
#193Punching packaged light-emitting diode apparatus and manufacturing method thereof
#194Light-emitting device package
#195Wiring substrate and production method thereof
#196Printed circuit board with built-in vertical heat dissipation ceramic block, and electrical assembly comprising the board
#197Method of producing an optoelectronic component
#198Quantum dot glass cell and light-emitting device package including the same
#199Method of manufacturing a semiconductor device including through silicon plugs
#200Electronic assembly for lighting applications, lighting device and method for producing an electronic assembly
#201JOINT STRUCTURE AND MANUFACTURING METHOD THEREOF
#202LED illumination module having plural LED elements and secondary cooling element
#203LED module having LED chips as light source
#204Mount structure
#205UV LED package
#206Wavelength converters with improved thermal conductivity and lighting devices including the same
#207Quantum dot LED package structure
#208Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#209COMPOSITE CONDUCIVE TO HEAT DISSIPATION OF LED-MOUNTED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#210Heat-dissipating ceramic foam containing carbonized cellulose particles and method for producing the same
#211LIGHT-EMISSION MODULE HAVING COOLER AND PRODUCTION METHOD FOR LIGHT-EMISSION MODULE HAVING COOLER
#212LIGHT-EMITTING MODULE SUBSTRATE, LIGHT-EMITTING MODULE, SUBSTRATE FOR LIGHT-EMITTING MODULE HAVING COOLER, AND PRODUCTION METHOD FOR LIGHT-EMITTING MODULE SUBSTRATE
#213Apparatus for heat exchange by using braided fabric woven from thermally conductive wire material
#214Light-emitting device
#215Phosphor film
#216Bonding Structure for III-V Group Compound Device
#217Display device and imaging device
#218LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF LIGHT EMITTING DEVICE
#219Electronic device
#220LED device and LED lamp including the same
#221HEAT DISSIPATION CIRCUIT BOARD AND METHOD FOR PRODUCING HEAT DISSIPATION CIRCUIT BOARD
#222Light-emitting diode and manufacturing method therefor
#223Metal PCB, headlight module having metal PCB applied thereto, and method for assembling headlight module
#224Arrangement
#225Light source module, backlight unit and liquid crystal display device including the same
#226Light-emitting device
#227METHOD FOR PRODUCING AN ELECTRONIC COMPONENT WITH A CARRIER ELEMENT AND ELECTRONIC COMPONENT WITH A CARRIER ELEMENT
#228Light emitting diode assembly using thermal pyrolytic graphite for thermal management
#229Semiconductor element and method for manufacturing the same
#230Method of making LED light bulb with thermal radiation filaments
#231Ultraviolet ray emitting device having maximized electrode area for improved heat dissipation
#232Light emitting diode (LED) devices, components and methods
#233PHOTOTHERAPY LIGHT ENGINE
#234Peripheral heat sinking arrangement for high brightness light emitting devices
#235Metal coating method, light-emitting device, and manufacturing method for the same
#236Advanced Solder Alloys For Electronic Interconnects
#237Optoelectronic device with a mixture having a silicone and a fluoro-organic additive
#238HEAT DISSIPATING PLATE DEVICE FOR LIGHT EMITTING DIODE, HEAD LAMP FOR AUTOMOBILE AND METHOD FOR PREPARING THE SAME
#239OPTOELECTRONIC DEVICE ARRAY AND METHOD FOR PRODUCING A MULTIPLICITY OF OPTOELECTRONIC DEVICE ARRAYS
#240Heatsink including thick film layer for UV LED arrays, and methods of forming UV LED arrays
#241Vertical topology light emitting device
#242Light source device and display device
#243LED flip-chip package substrate and LED package structure
#244Light-emitting device and manufacturing method thereof
#245Light emitting device
#246MULTI-MATERIAL LED HEAT SINKS
#247Light emitting diode chip and display composed of light emitting diode chips
#248Light-emitter mounting package, light-emitting device, and light-emitting module
#249Method for manufacturing light emitting device
#250Methods and apparatus for illuminating gemstones
#251Headlamp module
#252Light emitting diode chip with protective layer of metal catalyst and fluorinated graphene and preparation method thereof
#253Terrestrial vehicle light-emitting module
#254LED flip chip die-bond conductive adhesive structure and mounting method thereof
#255Method and apparatus to facilitate direct surface cooling of a chip within a 3D stack of chips using optical interconnect
#256LED package with integrated features for gas or liquid cooling
#257FLEXIBLE LIGHTING DEVICE INCLUDING A NANO-PARTICLE HEAT SPREADING LAYER
#258Light-emitting apparatus
#259Flexible graphite sheet support structure and thermal management arrangement
#260Circuit board having a heat dissipating sheet with varying metal grain size
#261LED lamp heat sink
#262Light emitting diodes with enhanced thermal sinking and associated methods of operation
#263Light emitting device and method for manufacturing the same
#264Luminescent ceramic for a light emitting device
#265Method of making LED light bulb with graphene filament
#266SEMICONDUCTOR DEVICE
#267FLEXIBLE LIGHT EMITTING SEMICONDUCTOR DEVICE
#268Light-emitting device package
#269PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND OLED DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
#270Light emitting package having a guiding member guiding an optical member
#271Method of producing semiconductor chips that efficiently dissipate heat
#272LED lighting apparatus
#273Package for ultraviolet emitting devices
#274Organopolysiloxane composition, preparation method therefor, and semiconductor component
#275LIGHTING EMITTING DEVICE WITH ALIGNED-BONDING
#276Substrate with reflective coating including silicate or alkylsilicate network
#277Inorganic filler, resin composition comprising the same and heat radiation substrate using the same
#278Mechanically stable, thermally conductive and electrically insulating stack forming a mounting device for electronic components
#279Support structure for light radiation sources, corresponding device and method
#280LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE
#281THERMALLY CONDUCTIVE POLYMER ARTICLES FOR ELECTRONIC CIRCUITRY
#282Light source cooling body, light source assembly, a luminaire and method to manufacture a light source cooling or a light source assembly
#283LIGHT EMITTING DEVICE AND A METHOD OF MAKING THE SAME
#284LED light
#285Light emitting device
#286LED ILLUMINATION APPARATUS AND MANUFACTURING METHOD THEREOF
#287Automotive LED lamp heat sink
#288Optoelectronic device and method for manufacturing the same
#289Shell integrated light-emitting diode assembly, shell integrated light-emitting diode lamp, and manufacturing method thereof
#290Light emitting element mounting substrate and light emitting device
#291Narrow band red phosphor
#292Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
#293Wavelength conversion member and light emitting device using same
#294Light emitting device
#295Flip-chip light emitting device and fabrication method
#296Anisotropic conductive adhesive
#297Lighting device having sealing member covering inside of wall member surrounding light emitting elements
#298Ultraviolet device encapsulant
#299LED module having LED chips as light source
#300Thermally Conductive Circuit Board Substrate and Method of Manufacture